Patents by Inventor Tsung-Han Hsieh

Tsung-Han Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11158505
    Abstract: A method for lithography patterning includes depositing a target layer over a substrate, the target layer including an inorganic material; implanting ions into the target layer, resulting in an ion-implanted target layer; forming a photoresist layer directly over the ion-implanted target layer; and exposing the photoresist layer to radiation in a photolithography process. The ion-implanted target layer reduces reflection of the radiation back to the photoresist layer during the photolithography process.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: October 26, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Cheng-Han Yang, Tsung-Han Wu, Chih-Wei Chang, Hsin-mei Lin, I-Chun Hsieh, Hsi-Yen Chang
  • Publication number: 20210317839
    Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one flow inlet. The impeller assembled in the housing and rotating about an axial direction includes a hub and a plurality blades disposed around the hub. The flow inlet is located in the axial direction and faces the hub. Each of the blades has a wing tab next to the flow inlet, and the wing tab extends from a main surface of the blade to another blade. The wing tab has an inclined surface facing toward a periphery of the flow inlet along a radial direction of the impeller.
    Type: Application
    Filed: April 5, 2021
    Publication date: October 14, 2021
    Applicant: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Jau-Han Ke, Kuang-Hua Lin
  • Publication number: 20210305122
    Abstract: A semiconductor package includes a circuit substrate, a die, a frame structure, a heat sink lid and conductive balls. The die is disposed on a front surface of the circuit substrate and electrically connected with the circuit substrate. The die includes two first dies disposed side by side and separate from each other with a gap between two facing sidewalls of the two first dies. The frame structure is disposed on the front surface of the circuit substrate and surrounding the die. The heat sink lid is disposed on the die and the frame structure. The head sink lid has a slit that penetrates through the heat sink lid in a thickness direction and exposes the gap between the two facing sidewalls of the two first dies. The conductive balls are disposed on the opposite surface of the circuit substrate and electrically connected with the die through the circuit substrate.
    Type: Application
    Filed: March 31, 2020
    Publication date: September 30, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei-Chih Lai, Chien-Chia Chiu, Chen-Hua Yu, Der-Chyang Yeh, Cheng-Hsien Hsieh, Li-Han Hsu, Tsung-Shu Lin, Wei-Cheng Wu, Yu-Chen Hsu
  • Publication number: 20210139592
    Abstract: An anti-PD-L1 antibody, or an antigen-binding fragment thereof, comprising: a heavy chain variable region comprising the three CDRs with the sequences of SEQ ID NOs: 2-4, 6-8, 10-12, 14-16, or 18-20; and/or a light chain variable region comprising the three CDRs with the sequences of SEQ ID NOs: 22-24, 26-28, 30-32, 34-36, or 38-40, wherein the antibody is a chimeric, humanized, composite, or human antibody.
    Type: Application
    Filed: July 14, 2019
    Publication date: May 13, 2021
    Applicant: Development Center for Biotechnology
    Inventors: Cheng-Chou YU, Shih-Rang YANG, Tsung-Han HSIEH, Mei-Chi CHAN, Shu-Ping YEH, Chuan-Lung HSU, Ling-Yueh HU, Chih-Lun HSIAO
  • Publication number: 20030049579
    Abstract: A gas supply apparatus for a gas fired radiant heater has a compact structure, which includes a pressure regulator extending vertically and disposed at one side of an assembly seat, a switch button disposed at one side of the assembly seat, a temperature-control switch and a mercury switch provided on a horizontal platform extending from one side of the assembly seat, a gas pipe vertically extending in a substantially upright straight route from the assembly seat, a mixing tube securely connected on an upper end of the gas pipe by means of a clamping ring, a burner cap provided on an upper end of the mixing tube and a temperature sensor and an igniter respectively provided at one side of the burner cap, whereby the structure of the gas supply apparatus is optimized, and the working reliability and safety are ensured.
    Type: Application
    Filed: September 7, 2001
    Publication date: March 13, 2003
    Inventor: Tsung-Han Hsieh
  • Patent number: D461548
    Type: Grant
    Filed: August 13, 2001
    Date of Patent: August 13, 2002
    Inventor: Tsung-Han Hsieh
  • Patent number: D465044
    Type: Grant
    Filed: January 22, 2002
    Date of Patent: October 29, 2002
    Inventor: Tsung-Han Hsieh
  • Patent number: D720877
    Type: Grant
    Filed: October 12, 2012
    Date of Patent: January 6, 2015
    Assignee: Watson Bell Co., Ltd.
    Inventors: Jao-Yi Chen, Tsung Han Hsieh
  • Patent number: D790623
    Type: Grant
    Filed: May 3, 2016
    Date of Patent: June 27, 2017
    Assignee: BASINER CO., LTD.
    Inventors: Hao-I Wang, Yi-Chen Liu, Tsung-Han Hsieh