Patents by Inventor Tsung-Han Su
Tsung-Han Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11960451Abstract: A method for deduplication applicable to a file chunked into a plurality of deduplicated chunks is provided and includes: defining a calculation range in the file according to types of the chunks in the file, where the calculation range includes a plurality of consecutive chunks in the file; generating an evaluation value according to the types of the chunks in the calculation range to determine whether to mark the chunks in the calculation range; and re-chunking and deduplicating the marked chunks in the file. A computer-readable medium and a file system corresponding to the method for deduplication are also provided.Type: GrantFiled: November 9, 2021Date of Patent: April 16, 2024Assignee: QNAP Systems, Inc.Inventors: Tsung-Han Chiang, Jing-Wei Su, Chin-Tsung Cheng
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Publication number: 20240077802Abstract: A method of forming a photoresist pattern includes forming a protective layer over a photoresist layer formed on a substrate. The protective layer and the photoresist layer are selectively exposed to actinic radiation. The photoresist layer is developed to form a pattern in the photoresist layer. The protective layer includes a polymer without a nitrogen-containing moiety, and a basic quencher, an organic acid, a photoacid generator, or a thermal acid generator.Type: ApplicationFiled: August 7, 2023Publication date: March 7, 2024Inventors: Yu-Chung SU, Tsung-Han KO, Ching-Yu CHANG
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Patent number: 8464751Abstract: An oxygen content adjustment apparatus includes an oxygen content detector, a number of keys, a controller, an oxygen source, a first nozzle, a first valve, a flame retardant gas source, a second nozzle, and a second valve. The controller is connected to the oxygen content detector and the keys. A first terminal of the first valve is connected to the controller. A second terminal of the first valve is connected to the oxygen source. A third terminal of the first valve is connected to the first nozzle. A first terminal of the second valve is connected to the controller. A second terminal of the second valve is connected to the flame retardant gas source. A third terminal of the second valve is connected to the second nozzle.Type: GrantFiled: September 20, 2010Date of Patent: June 18, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Tsung-Han Su, Chun-Ming Chen
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Patent number: 8422223Abstract: A multi-modular data center includes at least one modular computing module and at least one modular power supply module. The modular computing module includes a transportable container, a plurality of computing systems, a cooling system, a surveillance system, and a network interface. The modular power supply module includes a transportable container and a plurality of power supply systems. The transportable containers are configured for transport via a transport infrastructure. The plurality of computing systems is mounted within the transportable container. The cooling system is disposed in the transportable container. The surveillance system is configured to monitor the transportable container. The network interface is configured to interface between an Internet access connection and the computing systems. The plurality of power supply systems is mounted within the transportable container.Type: GrantFiled: August 19, 2010Date of Patent: April 16, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Tsung-Han Su, Chung-I Lee, Chun-Ming Chen
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Publication number: 20130043008Abstract: A cooling system for cooling an electronic device includes a first heat exchanger, a second heat exchanger, a third heat exchanger, a first refrigerant pipe, a second refrigerant pipe, and a pump. The first and second refrigerant pipes receive refrigerants, which can circulate in the first and second heat exchangers. The first heat exchanger is arranged in the electronic device for cooling the electronic device. The pump circulates the refrigerants. The third heat exchanger heats liquefied gas with sea water before the sea water enters the second heat exchanger. The second heat exchanger cools the refrigerants by the cooled sea water from the third heat exchanger.Type: ApplicationFiled: October 20, 2011Publication date: February 21, 2013Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: TSUNG-HAN SU, CHUN-MING CHEN
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Publication number: 20130031924Abstract: A cooling system for cooling an electronic device includes a first heat exchanger, a second heat exchanger, a first refrigerant pipe, a second refrigerant pipe, and a pump. The first and second refrigerant pipes receive refrigerants, which can circulate in the first and second heat exchangers. The first heat exchanger is arranged in the electronic device for cooling the electronic device. The second heat exchanger cools the refrigerants by gasifying liquefied gas. The pump circulates the refrigerants. The third heat exchanger heats the liquefied gas with sea water before the liquefied gas enters the second heat exchanger.Type: ApplicationFiled: October 13, 2011Publication date: February 7, 2013Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Tsung-Han SU, Chun-Ming CHEN
