Patents by Inventor Tsung Han Chiang
Tsung Han Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11960451Abstract: A method for deduplication applicable to a file chunked into a plurality of deduplicated chunks is provided and includes: defining a calculation range in the file according to types of the chunks in the file, where the calculation range includes a plurality of consecutive chunks in the file; generating an evaluation value according to the types of the chunks in the calculation range to determine whether to mark the chunks in the calculation range; and re-chunking and deduplicating the marked chunks in the file. A computer-readable medium and a file system corresponding to the method for deduplication are also provided.Type: GrantFiled: November 9, 2021Date of Patent: April 16, 2024Assignee: QNAP Systems, Inc.Inventors: Tsung-Han Chiang, Jing-Wei Su, Chin-Tsung Cheng
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Patent number: 11954032Abstract: An apparatus for managing buffers and a method thereof are provided. The method for managing buffers includes: receiving a plurality of pieces of data, where the plurality of pieces of data includes a first piece of data and a second piece of data; allocating at least one buffer to establish a cluster buffer according to a data amount of the first piece of data; and if at least one of a first condition and a second condition is satisfied, ending a storage operation of the cluster buffer, where the first condition is that a total remaining space of the at least one buffer that has stored the data in the cluster buffer is less than a remaining space threshold, and the second condition is that the quantity of the at least one buffer that has stored the data in the cluster buffer reaches a cluster threshold.Type: GrantFiled: January 24, 2022Date of Patent: April 9, 2024Assignee: REALTEK SINGAPORE PRIVATE LIMITEDInventors: Mark Tsung-Han Chiang, Mei-Yao Lin
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Publication number: 20240088072Abstract: Methods, apparatuses, and systems related to embedded metal pads are described. An example semiconductor device includes a dielectric material, a metal pad having side surface, where a lower portion of the side surface is embedded in the dielectric material, a mask material on a portion of a surface of the dielectric material, an upper portion of the side surface of the metal pad, and a portion of a top surface of the metal pad and a contact pillar on a second portion of the top surface of metal pad, the contact pillar comprising a metal pillar and a pillar bump.Type: ApplicationFiled: September 13, 2022Publication date: March 14, 2024Inventors: Tsung Han Chiang, Shin Yueh Yang
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Publication number: 20240081077Abstract: A transistor includes a first semiconductor layer, a second semiconductor layer, a semiconductor nanosheet, a gate electrode and source and drain electrodes. The semiconductor nanosheet is physically connected to the first semiconductor layer and the second semiconductor layer. The gate electrode wraps around the semiconductor nanosheet. The source and drain electrodes are disposed at opposite sides of the gate electrode. The first semiconductor layer surrounds the source electrode, the second semiconductor layer surrounds the drain electrode, and the semiconductor nanosheet is disposed between the source and drain electrodes.Type: ApplicationFiled: September 1, 2022Publication date: March 7, 2024Applicants: Taiwan Semiconductor Manufacturing Company, Ltd., National Yang Ming Chiao Tung UniversityInventors: Po-Tsun Liu, Meng-Han Lin, Zhen-Hao Li, Tsung-Che Chiang, Bo-Feng Young, Hsin-Yi Huang, Sai-Hooi Yeong, Yu-Ming Lin
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Publication number: 20240077914Abstract: A foldable electronic device includes a first body having an end and a first inclined surface, a second body having a second inclined surface, and a hinge module. The end includes an accommodating area. A virtual shaft line exists between sides of the first inclined surface and the second inclined surface that are closest to each other. The second body rotates relative to the first body through the virtual shaft line. The hinge module includes a first bracket adjacent to the first inclined surface, connected to the first body, and located in the accommodating area, a second bracket adjacent to the second inclined surface and connected to the second body, and a third bracket including a first end and a second end. The first bracket is connected to the first end through a first torsion assembly. The second bracket is connected to the second end through a second torsion assembly.Type: ApplicationFiled: April 27, 2023Publication date: March 7, 2024Applicant: ASUSTeK COMPUTER INC.Inventors: Chih-Han Chang, Tsung-Ju Chiang, Chi-Hung Lin, Yen-Ting Liu
