Patents by Inventor Tsung-Han Lin

Tsung-Han Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240150592
    Abstract: Provided is a photocurable conductive black composition including: (a) at least one (meth)acrylate-functionalized urethane oligomer; (b) at least one photopolymerizable compound; (c) a photoinitiator; (d) a visible-light blocking system; (e) conductive fillers; and optionally (f) a thermal initiator. Also provided are a method for forming a cured product composed of the photocurable conductive black compositions, and an article comprising the cured product.
    Type: Application
    Filed: October 24, 2023
    Publication date: May 9, 2024
    Inventors: Chien-Ho HUANG, Yi-Ting CHEN, Tsung-Han TSAI, Li-Yen LIN
  • Patent number: 11971624
    Abstract: A display device includes a first display unit emitting a green light having a first output spectrum corresponding to a highest gray level of the display device and a second display unit emitting a blue light having a second output spectrum corresponding to the highest gray level of the display device. The first output spectrum has a main wave with a first peak. The second output spectrum has a main wave with a second peak and a sub wave with a sub peak. The second peak corresponds to a main wavelength, the sub peak corresponds to a sub wavelength, and the main wavelength is less than the sub wavelength. An intensity of the second peak is greater than an intensity of the sub peak and an intensity of the first peak.
    Type: Grant
    Filed: July 6, 2023
    Date of Patent: April 30, 2024
    Assignee: InnoLux Corporation
    Inventors: Hsiao-Lang Lin, Jia-Yuan Chen, Jui-Jen Yueh, Kuan-Feng Lee, Tsung-Han Tsai
  • Patent number: 11974366
    Abstract: A display device includes a substrate, an electroluminescence element, a partition structure, a light conversion element and an intermediate layer. The electroluminescence element is disposed above the substrate. The partition structure is disposed above the electroluminescence element and includes a first opening. The light conversion element is disposed in the first opening. The intermediate layer is disposed above the light conversion element and the partition structure. The intermediate layer has a first part and a second part. In a top-view direction, the first part overlaps the light conversion element, the second part overlaps the partition structure, and a thickness of the first part is greater than a thickness of the second part.
    Type: Grant
    Filed: March 14, 2023
    Date of Patent: April 30, 2024
    Assignee: InnoLux Corporation
    Inventors: Hsiao-Lang Lin, Tsung-Han Tsai, Kuan-Feng Lee
  • Patent number: 11963421
    Abstract: A display device includes a plurality of pixels. At least one of the pixels includes a green light wavelength conversion layer, a color filter layer and a light path. The light path passes through the green light wavelength conversion layer and then passes through the color filter layer. The color filter layer includes a green pigment and a yellow pigment.
    Type: Grant
    Filed: January 6, 2021
    Date of Patent: April 16, 2024
    Assignee: InnoLux Corporation
    Inventors: Hsiao-Lang Lin, Tsung-Han Tsai
  • Patent number: 11955439
    Abstract: A semiconductor package includes a semiconductor die, a redistribution structure and connective terminals. The redistribution structure is disposed on the semiconductor die and includes a first metallization tier disposed in between a pair of dielectric layers. The first metallization tier includes routing conductive traces electrically connected to the semiconductor die and a shielding plate electrically insulated from the semiconductor die. The connective terminals include dummy connective terminals and active connective terminals. The dummy connective terminals are disposed on the redistribution structure and are electrically connected to the shielding plate. The active connective terminals are disposed on the redistribution structure and are electrically connected to the routing conductive traces. Vertical projections of the dummy connective terminals fall on the shielding plate.
    Type: Grant
    Filed: January 17, 2023
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Cheng Wu, Chien-Chia Chiu, Cheng-Hsien Hsieh, Li-Han Hsu, Meng-Tsan Lee, Tsung-Shu Lin
  • Fan
    Patent number: 11946483
    Abstract: A fan is provided herein, including a housing, a hub, and a plurality of blades. The housing includes a top case and a bottom case. The hub is rotatably disposed between the top case and the bottom case in an axial direction. The blades extend from the hub in a radial direction, located between the top case and the bottom case. Each of the blades has a proximal end and a distal end. The proximal end is connected to the hub. The distal end is opposite from the proximal end, located at the other side of the blade, having at least one recessed portion. Each of the recessed portions form a passage for air.
