Patents by Inventor TSUNG-CHUN TSENG

TSUNG-CHUN TSENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11935871
    Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang, Ming-Hung Tseng, Kris Lipu Chuang, Chung-Ming Weng, Tsung-Yuan Yu, Tzuan-Horng Liu
  • Patent number: 11929318
    Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
  • Patent number: 11798292
    Abstract: A driving assistant method applied to a first moving vehicle is provided. The method includes capturing an image of a license plate of a second moving vehicle when the first moving vehicle is moving, and identifying a first area of the license plate in the captured image. Basic information of the second moving vehicle are obtained according to a size of the first area. Once a safe distance is determined according to driving information of the first moving vehicle and the basic information of the second moving vehicle, a warning message is transmitted when the distance between the first moving vehicle and the second moving vehicle is less than the safe distance.
    Type: Grant
    Filed: October 9, 2020
    Date of Patent: October 24, 2023
    Assignee: Chiun Mai Communication Systems, Inc.
    Inventors: Chih-Pu Hsu, Jian-Cheng Lin, Pei-Lin Chen, Tsung-Chun Tseng, Chien-Chun Chang
  • Patent number: 11554789
    Abstract: A method for providing assistance in driving includes capturing an image of a second moving vehicle when a first moving vehicle is moving and obtaining basic information of the second moving vehicle according to the image thereof, the basic information of the second moving vehicle comprising weight information of the second moving vehicle. Driving information of the first moving vehicle is obtained, and a safe distance between the first moving vehicle and the second moving vehicle is determined according to the driving information of the first moving vehicle and the basic information of the second moving vehicle. The current distance between the first moving vehicle and the second moving vehicle is detected, and a warning is output if the distance between the first moving vehicle and the second moving vehicle is less than the safe distance.
    Type: Grant
    Filed: October 11, 2020
    Date of Patent: January 17, 2023
    Assignee: Chiun Mai Communication Systems, Inc.
    Inventors: Chih-Pu Hsu, Jian-Cheng Lin, Pei-Lin Chen, Tsung-Chun Tseng, Chien-Chun Chang
  • Publication number: 20210107508
    Abstract: A method for providing assistance in driving includes capturing an image of a second moving vehicle when a first moving vehicle is moving and obtaining basic information of the second moving vehicle according to the image thereof, the basic information of the second moving vehicle comprising weight information of the second moving vehicle. Driving information of the first moving vehicle is obtained, and a safe distance between the first moving vehicle and the second moving vehicle is determined according to the driving information of the first moving vehicle and the basic information of the second moving vehicle. The current distance between the first moving vehicle and the second moving vehicle is detected, and a warning is output if the distance between the first moving vehicle and the second moving vehicle is less than the safe distance.
    Type: Application
    Filed: October 11, 2020
    Publication date: April 15, 2021
    Inventors: CHIH-PU HSU, JIAN-CHENG LIN, PEI-LIN CHEN, TSUNG-CHUN TSENG, CHIEN-CHUN CHANG
  • Publication number: 20210110181
    Abstract: A driving assistant method applied to a first moving vehicle is provided. The method includes capturing an image of a license plate of a second moving vehicle when the first moving vehicle is moving, and identifying a first area of the license plate in the captured image. Basic information of the second moving vehicle are obtained according to a size of the first area. Once a safe distance is determined according to driving information of the first moving vehicle and the basic information of the second moving vehicle, a warning message is transmitted when the distance between the first moving vehicle and the second moving vehicle is less than the safe distance.
    Type: Application
    Filed: October 9, 2020
    Publication date: April 15, 2021
    Inventors: CHIH-PU HSU, JIAN-CHENG LIN, PEI-LIN CHEN, TSUNG-CHUN TSENG, CHIEN-CHUN CHANG