Abstract: A boiling enhancement component and an immersion cooling system having the same are provided. The boiling enhancement component includes a heat conductive portion and a boiling formation portion. The heat conductive portion has a first surface contacting a heat source and a second surface; the boiling formation portion is located on the second surface and includes a plurality of bubble disturbance regions. When a fluid medium boils on the boiling formation portion to generate bubbles, the bubble disturbance regions redirect the rising paths of at least some of the bubbles, thereby promoting bubble aggregation and accelerating the detachment of bubbles from the boiling enhancement component. Another embodiment provides an immersion cooling system, which includes a tank and the boiling enhancement component, the tank having a containing space to contain the fluid medium, and the boiling enhancement component being disposed in the containing space and immersed in the fluid medium.

Abstract: A gas cooling module for an immersion electronic apparatus and a test device equipped with the gas cooling module are provided. The immersion electronic apparatus includes a boiler disposed on a heat source of a circuit board. The gas cooling module includes a gas supply source and a fluid guide member. Cooling gas is introduced from the gas supply source into the fluid guide member, and is ejected toward the boiler, so that heat can be effectively taken away, and the immersion electronic apparatus can be tested in an air environment. The test device further integrates a housing, the immersion electronic apparatus is placed in the housing, and the test device is equipped with the foregoing gas cooling module, to perform a more comprehensive performance test.

Abstract: A media docking device includes an input module, an output module and a processing module. The input module is electrically connected to a media source device for receiving media data. The output module is electrically connected to a media play device. The processing module determines if an instruction is received from the media source device or a remote device. If the instruction is not received, the processing module transfers the media data to the output module to transmit to the media play device. If the instruction is received, the processing module limits a transmission of the media data according to the instruction, such that the media data will not be completely played by the media play device.

Abstract: An enclosure for an electronic device includes a metal substrate, a porous anodic oxide layer overlaying the metal substrate, and a hydrothermal sealant disposed on the anodic oxide layer, the hydrothermal sealant including a molten salt.

Abstract: A server system includes a rack, servers disposed in the rack and a heat dissipation module including a pump assembly, a main manifold assembly, heat exchange assemblies and a sub manifold assembly. The pump assembly is disposed in the rack. The main manifold assembly includes two main pipelines, one is connected to a main outlet of the pump assembly and inlets of the servers, and the other is connected to outlets of the servers and a main inlet of the pump assembly. The heat exchange assemblies are removably disposed in the rack. The sub manifold assembly includes two sub pipelines, one is connected to a sub outlet of the pump assembly and inlets of the heat exchange assemblies, and the other is connected to outlets of the heat exchange assemblies and a sub inlet of the pump assembly.

Abstract: An immersion cooling system includes a work tank, a buffer tank, and a communication control assembly. The work tank has a work-tank gas-phase region and a work-tank liquid-phase region. The buffer tank has a buffer-tank gas-phase region and a buffer-tank liquid-phase region. The communication control assembly includes a first pipeline, a first pump, a second pipeline, and a second valve. In response to that the first pump is actuated, through the first pipeline, a fluid of the work-tank liquid-phase region is transported to the buffer-tank liquid-phase region, or a fluid of the buffer-tank liquid-phase region is transported to the work-tank liquid-phase region. In response to that the second valve is actuated, through the second pipeline, the work-tank gas-phase region is selectively in communication with the buffer-tank gas-phase region.

Abstract: An electronic system includes a heat source and a cooling module. The cooling module includes a cold plate and a thermally conductive component. The cold plate has a fluid chamber, a thermally coupling surface and a heat dissipation surface, the fluid chamber is located between the thermally coupling surface and the heat dissipation surface, and the thermally coupling surface is thermally coupled with the heat source. The thermally conductive component is thermally coupled with the cold plate. The thermally conductive component extends from one side of the cold plate located closer to the thermally coupling surface to another side of the cold plate located closer to the heat dissipation surface.

Abstract: A media docking device is provided and includes an input module, an output module, and a process module. The input module is electrically connected to a media source device. The output module is electrically connected to multiple media playing devices and obtains device data from the media playing devices. The process module transmits the device data and screen numbers to the media source device through the input module. When determining to perform a display switch procedure, the process module modifies the device data and the screen numbers, and transmits the modified device data and the modified screen numbers to the media source device through the input module. The process module also transmits media data from the media source device to the corresponding media playing device.

Abstract: A method for cooling electronic components includes: causing a flow of a portion of a cooling liquid from a cooling chamber through an electro-filtration device, in which the cooling chamber is configured to enable a thermal exchange between one or more electronic components and the cooling liquid housed in the cooling chamber; filtering at least a portion of the cooling liquid through the electro-filtration device, which is configured to apply one or more electric fields on the portion of the cooling liquid, the electro-filtration device having electrodes for providing the one or more electric fields while the portion of the cooling liquid flows through at least some of the one or more electric fields to result in a filtered cooling liquid; and causing a flow of the filtered cooling liquid from the electro-filtration device to the cooling chamber.

Abstract: A separate immersion cooling system includes a separate immersion cooling device. The separate immersion cooling device includes a condensing device, a plurality of cooling tanks, a plurality of outflow pipes and a plurality of return pipes. The separate immersion cooling device is adapted to cooling a heat-generating device immersed in the cooling tank.

