Abstract: A power adjustable, isolated and tranformerless AC to DC power circuit is revealed. The AC to DC power circuit includes a first reactance component, a second reactance component, a third reactance component and an AC power connected to form a loop. The third reactance component is connected to an input end of a full bridge rectifier and a filter capacitor is connected across to an output end of the full bridge rectifier for output of a stable low voltage DC. Thereby AC power is isolated to avoid electric conductance or shock. Moreover, the manufacturing cost is dramatically reduced, the power is saved, and no heat is generated. Furthermore, the reactance of the whole circuit is reduced so as to get high power factor. The AC to DC power circuit has no high frequency radiation, no radiation damage and no interference to sensitive electronic equipment.

Abstract: A planar light circuit may be mounted in the housing a one-point mounting. The one-point mounting may reduce the tendency of thermal deformations in the housing to be transmitted to the planar light circuit.

Abstract: A light emitting diode device with higher heat dissipation and controllable light pattern is revealed. The light emitting diode device includes a light fixture reflector and a plurality of light emitting diodes fixed on surface of the light fixture reflector. By heat conduction, heat convection, and heat radiation of electrons of the light fixture reflector, heat is dissipated. Light pattern is controlled by adjustment of reflection angle of the light fixture reflector. Thus the manufacturing cost is reduced and the light emitting diode device is having more practical value.

Abstract: A non-flashing brightness adjusting device for a non-resistive light-emitting load has a brightness adjuster and a conductive current sustainer. The brightness adjuster has an AC silicon-controlled rectifier (SCR) and an adjustable trigger unit. By adjusting the adjustable trigger unit and setting a trigger angle of the TRIAC, a total output current of the brightness adjuster is adjusted. The conductive current sustainer is connected to the output terminal of the brightness adjuster for a non-resistive light-emitting load to connect. When the trigger angle of the TRIAC is greater than 90 degrees, the conductive current sustainer keeps the current flowing through the anode and cathode of the TRIAC not lower than its threshold current to maintain the conduction of the TRIAC. Therefore, the non-resistive light-emitting load keeps receiving the required working power and does not flash.

Abstract: An AC-to-DC power supply circuit has an AC capacitor, a half-wave rectifier, and a filter capacitor. Through the AC capacitor, the half-wave rectifier forms a power supply circuit with an AC power supply for converting AC power to half-wave DC power. The filer circuit further converts the half-wave DC power into low-voltage DC power. The AC-to-DC power supply circuit adjusts the ratio of the AC capacitor and the filter capacitor so that the capacitance ratio matches with the voltage ratio of the half-wave DC power and the lower-voltage DC power. As a consequence, the AC-to-DC power supply circuit does not need to use a large-size transformer and can still effectively convert AC power to low-voltage DC power. This can largely reduce the manufacturing cost.

Abstract: A variable optical attenuator multiplexer having at least one thermal isolating optical joint. The variable optical attenuator multiplexer including a plurality of planar lightwave circuit components, such as, for example a combination of an array waveguide grating, a variable optical attenuator, and/or a power monitor. The planar lightwave circuit components are joined with an optical adhesive. The components may be thermally isolated by the formation of a widened space or gap between the component joints, and/or by creating a trench in the optical adhesive.

Abstract: A thermo-optical device may use a heater to tune an optical device such as an optical switch, a Mach-Zehnder interferometer, or a variable optical attenuator, to mention a few examples. In some embodiments, polarization-dependent losses caused by the heating and power efficiency may be improved by defining a clad core including an optical core and cladding material on a substrate and covering the clad core on three sides with a heater.

Abstract: A mounting platform provides support and packaging for one or more fiber Bragg gratings and electronic circuitry (e.g., heaters, coolers, piezoelectric strain providers, temperature and strain sensors, feedback circuitry, control loops), which may be printed on or on the mounting platform, embedded in the mounting platform, or may be an “off-board” chip solution (e.g., the electronic circuitry may be attached to the mounting platform, but not formed on or defined on the mounting platform). The fiber Bragg gratings are held in close proximity to the electronic circuitry, which applies local and global temperature and/or strain variations to the fiber Bragg gratings to, for example, stabilize and/or tune spectral properties of the fiber Bragg gratings so that spatial variations in the fiber Bragg gratings that result from processing and manufacturing fluctuations and tolerances can be compensated for.

Abstract: A variable optical attenuator multiplexer having at least one thermal isolating optical joint. The variable optical attenuator multiplexer including a plurality of planar lightwave circuit components, such as, for example a combination of an array waveguide grating, a variable optical attenuator, and/or a power monitor. The planar lightwave circuit components are joined with an optical adhesive. The components may be thermally isolated by the formation of a widened space or gap between the component joints, and/or by creating a trench in the optical adhesive.

Abstract: An optical network may include a detector for detecting the power of each of a plurality of channels of a wavelength division multiplexed optical signal in one embodiment of the present invention. Each channel may be conveyed to an interface underneath a detector by way of a core formed in the substrate. The interface may include a trench with one side surface angled to form a reflector to reflect light upwardly to be detected by the detector. Other surfaces of said trench may also be reflective to reduce the cross talk between adjacent channels.

