Patents by Inventor Tsung-Han Ou

Tsung-Han Ou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11170926
    Abstract: An isolation coupling structure for transmitting a feedback signal between a secondary side and a primary side of a voltage conversion device includes a first dielectric layer including a first face and a second face opposite to the first face, a first coupling coil disposed on the first face enclosing to form an inner region; a second coupling coil configured to couple with the first coupling coil. The second coupling coil includes a first coil portion and a second coil portion, where the first coil portion is disposed on the second face, the second coil portion is disposed on the first face and located inside the inner region. The second coil portion is isolated from the first coupling coil, and the first coil portion and the second coil portion are electrically connected. The technical effect is that it can realize the electrical isolation and the coupling with low cost and small package size.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: November 9, 2021
    Assignee: ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD.
    Inventors: Jung-Pei Cheng, Hsiang-Chung Chang, Yu-Ming Chen, Chieh-Wen Cheng, Tsung-Han Ou, Lih-Ming Doong
  • Publication number: 20190172621
    Abstract: An isolation coupling structure for transmitting a feedback signal between a secondary side and a primary side of a voltage conversion device includes a first dielectric layer including a first face and a second face opposite to the first face, a first coupling coil disposed on the first face enclosing to form an inner region; a second coupling coil configured to couple with the first coupling coil. The second coupling coil includes a first coil portion and a second coil portion, where the first coil portion is disposed on the second face, the second coil portion is disposed on the first face and located inside the inner region. The second coil portion is isolated from the first coupling coil, and the first coil portion and the second coil portion are electrically connected. The technical effect is that it can realize the electrical isolation and the coupling with low cost and small package size.
    Type: Application
    Filed: February 2, 2018
    Publication date: June 6, 2019
    Applicant: Alpha and Omega Semiconductor (Cayman) Ltd.
    Inventors: Jung-Pei Cheng, Hsiang-Chung Chang, Yu-Ming Chen, Chieh-Wen Cheng, Tsung-Han Ou, Lih-Ming Doong