Abstract: An immersion cooling system includes a work tank, a pump, a first pipeline, a condensation dehumidification device, a second pipeline, and a control system. The work tank includes a vapor section and a humidity sensor for sensing a humidity of the vapor section. The first pipeline includes a first valve. The vapor section and the pump are selectively in communication with each other or not when the first valve is actuated. The condensation dehumidification device has a first end and a second end, where the first end is in communication with the pump. The second pipeline includes a second valve. The condensation dehumidification device and the tank are selectively in communication with each other or not when the second valve is actuated. When the humidity is greater than a preset humidity, the control system controls the first valve to communicate the vapor section and the pump and activates the pump.

Abstract: An outdoor doorbell warning system includes a millimeter-wave radar unit, a first speaker unit and a control module. The control module is electrically connected with the millimeter-wave radar unit and the first speaker unit. When a person in a detection range of the millimeter-wave radar unit is detected by the millimeter-wave radar unit, the control module drives the first speaker unit to emit a warning sound according to the position information of the person. Furthermore, when the person moves or stays in different warning regions, the loudness levels of the warning sounds received by the outsider person are similar or identical.

Abstract: A doorbell system includes a chime device, a network communication device and a doorbell body. The chime device is disposed within a first space. The network communication device has a Power over Ethernet function. The network communication device issues an Ethernet network power signal and provides a remote network communication service. The doorbell body includes a doorbell button. The doorbell body is electrically connected with the network communication device through a Power-over-Ethernet power supply and data bus. The doorbell body receives the Ethernet network power signal from the network communication device through the Power-over-Ethernet power supply and data bus. The doorbell body is powered by the Ethernet network power signal only. In response to a pressing and activating action on the doorbell button, the doorbell body issues a doorbell enabling control signal. The chime device generates a chime sound effect in response to the doorbell enabling control signal.

Abstract: A media docking device includes an input module, an output module and a processing module. The input module is electrically connected to a media source device for receiving media data. The output module is electrically connected to a media play device. The processing module determines if an instruction is received from the media source device or a remote device. If the instruction is not received, the processing module transfers the media data to the output module to transmit to the media play device. If the instruction is received, the processing module limits a transmission of the media data according to the instruction, such that the media data will not be completely played by the media play device.

Abstract: A media docking device includes an input circuit, an output circuit and a processing circuit. The input circuit is electrically connected to a media source device for receiving media data. The output circuit is electrically connected to a media play device. The processing circuit is electrically connected to the input circuit and the output circuit. The processing circuit determines if a verification procedure is passed. If the verification procedure is passed, the processing circuit transfers the media data to the media play device. If the verification procedure is not passed, the processing circuit limits a transmission of the media data, such that the media data will not be completely played by the media play device.

Abstract: An immersion cooling system includes a work tank, a chip device, a microchannel device, a first communication pipeline, and a first heat exchange device. The work tank includes a fluid section. The chip device is in the fluid section and has an inlet and an outlet. The chip device includes a motherboard, a chip, and a cover. The motherboard has a main surface substantially parallel to a vertical line. The cover is on the motherboard. The chip is between the cover and the motherboard. The microchannel device is in the chip device. Two ends of the microchannel device are respectively in communication with the inlet and the outlet. The first communication pipeline and the first heat exchange device are in the fluid section. Two ends of the first communication pipeline are respectively in communication with the outlet and the first heat exchange device.

Abstract: A piece of immersion liquid cooling equipment, which is adapted for an electronic device, includes a tank, a condenser, a cold plate, and a first pipe. The tank accommodates a first fluid, and the electronic device is immersed in the first fluid in the form of a liquid. The condenser is disposed in the tank and located above the first fluid in the form of a liquid. The cold plate is disposed in the tank and is in thermal contact with at least one high power commodity of the electronic device. The first pipe is disposed and extends between an exterior and an interior of the tank. The first pipe communicates with the condenser and the cold plate. The first pipe is configured to receive a second fluid to flow through the condenser and the cold plate. A heat dissipation method for an electronic device.

Abstract: A separate immersion cooling system includes a separate immersion cooling device. The separate immersion cooling device includes a condensing device, a plurality of cooling tanks, a plurality of outflow pipes and a plurality of return pipes. The separate immersion cooling device is adapted to cooling a heat-generating device immersed in the cooling tank.

Abstract: An electronic apparatus including at least one heat generating component and an immersion cooling system is provided. The immersion cooling system includes a box body and a condensation module. The box body is adapted to accommodate a coolant, and the heat generating component is disposed in the box body to be immersed in the coolant in a liquid state. The condensation module includes a pipeline and a condensate, and the pipeline passes through the box body and is adapted for the condensate to flow. At least one parameter of the condensate may be changed to lower a boiling point of the coolant to a predetermined value by lowering the temperature in the box body with the condensate. In addition, an operating method of the electronic apparatus is also provided.

Abstract: An immersion cooling system including a rack and at least one immersion cooling module is provided. The immersion cooling module includes a chassis and a condensation pipeline. The chassis is slidably disposed on the rack and is adapted to accommodate a coolant. At least one heat generating component is adapted to be disposed in the chassis to be immersed in the liquid coolant. The condensation pipeline is disposed in the chassis and is located above the liquid coolant. In addition, an electronic apparatus having the immersion cooling system is also provided.