Abstract: A mounting platform provides support and packaging for one or more fiber Bragg gratings and electronic circuitry (e.g., heaters, coolers, piezoelectric strain providers, temperature and strain sensors, feedback circuitry, control loops), which may be printed on or on the mounting platform, embedded in the mounting platform, or may be an “off-board” chip solution (e.g., the electronic circuitry may be attached to the mounting platform, but not formed on or defined on the mounting platform). The fiber Bragg gratings are held in close proximity to the electronic circuitry, which applies local and global temperature and/or strain variations to the fiber Bragg gratings to, for example, stabilize and/or tune spectral properties of the fiber Bragg gratings so that spatial variations in the fiber Bragg gratings that result from processing and manufacturing fluctuations and tolerances can be compensated for.

Abstract: A thermo-optical device may use a heater to tune an optical device such as an optical switch, a Mach-Zehnder interferometer, or a variable optical attenuator, to mention a few examples. In some embodiments, polarization-dependent losses caused by the heating and power efficiency may be improved by defining a clad core including an optical core and cladding material on a substrate and covering the clad core on three sides with a heater.

Abstract: A thermo-optical device may use a heater to tune an optical device such as an optical switch, a Mach-Zehnder interferometer, or a variable optical attenuator, to mention a few examples. In some embodiments, polarization-dependent losses caused by the heating and power efficiency may be improved by defining a clad core including an optical core and cladding material on a substrate and covering the clad core on three sides with a heater.

Abstract: A mounting platform provides support and packaging for one or more fiber Bragg gratings and electronic circuitry (e.g., heaters, coolers, piezoelectric strain providers, temperature and strain sensors, feedback circuitry, control loops), which may be printed on or on the mounting platform, embedded in the mounting platform, or may be an “off-board” chip solution (e.g., the electronic circuitry may be attached to the mounting platform, but not formed on or defined on the mounting platform). The fiber Bragg gratings are held in close proximity to the electronic circuitry, which applies local and global temperature and/or strain variations to the fiber Bragg gratings to, for example, stabilize and/or tune spectral properties of the fiber Bragg gratings so that spatial variations in the fiber Bragg gratings that result from processing and manufacturing fluctuations and tolerances can be compensated for.

Abstract: The coupling properties of an optical device having at least two inputs and two outputs may be more accurately measured by simultaneously measuring the optical transmission through all outputs for light coupled to each input to the device. An optical switch may be used to selectively couple the light to each of the device inputs. This removes the need to remove the light source from one input and to reconnect it to another input. By proper processing of the measured optical transmission corresponding to each input, an accurate and precise value for the transfer function, including polarization properties, of the device may be obtained independent of the insertion losses in the system.

Abstract: A planar light circuit may be mounted in the housing using a one-point mounting. The one-point mounting may reduce the tendency of thermal deformations in the housing to be transmitted to the planar light circuit.

Abstract: A method, apparatus, and system for monitoring optical signals in a planar lightwave circuit (“PLC”) by tapping light out of an optical transmission medium (e.g., a waveguide or optical fiber), into which a grating has been written, within a plane of the optical transmission medium and onto a photosensitive device are disclosed herein. In one embodiment, a tilted grating, with an angle greater than about 6 degrees from normal to a central axis of the optical transmission medium may be written into a waveguide in the PLC at a location at which an attribute (e.g., a wavelength or power) of an optical signal is to be measured. A portion of an optical signal may then be reflected out of a plane of the optical transmission medium, and be detected by a photodetector positioned in the plane of the optical transmission medium.

Abstract: An optical network may include a detector for detecting the power of each of a plurality of channels of a wavelength division multiplexed optical signal in one embodiment of the present invention. Each channel may be conveyed to an interface underneath a detector by way of a core formed in the substrate. The interface may include a trench with one side surface angled to form a reflector to reflect light upwardly to be detected by the detector. Other surfaces of said trench may also be reflective to reduce the cross talk between adjacent channels.

Abstract: A thermo-optical device may use a heater to tune an optical device such as an optical switch, a Mach-Zehnder interferometer, or a variable optical attenuator, to mention a few examples. In some embodiments, polarization-dependent losses caused by the heating and power efficiency may be improved by defining a clad core including an optical core and cladding material on a substrate and covering the clad core on three sides with a heater.

Abstract: A mounting platform provides support and packaging for one or more fiber Bragg gratings and electronic circuitry (e.g., heaters, coolers, piezoelectric strain providers, temperature and strain sensors, feedback circuitry, control loops), which may be printed on or on the mounting platform, embedded in the mounting platform, or may be an “off-board” chip solution (e.g., the electronic circuitry may be attached to the mounting platform, but not formed on or defined on the mounting platform). The fiber Bragg gratings are held in close proximity to the electronic circuitry, which applies local and global temperature and/or strain variations to the fiber Bragg gratings to, for example, stabilize and/or tune spectral properties of the fiber Bragg gratings so that spatial variations in the fiber Bragg gratings that result from processing and manufacturing fluctuations and tolerances can be compensated for.