    Type: Grant
    Filed: May 17, 2023
    Date of Patent: April 2, 2024
    Assignee: ACER INCORPORATED
    Inventors: Jau-Han Ke, Tsung-Ting Chen, Chun-Chieh Wang, Yu-Ming Lin, Cheng-Wen Hsieh, Wen-Neng Liao
  • Publication number: 20240087955
    Abstract: A method and apparatus for forming tungsten features in semiconductor devices is provided. The method includes exposing a top opening of a feature formed in a substrate to a physical vapor deposition (PVD) process to deposit a tungsten liner layer within the feature. The PVD process is performed in a first processing region of a first processing chamber and the tungsten liner layer forms an overhang portion, which partially obstructs the top opening of the feature. The substrate is transferred from the first processing region of the first processing chamber to a second processing region of a second processing chamber without breaking vacuum. The overhang portion is exposed to nitrogen-containing radicals in the second processing region to inhibit subsequent growth of tungsten along the overhang portion. The feature is exposed to a tungsten-containing precursor gas to form a tungsten fill layer over the tungsten liner layer within the feature.
    Type: Application
    Filed: September 1, 2023
    Publication date: March 14, 2024
    Inventors: Yi XU, Xianyuan ZHAO, Zhimin QI, Aixi ZHANG, Geraldine VASQUEZ, Dien-Yeh WU, Wei LEI, Xingyao GAO, Shirish PETHE, Wenting HOU, Chao DU, Tsung-Han YANG, Kyoung-Ho BU, Chen-Han LIN, Jallepally RAVI, Yu LEI, Rongjun WANG, Xianmin TANG
  • Publication number: 20240078629
    Abstract: Techniques to improve performance of matrix multiply operations are described in which a compute kernel can specify one or more element-wise operations to perform on output of the compute kernel before the output is transferred to higher levels of a processor memory hierarchy.
    Type: Application
    Filed: September 14, 2023
    Publication date: March 7, 2024
    Applicant: Intel Corporation
    Inventors: Eriko Nurvitadhi, Balaji Vembu, Tsung-Han Lin, Kamal Sinha, Rajkishore Barik, Nicolas C. Galoppo Von Borries
  • Publication number: 20240077914
    Abstract: A foldable electronic device includes a first body having an end and a first inclined surface, a second body having a second inclined surface, and a hinge module. The end includes an accommodating area. A virtual shaft line exists between sides of the first inclined surface and the second inclined surface that are closest to each other. The second body rotates relative to the first body through the virtual shaft line. The hinge module includes a first bracket adjacent to the first inclined surface, connected to the first body, and located in the accommodating area, a second bracket adjacent to the second inclined surface and connected to the second body, and a third bracket including a first end and a second end. The first bracket is connected to the first end through a first torsion assembly. The second bracket is connected to the second end through a second torsion assembly.
    Type: Application
    Filed: April 27, 2023
    Publication date: March 7, 2024
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Chih-Han Chang, Tsung-Ju Chiang, Chi-Hung Lin, Yen-Ting Liu
  • Publication number: 20240081077
    Abstract: A transistor includes a first semiconductor layer, a second semiconductor layer, a semiconductor nanosheet, a gate electrode and source and drain electrodes. The semiconductor nanosheet is physically connected to the first semiconductor layer and the second semiconductor layer. The gate electrode wraps around the semiconductor nanosheet. The source and drain electrodes are disposed at opposite sides of the gate electrode. The first semiconductor layer surrounds the source electrode, the second semiconductor layer surrounds the drain electrode, and the semiconductor nanosheet is disposed between the source and drain electrodes.
    Type: Application
    Filed: September 1, 2022
    Publication date: March 7, 2024
    Applicants: Taiwan Semiconductor Manufacturing Company, Ltd., National Yang Ming Chiao Tung University
    Inventors: Po-Tsun Liu, Meng-Han Lin, Zhen-Hao Li, Tsung-Che Chiang, Bo-Feng Young, Hsin-Yi Huang, Sai-Hooi Yeong, Yu-Ming Lin
  • Patent number: 11922535
    Abstract: Embodiments provide mechanisms to facilitate compute operations for deep neural networks. One embodiment comprises a graphics processing unit comprising one or more multiprocessors, at least one of the one or more multiprocessors including a register file to store a plurality of different types of operands and a plurality of processing cores. The plurality of processing cores includes a first set of processing cores of a first type and a second set of processing cores of a second type. The first set of processing cores are associated with a first memory channel and the second set of processing cores are associated with a second memory channel.
