Patents by Inventor Tsung-Ching Lin

Tsung-Ching Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10895680
    Abstract: A display device includes a display module and an optical film. The display module has a through hole. At least one optical film is located on the display module and has an alignment through hole aligned with the through hole and an alignment mark surrounding the alignment through hole.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: January 19, 2021
    Assignee: E Ink Holdings Inc.
    Inventors: Chi-Ming Wu, Yi-Ching Wang, Tsung-Chin Lin, Ching-Huan Liao
  • Patent number: 10884325
    Abstract: A projection device includes: a light source module for generating an illumination beam; an optical engine module disposed on a transmission path of the illumination beam for forming an image beam; a projection lens disposed on a transmission path of the image beam for projecting the image beam to an outside of the projection device; and a housing having opposite bottom and top portions, and a side wall connected between and surrounding the portions and having an air inflow region adjacent to the bottom portion and an air exhaust region adjacent to the top portion. The light source module, the optical engine module and the projection lens are disposed in the housing adjacent to the top portion, wherein the image beam is projected to the outside toward the bottom portion. The projection device of the invention can effectively dissipate heat.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: January 5, 2021
    Assignee: Coretronic Corporation
    Inventors: Wei-Min Chien, Jhih-Hao Chen, Tsung-Ching Lin, Shi-Wen Lin
  • Patent number: 10872769
    Abstract: The present disclosure relates to a semiconductor device and a manufacturing method of fabricating a semiconductor structure. The method includes forming an opening in a substrate and depositing a conformal metal layer in the opening. The depositing includes performing one or more deposition cycles. The deposition includes flowing a first precursor into a deposition chamber and purging the deposition chamber to remove at least a portion of the first precursor. The method also includes flowing a second precursor into the deposition chamber to form a sublayer of the conformal metal layer and purging the deposition chamber to remove at least a portion of the second precursor. The method further includes performing a metallic halide etching (MHE) process that includes flowing a third precursor into the deposition chamber.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: December 22, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Po-Yu Lin, Chi-Yu Chou, Hsien-Ming Lee, Huai-Tei Yang, Chun-Chieh Wang, Yueh-Ching Pai, Chi-Jen Yang, Tsung-Ta Tang, Yi-Ting Wang
  • Publication number: 20200387058
    Abstract: A projection apparatus includes a casing, a projection lens, a first fan, a second fan, and a heat sink assembly. The casing has an air inlet and an air outlet. The projection lens is disposed in the casing, and between the air inlet and the air outlet. The first fan is disposed in the casing, and between the projection lens and the air inlet. The second fan is disposed in the casing, and between the projection lens and the air outlet. The heat sink assembly is disposed in the casing and between the projection lens and the air inlet. The first fan has a first rotational speed, the second fan has a second rotational speed. The second rotational speed is larger than the first rotational speed. The projection apparatus has the advantages of low development cost and effectively lowering the influence of the heat on the image quality.
    Type: Application
    Filed: June 9, 2020
    Publication date: December 10, 2020
    Inventors: WEN-JUI HUANG, TSUNG-CHING LIN
  • Publication number: 20200386490
    Abstract: A heat dissipation module is configured to dissipate heat generated by at least one heating element of a projection device. The heat dissipation module includes at least one first heat pipe, at least one second heat pipe and a heat dissipation fin assembly. The first heat pipe includes a first section connected to the heating element and a second section. The second heat pipe includes a third section connected to the heating element and a fourth section. The length of the first heat pipe is less than that of the second heat pipe. The heat dissipation fin assembly includes a plurality of heat dissipation fins. The second section and the fourth section pass through the heat dissipation fin assembly, and the number of heat dissipation fins through which the second section passes is 70% or below of the number of heat dissipation fins through which the fourth section passes.