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Publication number: 20230236975Abstract: An apparatus for managing buffers and a method thereof are provided. The method for managing buffers includes: receiving a plurality of pieces of data, where the plurality of pieces of data includes a first piece of data and a second piece of data; allocating at least one buffer to establish a cluster buffer according to a data amount of the first piece of data; and if at least one of a first condition and a second condition is satisfied, ending a storage operation of the cluster buffer, where the first condition is that a total remaining space of the at least one buffer that has stored the data in the cluster buffer is less than a remaining space threshold, and the second condition is that the quantity of the at least one buffer that has stored the data in the cluster buffer reaches a cluster threshold.Type: ApplicationFiled: January 24, 2022Publication date: July 27, 2023Inventors: Mark Tsung-Han Chiang, Mei-Yao Lin
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Publication number: 20230206399Abstract: Systems and techniques provide for low-latency, full-frequency noise filtering of images through the use of an image-scaling-based filtering technique, or “multiscale filtering technique”, that can provide filtering for low, medium, and/or high frequencies for one or more components of an image, such that the different resolution scales at each level of the multiscale filtering technique provides a larger receptive field for a denoising process employed at each level than a conventional denoising framework. This multiscale filtering includes receiving an input image to be filtered and then performing a multiscale filtering process in which an input image is, at different resolution scales, denoised, downscaled, upscaled, and fused with a result of a lower resolution scale, to generate a filtered image. This may include temporarily buffering intermediate image data for some of the resolution scales at a memory using direct memory access (DMA) operations.Type: ApplicationFiled: December 24, 2021Publication date: June 29, 2023Inventors: YongMei Dong, Hui Zhou, ZhongFei Dong, Tsung-Han Chiang
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Patent number: 11651479Abstract: An image processing method and an image processing device is provided. The processing device comprises memory and a processor configured to receive a frame of color filtered image data comprising pixels which are spatially multiplexed according to a plurality of different light exposures, resample the color values as different frames of pixels for the plurality of different light exposures, fuse the resampled frames of pixels for the plurality of different light exposures into a frame of pixels according to a HDR format and color interpolate the fused frame of pixels. The processor is configured to interpolate, for each resampled frame, missing pixel color values based on the color values of adjacent resampled pixels in a same resampled frame. The color interpolated fused frame of pixels is processed in an image processing pipeline and converted to a YUV color space.Type: GrantFiled: December 22, 2020Date of Patent: May 16, 2023Assignee: Advanced Micro Devices, Inc.Inventors: Chang-Che Tsai, Tsung-Han Chiang
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Publication number: 20230063119Abstract: A method for deduplication applicable to a file chunked into a plurality of deduplicated chunks is provided and includes: defining a calculation range in the file according to types of the chunks in the file, where the calculation range includes a plurality of consecutive chunks in the file; generating an evaluation value according to the types of the chunks in the calculation range to determine whether to mark the chunks in the calculation range; and re-chunking and deduplicating the marked chunks in the file. A computer-readable medium and a file system corresponding to the method for deduplication are also provided.Type: ApplicationFiled: November 9, 2021Publication date: March 2, 2023Inventors: Tsung-Han Chiang, Jing-Wei Su, Chin-Tsung Cheng
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Patent number: 11442511Abstract: A pressing module includes a housing, an operation panel, a waterproof fixing frame, and an elastic member. The housing includes a first surface, a second surface opposite to the first surface and a slot. The slot passes through the first surface and the second surface. The operation panel is pressibly accommodated in the slot. The waterproof fixing frame is disposed on the second surface of the housing and the operation panel and covers a junction between the second surface and the operation panel. The elastic member is disposed on the waterproof fixing frame. The elastic member includes a fixed side and a movable side that are disposed on two opposite sides. The fixed side is fixed to the second surface, and the movable side is fixed to the operation panel, so that the elastic member can provide an elastic restoring force for the operation panel.Type: GrantFiled: April 30, 2021Date of Patent: September 13, 2022Assignee: PEGATRON CORPORATIONInventors: Tsung-Han Chiang, Chun-Sheng Li
