Patents by Inventor Tsung-Fu Yang

Tsung-Fu Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230023186
    Abstract: A semiconductor device includes a substrate, a 2-D material layer, source/drain contacts, and a gate electrode. The 2-D material layer is over the substrate, the 2-D material layer includes source/drain regions and a channel region between the source/drain regions, in which the 2-D material layer is made of a transition metal dichalcogenide (TMD). The source/drain contacts are in contact with source/drain regions of the 2-D material layer, in which a binding energy of transition metal atoms at the channel region of the 2-D material layer is different from a binding energy of the transition metal atoms at the source/drain regions of the 2-D material layer. The gate electrode is over the substrate.
    Type: Application
    Filed: January 13, 2022
    Publication date: January 26, 2023
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., National Yang Ming Chiao Tung University
    Inventors: Chiung-Yuan LIN, Tsung-Fu YANG, Weicheng CHU, Ching Liang CHANG, Chen Han CHOU, Chia-Ho YANG, Tsung-Kai LIN, Tsung-Han LIN, Chih-Hung CHUNG, Chenming HU
  • Publication number: 20190059971
    Abstract: A tumor ablation system includes a heating needle and a power supply device. The heating needle includes a rigid tubular shell. The heating needle further includes a heating element and a non-heating element; the heating element has at least one heating wire, a central cylindrical object and a distal part of the shell. The heating wire and the central cylindrical object are inside the shell. The heating wire is electrically coupled to the non-heating element, and coiled on the central cylindrical object. The distal part of the shell covers the coil formed by the heating wire on the central cylindrical object. When the heating wire is charged with electricity the heating wire generates thermal energy that is conducted to the distal part of the shell. The power supply device couples to the non-heating element, and provides electricity to the heating needle.
    Type: Application
    Filed: May 10, 2017
    Publication date: February 28, 2019
    Inventors: SHENG-CHIEH HUANG, HSIANG-SHENG WEN, TSUNG-FU YANG, CHUNG-CHUN LIAO
  • Patent number: 8618672
    Abstract: This disclosure related to a stacked chip package structure having a sloped dam structure located on the substrate and beside the chip stack. The dam structure can facilitate the dispensing process of the underfill.
    Type: Grant
    Filed: June 6, 2011
    Date of Patent: December 31, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Wei Huang, Tsung-Fu Yang
  • Publication number: 20120168967
    Abstract: This disclosure related to a stacked chip package structure having a sloped dam structure located on the substrate and beside the chip stack. The dam structure can facilitate the dispensing process of the underfill.
    Type: Application
    Filed: June 6, 2011
    Publication date: July 5, 2012
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Wei Huang, Tsung-Fu Yang
  • Patent number: 8134230
    Abstract: A sealed joint structure of device includes a buffer bump layer, conductive joint portions and a sealed joint portion. The buffer bump layer disposed between a device and a substrate includes first parts and a second part surrounding the first parts. Each of the conductive joint portions includes a first electrode covering each of the first parts and a second electrode on the substrate, and each of the first electrodes is electrically connected to the second electrode. The sealed joint portion includes a joint ring located on the substrate and is jointed with the second part to form a hermetic space between the device and the substrate.
    Type: Grant
    Filed: July 24, 2009
    Date of Patent: March 13, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Tsung-Fu Yang, Su-Tsai Lu
  • Publication number: 20110018117
    Abstract: A sealed joint structure of device includes a buffer bump layer, conductive joint portions and a sealed joint portion. The buffer bump layer disposed between a device and a substrate includes first parts and a second part surrounding the first parts. Each of the conductive joint portions includes a first electrode covering each of the first parts and a second electrode on the substrate, and each of the first electrodes is electrically connected to the second electrode. The sealed joint portion includes a joint ring located on the substrate and is jointed with the second part to form a hermetic space between the device and the substrate.
    Type: Application
    Filed: July 24, 2009
    Publication date: January 27, 2011
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Tsung-Fu Yang, Su-Tsai Lu
  • Patent number: 7179874
    Abstract: A biodegradable cationic polymer is disclosed. The biodegradable cationic polymer of the invention has amino groups in the backbone and side chains, self-assembles cationic complexes with nucleic acids, and delivers nucleic acids into a cell by endocytosis. The biodegradable cationic polymer of the invention also has very low cytotoxicity. Methods of making and using the biodegradable cationic polymer are further disclosed.
    Type: Grant
    Filed: November 21, 2003
    Date of Patent: February 20, 2007
    Assignee: Chia Nan University of Pharmacy and Science
    Inventors: Min-Da Shau, Jong-Yuh Cherng, Tsung-Fu Yang, Wei-Kuo Chin
  • Publication number: 20050112203
    Abstract: A biodegradable cationic polymer is disclosed. The biodegradable cationic polymer of the invention has amino groups in the backbone and side chains, self-assembles cationic complexes with nucleic acids, and delivers nucleic acids into a cell by endocytosis. The biodegradable cationic polymer of the invention also has very low cytotoxicity. Methods of making and using the biodegradable cationic polymer are further disclosed.
    Type: Application
    Filed: November 21, 2003
    Publication date: May 26, 2005
    Inventors: Min-Da Shau, Jong-Yuh Cherng, Tsung-Fu Yang, Wei-Kuo Chin
  • Patent number: 5578974
    Abstract: A piezoelectric resonator (10) with an attenuated spurious response. The resonator (10) includes a piezoelectric crystal plate (12) having opposite surfaces (14, 16), electrodes (18, 24) positioned in overlying relationship on each of the opposite surfaces (14, 16), the electrodes (18, 24) being substantially coextensive and opposite, and providing a primary frequency mode of operation and spurious modes upon suitable energization, and one of the electrodes (18, 24) having a curved extension (23) for reducing spurious modes.
    Type: Grant
    Filed: April 28, 1995
    Date of Patent: November 26, 1996
    Assignee: Motorola, Inc.
    Inventors: Tsung-Fu Yang, Wei-Shung Huang