    Type: Application
    Filed: May 31, 2020
    Publication date: December 10, 2020
    Applicant: Coretronic Corporation
    Inventors: Wen-Jui Huang, Jhih-Hao Chen, Tsung-Ching Lin
  • Patent number: 10855280
    Abstract: A circuit receives an input signal that switches between reference and first voltage levels, a power node carries a second voltage level, and a set of transistors is coupled between the power node and an output node. The second voltage level is a multiple of the first voltage level, and the multiple and a number of the transistors have a same value greater than two. A control signal circuit includes a level shifting circuit including a series of capacitive devices paired with latch circuits, a number of the pairs being one less than the value of the multiple, and, responsive to the input signal, outputs a control signal to a gate of a transistor of the first set of transistors closest to the power node, the control signal switching between the second voltage level and a third voltage level equal to the second voltage level minus the first voltage level.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: December 1, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chan-Hong Chern, Tsung-Ching Huang, Chih-Chang Lin, Ming-Chieh Huang, Fu-Lung Hsueh
  • Publication number: 20200365557
    Abstract: A semiconductor package includes a first integrated circuit structure, a second integrated circuit structure, a plurality of conductive bumps, an encapsulating material, and a redistribution structure. The first integrated circuit structure includes an active surface having a plurality of contact pads, a back surface opposite to the active surface, and a plurality of through vias extending through the first integrated circuit structure and connecting the active surface and the back surface. The second integrated circuit structure is disposed on the back surface of the first integrated circuit structure. The conductive bumps are disposed between the first integrated circuit structure and the second integrated circuit structure, and electrically connecting the plurality of through vias and the second integrated circuit structure. The encapsulating material at least encapsulates the second integrated circuit structure.
    Type: Application
    Filed: May 16, 2019
    Publication date: November 19, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Fu Tsai, Shih-Ting Lin, Szu-Wei Lu, Ying-Ching Shih
  • Patent number: 10827153
    Abstract: A projection device includes a light source module, an optical engine module, a projection lens, a housing, and at least one first heat dissipating element. The housing comprises a first end and a second end opposite to each other. The at least one first heat dissipating element is disposed in the housing, and each of the at least one first heat dissipating element includes a first plate portion, a second plate portion, and a first fin portion. The first plate portion is connected to the light source module. The second plate portion is connected to the first plate portion. The first fin portion is connected to the second plate portion and includes a plurality of first fins arranged at intervals. These first fins are arranged between the first end and the second end.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: November 3, 2020
    Assignee: Coretronic Corporation
    Inventors: Jhih-Hao Chen, Wei-Min Chien, Tsung-Ching Lin, Shi-Wen Lin
  • Patent number: 10827647
    Abstract: The invention provides a liquid-cooling device, including a shell, wherein the shell includes a top plate, a bottom plate, a front plate, a rear plate and two opposite side plates, and form an accommodating space. At least one water inlet pipe is disposed on the top plate of the shell and communicates with the accommodating space. At least one water outlet pipe is disposed on the front plate of the shell and communicates with the accommodating space. A plurality of heat-dissipating fins is disposed in the accommodating space. A partition plate is disposed in the accommodating space. The partition plate forms at least two flow passages in the accommodating space.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: November 3, 2020
    Assignee: Coretronic Corporation
    Inventors: Shi-Wen Lin, Tsung-Ching Lin, Wei-Chi Liu
  • Publication number: 20200310234
    Abstract: A heat dissipation module includes a housing, at least one inlet, at least one outlet and at least one heat dissipation set. The housing includes a partition dividing the housing, such that a first accommodation space and a second accommodation space are formed inside the housing. At least one opening is disposed in the partition, penetrates through the partition and communicates the first accommodation space with the second accommodation space. The inlet is connected to the housing and communicates with the first accommodation space. The outlet is connected to the housing and communicates with the second accommodation space. The heat dissipation set is located in the second accommodation space. A projection apparatus is also provided. The heat dissipation module and the projection apparatus may effectively exhaust the heat accumulated on the at least one heat dissipation set, which facilitates reducing a temperature of a heat source with high heat-density.