    Type: Grant
    Filed: February 13, 2023
    Date of Patent: March 5, 2024
    Assignee: Intel Corporation
    Inventors: Prasoonkumar Surti, Narayan Srinivasa, Feng Chen, Joydeep Ray, Ben J. Ashbaugh, Nicolas C. Galoppo Von Borries, Eriko Nurvitadhi, Balaji Vembu, Tsung-Han Lin, Kamal Sinha, Rajkishore Barik, Sara S. Baghsorkhi, Justin E. Gottschlich, Altug Koker, Nadathur Rajagopalan Satish, Farshad Akhbari, Dukhwan Kim, Wenyin Fu, Travis T. Schluessler, Josh B. Mastronarde, Linda L. Hurd, John H. Feit, Jeffery S. Boles, Adam T. Lake, Karthik Vaidyanathan, Devan Burke, Subramaniam Maiyuran, Abhishek R. Appu
  • Publication number: 20240005136
    Abstract: In an example, an apparatus comprises a compute engine comprising a high precision component and a low precision component; and logic, at least partially including hardware logic, to receive instructions in the compute engine; select at least one of the high precision component or the low precision component to execute the instructions; and apply a gate to at least one of the high precision component or the low precision component to execute the instructions. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: July 12, 2023
    Publication date: January 4, 2024
    Applicant: Intel Corporation
    Inventors: Kamal Sinha, Balaji Vembu, Eriko Nurvitadhi, Nicolas C. Galoppo Von Borries, Rajkishore Barik, Tsung-Han Lin, Joydeep Ray, Ping T. Tang, Michael S. Strickland, Xiaoming Chen, Anbang Yao, Tatiana Shpeisman, Abhishek R. Appu, Altug Koker, Farshad Akhbari, Narayan Srinivasa, Feng Chen, Dukhwan Kim, Nadathur Rajagopalan Satish, John C. Weast, Mike B. MacPherson, Linda L. Hurd, Vasanth Ranganathan, Sanjeev Jahagirdar
  • Publication number: 20230394616
    Abstract: One embodiment provides a parallel processor comprising a hardware scheduler to schedule pipeline commands for compute operations to one or more of multiple types of compute units, a plurality of processing resources including a first sparse compute unit configured for input at a first level of sparsity and hybrid memory circuitry including a memory controller, a memory interface, and a second sparse compute unit configured for input at a second level of sparsity that is greater than the first level of sparsity.
    Type: Application
    Filed: June 14, 2023
    Publication date: December 7, 2023
    Applicant: Intel Corporation
    Inventors: Eriko Nurvitadhi, Balaji Vembu, Nicolas C. Galoppo Von Borries, Rajkishore Barik, Tsung-Han Lin, Kamal Sinha, Nadathur Rajagopalan Satish, Jeremy Bottleson, Farshad Akhbari, Altug Koker, Narayan Srinivasa, Dukhwan Kim, Sara S. Baghsorkhi, Justin E. Gottschlich, Feng Chen, Elmoustapha Ould-Ahmed-Vall, Kevin Nealis, Xiaoming Chen, Anbang Yao
  • Patent number: 11835951
    Abstract: Systems and methods for predicting object motion and controlling autonomous vehicles are provided. In one example embodiment, a computer implemented method includes obtaining state data indicative of at least a current or a past state of an object that is within a surrounding environment of an autonomous vehicle. The method includes obtaining data associated with a geographic area in which the object is located. The method includes generating a combined data set associated with the object based at least in part on a fusion of the state data and the data associated with the geographic area in which the object is located. The method includes obtaining data indicative of a machine-learned model. The method includes inputting the combined data set into the machine-learned model. The method includes receiving an output from the machine-learned model. The output can be indicative of a plurality of predicted trajectories of the object.
    Type: Grant
    Filed: September 3, 2021
    Date of Patent: December 5, 2023
    Assignee: UATC, LLC
    Inventors: Nemanja Djuric, Vladan Radosavljevic, Thi Duong Nguyen, Tsung-Han Lin, Jeff Schneider, Henggang Cui, Fang-Chieh Chou, Tzu-Kuo Huang
  • Publication number: 20230359461
    Abstract: One embodiment provides for a compute apparatus comprising a decode unit to decode a single instruction into a decoded instruction that specifies multiple operands including a multi-bit input value and a one-bit weight associated with a neural network, as well as an arithmetic logic unit including a multiplier, an adder, and an accumulator register. To execute the decoded instruction, the multiplier is to perform a fused operation including an exclusive not OR (XNOR) operation and a population count operation. The adder is configured to add the intermediate product to a value stored in the accumulator register and update the value stored in the accumulator register.
    Type: Application
    Filed: May 11, 2023
    Publication date: November 9, 2023
    Applicant: Intel Corporation
    Inventors: Kevin Nealis, Anbang Yao, Xiaoming Chen, Elmoustapha Ould-Ahmed-Vall, Sara S. Baghsorkhi, Eriko Nurvitadhi, Balaji Vembu, Nicolas C. Galoppo Von Borries, Rajkishore Barik, Tsung-Han Lin, Kamal Sinha
  • Patent number: 11803935
    Abstract: Techniques to improve performance of matrix multiply operations are described in which a compute kernel can specify one or more element-wise operations to perform on output of the compute kernel before the output is transferred to higher levels of a processor memory hierarchy.