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Publication number: 20220198623Abstract: An image processing method and an image processing device is provided. The processing device comprises memory and a processor configured to receive a frame of color filtered image data comprising pixels which are spatially multiplexed according to a plurality of different light exposures, resample the color values as different frames of pixels for the plurality of different light exposures, fuse the resampled frames of pixels for the plurality of different light exposures into a frame of pixels according to a HDR format and color interpolate the fused frame of pixels. The processor is configured to interpolate, for each resampled frame, missing pixel color values based on the color values of adjacent resampled pixels in a same resampled frame. The color interpolated fused frame of pixels is processed in an image processing pipeline and converted to a YUV color space.Type: ApplicationFiled: December 22, 2020Publication date: June 23, 2022Applicant: Advanced Micro Devices, Inc.Inventors: Chang-Che Tsai, Tsung-Han Chiang
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Patent number: 11302539Abstract: A method for packaging a semiconductor device includes the steps of: disposing a wafer on a first carrier plate; attaching a second carrier plate to a side of the first carrier plate opposite to the wafer; disposing a chip unit on a side of the wafer opposite to the first carrier plate; and covering the wafer and the chip unit with an encapsulation layer. A semiconductor packaging structure is also disclosed.Type: GrantFiled: August 7, 2020Date of Patent: April 12, 2022Assignee: Powertech Technology Inc.Inventors: Tsung-Han Chiang, Chun-Te Lin
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Publication number: 20220035465Abstract: A pressing module includes a housing, an operation panel, a waterproof fixing frame, and an elastic member. The housing includes a first surface, a second surface opposite to the first surface and a slot. The slot passes through the first surface and the second surface. The operation panel is pressibly accommodated in the slot. The waterproof fixing frame is disposed on the second surface of the housing and the operation panel and covers a junction between the second surface and the operation panel. The elastic member is disposed on the waterproof fixing frame. The elastic member includes a fixed side and a movable side that are disposed on two opposite sides. The fixed side is fixed to the second surface, and the movable side is fixed to the operation panel, so that the elastic member can provide an elastic restoring force for the operation panel.Type: ApplicationFiled: April 30, 2021Publication date: February 3, 2022Inventors: Tsung-Han Chiang, Chun-Sheng Li
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Patent number: 11224231Abstract: A method for brewing a beverage, a water concentrate for brewing the beverage and the beverage thereof are provided, wherein the water concentrate includes a hardness between 10,000 ppm and 100,000 ppm, a calcium ion concentration between 300 ppm and 10,000 ppm, a magnesium ion concentration between 200 ppm and 20,000 ppm, a sodium ion concentration between 30 ppm and 1,000 ppm, a potassium ion concentration between 30 ppm and 1,000 ppm, a bicarbonate ion between 10 ppm and 300 ppm, and a pH between 6 and 9. By controlling the hardness and mineral composition of the water concentrate, the invention increases the affinity to amino acids, flavonoid compounds, polyphenolic compounds, terpenoid compounds, alkaloids, and organic acids in coffee or tea beverages, and adds the content of substances which are helpful to the human body in addition to improving the taste and flavor of the beverages.Type: GrantFiled: November 14, 2019Date of Patent: January 18, 2022Assignee: Aqua Lohas Water-Tech Service Co., Ltd.Inventors: Wei-Chieh Lin, Tsung-Han Chiang, Hui-Xiang Zhou
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Publication number: 20210351044Abstract: A method for packaging a semiconductor device includes the steps of: disposing a wafer on a first carrier plate; attaching a second carrier plate to a side of the first carrier plate opposite to the wafer; disposing a chip unit on a side of the wafer opposite to the first carrier plate; and covering the wafer and the chip unit with an encapsulation layer. A semiconductor packaging structure is also disclosed.Type: ApplicationFiled: August 7, 2020Publication date: November 11, 2021Applicant: Powertech Technology Inc.Inventors: Tsung-Han CHIANG, Chun-Te LIN