    Type: Application
    Filed: March 27, 2020
    Publication date: October 1, 2020
    Applicant: Coretronic Corporation
    Inventors: Wei-Chi Liu, Tsung-Ching Lin, Shi-Wen Lin
  • Publication number: 20200287528
    Abstract: A circuit includes a first power node configured to carry a first voltage having a first voltage level, a second power node configured to carry a second voltage having a second voltage level, an output node, and first and second cascode transistors coupled between the first power node and the output node and to each other at a node. A bias circuit uses the first and second cascode transistors to generate an output signal at the output node that transitions between the first voltage level and a third voltage level, and a delay circuit generates a transition in a first signal from one of the first or second voltage levels to the other of the first or second voltage levels, the transition having a time delay based on the output signal. A contending transistor couples the node to the second power node responsive to the first signal.
    Type: Application
    Filed: May 26, 2020
    Publication date: September 10, 2020
    Inventors: Chan-Hong CHERN, Tsung -Ching HUANG, Chih-Chang LIN, Ming-Chieh HUANG, Fu-Lung HSUEH
  • Publication number: 20200272037
    Abstract: A light source heat-dissipating device is disposed in a projection apparatus having a casing with an air inlet. The light source heat-dissipating device has a heat-dissipating fin assembly disposed in the casing and having an air intake side, and first and second heat-dissipating fin assemblies, a first air duct, and a fan adjacent to the first and second heat-dissipating fin assemblies. The second heat-dissipating fin assembly is stacked on the first one. The first heat-dissipating fin assembly is between the second one and the air inlet. The first air duct is adjacently-disposed at the air intake side, has a first entrance end connected with the air inlet and a first exit end opposite to the first entrance. The light source heat-dissipating device and projection apparatus improve temperature and life consistency between light source modules. The heat dissipation performances of the first and second heat-dissipating fin assemblies tend to be consistent.
    Type: Application
    Filed: February 21, 2020
    Publication date: August 27, 2020
    Inventors: CHUN-LUNG YEN, TE-TANG CHEN, WEN-JUI HUANG, TSUNG-CHING LIN
  • Publication number: 20200274535
    Abstract: A circuit receives an input signal that switches between reference and first voltage levels, a power node carries a second voltage level, and a set of transistors is coupled between the power node and an output node. The second voltage level is a multiple of the first voltage level, and the multiple and a number of the transistors have a same value greater than two. A control signal circuit includes a level shifting circuit including a series of capacitive devices paired with latch circuits, a number of the pairs being one less than the value of the multiple, and, responsive to the input signal, outputs a control signal to a gate of a transistor of the first set of transistors closest to the power node, the control signal switching between the second voltage level and a third voltage level equal to the second voltage level minus the first voltage level.
    Type: Application
    Filed: May 14, 2020
    Publication date: August 27, 2020
    Inventors: Chan-Hong CHERN, Tsung-Ching HUANG, Chih-Chang LIN, Ming-Chieh HUANG, Fu-Lung HSUEH
  • Publication number: 20200201151
    Abstract: A projector comprises a casing, a projection lens module and a light emitting module. The casing comprises a first air inlet and an air outlet. The projection lens module is disposed in the casing and adjacent to the first air inlet. The light emitting module is disposed in the casing and adjacent to the air outlet. The casing comprises a rear cover. The rear cover comprises a second air inlet, the second air inlet corresponds to the light emitting module. A first airflow flows into the casing from the first air inlet to dissipate heat from the projection lens module and the light emitting module, and then flows out of the air outlet. A second airflow flows into the casing from the second air inlet to dissipate heat from the light emitting module, and then flows out of the air outlet.
    Type: Application
    Filed: December 20, 2019
    Publication date: June 25, 2020
    Applicant: Coretronic Corporation
    Inventors: Chih-Sheng Wu, Te-Tang Chen, Tsung-Ching Lin
  • Patent number: 10686434
    Abstract: A circuit includes a first power node configured to carry a first voltage having a first voltage level, an output node, a node coupled between the first power node and the output node, and a contending transistor coupled between the node and a second power node configured to carry a second voltage having a second voltage level. The circuit generates a signal at the output node that ranges between the first voltage level and a third voltage level, the contending transistor couples the node with the second power node responsive to the signal, a difference between the first voltage level and the second voltage level has a first magnitude, a difference between the first voltage level and the third voltage level has a second magnitude, and the second magnitude is a multiple of the first magnitude having a value greater than one.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: June 16, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chan-Hong Chern, Tsung-Ching Huang, Chih-Chang Lin, Ming-Chieh Huang, Fu-Lung Hsueh
  • Publication number: 20200183263
    Abstract: A projection device includes: a light source module for generating an illumination beam; an optical engine module disposed on a transmission path of the illumination beam for forming an image beam; a projection lens disposed on a transmission path of the image beam for projecting the image beam to an outside of the projection device; and a housing having opposite bottom and top portions, and a side wall connected between and surrounding the portions and having an air inflow region adjacent to the bottom portion and an air exhaust region adjacent to the top portion. The light source module, the optical engine module and the projection lens are disposed in the housing adjacent to the top portion, wherein the image beam is projected to the outside toward the bottom portion. The projection device of the invention can effectively dissipate heat.