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: October 31, 2023
    Assignee: Intel Corporation
    Inventors: Eriko Nurvitadhi, Balaji Vembu, Tsung-Han Lin, Kamal Sinha, Rajkishore Barik, Nicolas C. Galoppo Von Borries
  • Patent number: 11748606
    Abstract: In an example, an apparatus comprises a compute engine comprising a high precision component and a low precision component; and logic, at least partially including hardware logic, to receive instructions in the compute engine; select at least one of the high precision component or the low precision component to execute the instructions; and apply a gate to at least one of the high precision component or the low precision component to execute the instructions. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: May 11, 2021
    Date of Patent: September 5, 2023
    Assignee: INTEL CORPORATION
    Inventors: Kamal Sinha, Balaji Vembu, Eriko Nurvitadhi, Nicolas C. Galoppo Von Borries, Rajkishore Barik, Tsung-Han Lin, Joydeep Ray, Ping T. Tang, Michael S. Strickland, Xiaoming Chen, Anbang Yao, Tatiana Shpeisman, Abhishek R. Appu, Altug Koker, Farshad Akhbari, Narayan Srinivasa, Feng Chen, Dukhwan Kim, Nadathur Rajagopalan Satish, John C. Weast, Mike B. MacPherson, Linda L. Hurd, Vasanth Ranganathan, Sanjeev S. Jahagirdar
  • Publication number: 20230260072
    Abstract: Embodiments provide mechanisms to facilitate compute operations for deep neural networks. One embodiment comprises a graphics processing unit comprising one or more multiprocessors, at least one of the one or more multiprocessors including a register file to store a plurality of different types of operands and a plurality of processing cores. The plurality of processing cores includes a first set of processing cores of a first type and a second set of processing cores of a second type. The first set of processing cores are associated with a first memory channel and the second set of processing cores are associated with a second memory channel.
    Type: Application
    Filed: February 13, 2023
    Publication date: August 17, 2023
    Applicant: Intel Corporation
    Inventors: Prasoonkumar Surti, Narayan Srinivasa, Feng Chen, Joydeep Ray, Ben J. Ashbaugh, Nicolas C. Galoppo Von Borries, Eriko Nurvitadhi, Balaji Vembu, Tsung-Han Lin, Kamal Sinha, Rajkishore Barik, Sara S. Baghsorkhi, Justin E. Gottschlich, Altug Koker, Nadathur Rajagopalan Satish, Farshad Akhbari, Dukhwan Kim, Wenyin Fu, Travis T. Schluessler, Josh B. Mastronarde, Linda L. Hurd, John H. Feit, Jeffery S. Boles, Adam T. Lake, Karthik Vaidyanathan, Devan Burke, Subramaniam Maiyuran, Abhishek R. Appu
  • Patent number: 11727527
    Abstract: One embodiment provides for a compute apparatus to perform machine learning operations, the compute apparatus comprising a decode unit to decode a single instruction into a decoded instruction, the decoded instruction to cause the compute apparatus to perform a complex compute operation.
    Type: Grant
    Filed: December 3, 2021
    Date of Patent: August 15, 2023
    Assignee: Intel Corporation
    Inventors: Eriko Nurvitadhi, Balaji Vembu, Nicolas C. Galoppo Von Borries, Rajkishore Barik, Tsung-Han Lin, Kamal Sinha, Nadathur Rajagopalan Satish, Jeremy Bottleson, Farshad Akhbari, Altug Koker, Narayan Srinivasa, Dukhwan Kim, Sara S. Baghsorkhi, Justin E. Gottschlich, Feng Chen, Elmoustapha Ould-Ahmed-Vall, Kevin Nealis, Xiaoming Chen, Anbang Yao
  • Patent number: 11720355
    Abstract: One embodiment provides a graphics processor comprising a memory controller and a graphics processing resource coupled with the memory controller. The graphics processing resource includes circuitry configured to execute an instruction to perform a matrix operation on first input including weight data and second input including input activation data, generate intermediate data based on a result of the matrix operation, quantize the intermediate data to a floating-point format determined based on a statistical distribution of first output data, and output, as second output data, quantized intermediate data in a determined floating-point format.
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: August 8, 2023
    Assignee: Intel Corporation
    Inventors: Himanshu Kaul, Mark A. Anders, Sanu K. Mathew, Anbang Yao, Joydeep Ray, Ping T. Tang, Michael S. Strickland, Xiaoming Chen, Tatiana Shpeisman, Abhishek R. Appu, Altug Koker, Kamal Sinha, Balaji Vembu, Nicolas C. Galoppo Von Borries, Eriko Nurvitadhi, Rajkishore Barik, Tsung-Han Lin, Vasanth Ranganathan, Sanjeev Jahagirdar