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Patent number: 10912219Abstract: A waterproof structure includes a case, an elastic waterproof component and a cover. The case has a recess. The elastic waterproof component is disposed in the recess, includes a body, a first and a second inclined portions. The body includes a top surface, a bottom surface, a first, a second, a third and a fourth side surfaces, and a through hole, wherein the second and the fourth side surface are opposite to the first and the third side surface, respectively, and the through hole penetrates the body from the first side surface to the second surface. The first and the second inclined portion respectively extend from the third and the fourth side surface, and have top surface interconnects a first and a second inclined surface. The cover has a protrusion portion corresponding to the recess, and is assemble to the case and coves the elastic waterproof component.Type: GrantFiled: May 10, 2019Date of Patent: February 2, 2021Assignee: PEGATRON CORPORATIONInventors: Tsung-Han Chiang, Jiun-Wei Li
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Publication number: 20200154728Abstract: A method for brewing a beverage, a water concentrate for brewing the beverage and the beverage thereof are provided, wherein the water concentrate comprises a hardness between 10,000 ppm and 100,000 ppm, a calcium ion concentration between 300 ppm and 10,000 ppm, a magnesium ion concentration between 200 ppm and 20,000 ppm, a sodium ion concentration between 30 ppm and 1,000 ppm, a potassium ion concentration between 30 ppm and 1,000 ppm, a bicarbonate ion between 10 ppm and 300 ppm, and a pH between 6 and 9. By controlling the hardness and mineral composition of the water concentrate, the invention increases the affinity to amino acids, flavonoid compounds, polyphenolic compounds, terpenoid compounds, alkaloids, and organic acids in coffee or tea beverages, and adds the content of substances which are helpful to the human body in addition to improving the taste and flavor of the beverages.Type: ApplicationFiled: November 14, 2019Publication date: May 21, 2020Inventors: Wei-Chieh LIN, Tsung-Han CHIANG, Hui-Xiang ZHOU
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Publication number: 20190371543Abstract: A waterproof electronic device includes a keyboard module, a first case and a first waterproof layer. The keyboard module has a plurality of key caps. The first case is disposed over the keyboard module and the first case has a top surface. The top surface of the first case has a plurality of first opening exposing the key caps. The first waterproof layer covers the top surface of the first case and the key caps, and the first waterproof layer includes a fabric layer and a waterproof adhesive layer.Type: ApplicationFiled: May 9, 2019Publication date: December 5, 2019Inventors: Tsung-Han CHIANG, Jiun-Wei LI
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Publication number: 20190373751Abstract: A waterproof structure includes a case, an elastic waterproof component and a cover. The case has a recess. The elastic waterproof component is disposed in the recess, includes a body, a first and a second inclined portions. The body includes a top surface, a bottom surface, a first, a second, a third and a fourth side surfaces, and a through hole, wherein the second and the fourth side surface are opposite to the first and the third side surface, respectively, and the through hole penetrates the body from the first side surface to the second surface. The first and the second inclined portion respectively extend from the third and the fourth side surface, and have top surface interconnects a first and a second inclined surface. The cover has a protrusion portion corresponding to the recess, and is assemble to the case and coves the elastic waterproof component.Type: ApplicationFiled: May 10, 2019Publication date: December 5, 2019Inventors: Tsung-Han CHIANG, Jiun-Wei LI
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Patent number: 10193041Abstract: A light emitting diode comprises a light emitting diode chip and a packaging layer. The light emitting diode chip comprises a N-semiconductor layer, a light active layer, and a P-semiconductor layer arranged from a bottom to a top in that sequence, a first electrode, and a second electrode. The first electrode is formed on the P-semiconductor layer. The second electrode is formed on the N-semiconductor layer. The packaging layer covers the light emitting diode chip, and exposes the N-semiconductor layer, the first electrode, and the second electrode. The packaging layer has a through hole separated from a periphery of the light emitting diode chip. A conductive substrate fills the through hole. A first conductive layer is electrically connected to the first electrode and the conductive substrate. The disclosure also provides a method for manufacturing a light emitting diode.Type: GrantFiled: November 16, 2017Date of Patent: January 29, 2019Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INCInventors: Shih-Chuan Lin, Tsung-Han Chiang, Chun-Yao Lin, Chao-Ming Huang, Hsiu-Ling Hung, Tzu-Chien Hung