    Type: Application
    Filed: December 5, 2019
    Publication date: June 11, 2020
    Inventors: WEI-MIN CHIEN, JHIH-HAO CHEN, TSUNG-CHING LIN, SHI-WEN LIN
  • Publication number: 20200186763
    Abstract: A projection device includes a light source module, an optical engine module, a projection lens, a housing, and at least one first heat dissipating element. The housing comprises a first end and a second end opposite to each other. The at least one first heat dissipating element is disposed in the housing, and each of the at least one first heat dissipating element includes a first plate portion, a second plate portion, and a first fin portion. The first plate portion is connected to the light source module. The second plate portion is connected to the first plate portion. The first fin portion is connected to the second plate portion and includes a plurality of first fins arranged at intervals. These first fins are arranged between the first end and the second end.
    Type: Application
    Filed: December 5, 2019
    Publication date: June 11, 2020
    Inventors: JHIH-HAO CHEN, WEI-MIN CHIEN, TSUNG-CHING LIN, SHI-WEN LIN
  • Patent number: 10673437
    Abstract: A level-shifting circuit includes an input device configured to receive an input signal capable of switching between a reference voltage level and a first voltage level, and a set of capacitive devices paired in series with latch circuits. A first capacitive device of the set is coupled with an output of the input device, and each capacitive device and latch circuit pair is configured to upshift a corresponding received signal by an amount equal to a difference between the first voltage level and the reference voltage level.
    Type: Grant
    Filed: January 7, 2019
    Date of Patent: June 2, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chan-Hong Chern, Tsung-Ching Huang, Chih-Chang Lin, Ming-Chieh Huang, Fu-Lung Hsueh
  • Patent number: 10650786
    Abstract: An automatically brightness adjusting electronic device and a brightness adjusting method are provided. The method comprises: sensing an environmental light intensity; generating a brightness adjustment signal according to the environmental light intensity via a second control unit; and adjusting a display brightness of a display unit according to the brightness adjustment signal via a first control unit or the second control unit.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: May 12, 2020
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Chin-Hung Lin, Wei-Chung Hung, Huai-Hao Syu, Tzu-Ping Lin, Chia-Po Chou, Tsung-Lin Wu, Han-Wei Tang, Yi-Ching Chen, Chih-Lung Lin, Ping-Fu Hsieh
  • Publication number: 20200135471
    Abstract: The present disclosure relates to a semiconductor device and a manufacturing method of fabricating a semiconductor structure. The method includes forming an opening in a substrate and depositing a conformal metal layer in the opening. The depositing includes performing one or more deposition cycles. The deposition includes flowing a first precursor into a deposition chamber and purging the deposition chamber to remove at least a portion of the first precursor. The method also includes flowing a second precursor into the deposition chamber to form a sublayer of the conformal metal layer and purging the deposition chamber to remove at least a portion of the second precursor. The method further includes performing a metallic halide etching (MHE) process that includes flowing a third precursor into the deposition chamber.
    Type: Application
    Filed: December 30, 2019
    Publication date: April 30, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Po-Yu LIN, Chi-Yu CHOU, Hsien-Ming LEE, Huai-Tei YANG, Chun-Chieh WANG, Yueh-Ching PAI, Chi-Jen YANG, Tsung-Ta TANG, Yi-Ting WANG