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Publication number: 20130025827Abstract: A cooling system for cooling an electronic device includes a first heat exchanger, a second heat exchanger, a first refrigerant pipe, a second refrigerant pipe, and a pump. The first and second refrigerant pipes receive refrigerants, which can circulate in the first and second heat exchangers. The first heat exchanger is arranged in the electronic device for cooling the electronic device. The second heat exchanger is used for cooling the refrigerants by gasifying liquefied gas. The pump is used for circulating the refrigerants.Type: ApplicationFiled: September 18, 2011Publication date: January 31, 2013Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: TSUNG-HAN SU, CHUN-MING CHEN
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Patent number: 8295982Abstract: A heat dissipation apparatus includes an air conditioning unit, a plurality of temperature sensors, a plurality of adjustable air outlet boards, a plurality of actuators, and a control unit. The temperature sensors determine the temperature of server racks. The adjustable air outlet boards guide airflow from the air conditioning device to the corresponding server racks. The actuator adjusts the corresponding adjustable air outlet board to alter the airflow to the corresponding server rack. The control unit receives the temperature detected by the temperature sensors to submit corresponding control signals, altering power supplied to the air conditioning unit and adjust the adjustable air outlet boards through the actuators. The present disclosure further provides a heat dissipation method and a container data center including the heat dissipation apparatus as disclosed.Type: GrantFiled: December 28, 2010Date of Patent: October 23, 2012Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Zeu-Chia Tan, Tsung-Han Su
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Publication number: 20120175088Abstract: The disclosure relates to a waste heat utilizing system for a container data center. The waste heat utilizing system includes a first heat exchanger received in and absorbing heat from the container data center, a water inlet pipe communicated with the first heat exchanger for supplying water to the first heat exchanger to exchange heat, a second pipe communicated with the first heat exchanger for removing heated water from the first heat exchanger, a second heat exchanger connected to the second pipe for dissipating heat of the heated water removed from the first heat exchanger, and a heat utilizing device receiving the second heat exchanger therein for absorbing the heat dissipated by the second heat exchanger. A third pipe is dipped into water container and connected to an outlet of the second heat exchanger, and water is flowed back to the water container via the third pipe.Type: ApplicationFiled: April 18, 2011Publication date: July 12, 2012Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: TSUNG-HAN SU, ZEU-CHIA TAN
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Publication number: 20120147543Abstract: A modular data center includes a container and a heat-dissipating control system. The container defines an opening with a cover rotatably mounted to the container to cover or uncover the opening when needed to assist in dissipating heat. The heat-dissipating control system includes a temperature sensor, a comparison unit, and a driving device. The temperature sensor is used to sense a temperature in the container, and output a sensed temperature value. The comparison unit is used to receive the sensed temperature value, and compare the sensed temperature value with a first predetermined temperature value. When the sensed temperature value is greater than or equal to the first predetermined temperature value, the comparison unit outputs a control signal. The driving device is used to open the cover to expose the opening after receiving the first control signal.Type: ApplicationFiled: December 21, 2010Publication date: June 14, 2012Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: TSUNG-HAN SU, ZEU-CHIA TAN, TAI-WEI LIN
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Publication number: 20120136488Abstract: A heat dissipation apparatus includes an air conditioning unit, a plurality of temperature sensors, a plurality of adjustable air outlet boards, a plurality of actuators, and a control unit. The temperature sensors determine the temperature of server racks. The adjustable air outlet boards guide airflow from the air conditioning device to the corresponding server racks. The actuator adjusts the corresponding adjustable air outlet board to alter the airflow to the corresponding server rack. The control unit receives the temperature detected by the temperature sensors to submit corresponding control signals, altering power supplied to the air conditioning unit and adjust the adjustable air outlet boards through the actuators. The present disclosure further provides a heat dissipation method and a container data center including the heat dissipation apparatus as disclosed.Type: ApplicationFiled: December 28, 2010Publication date: May 31, 2012Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: ZEU-CHIA TAN, TSUNG-HAN SU
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Publication number: 20120035772Abstract: An oxygen content adjustment apparatus includes an oxygen content detector, a number of keys, a controller, an oxygen source, a first nozzle, a first valve, a flame retardant gas source, a second nozzle, and a second valve. The controller is connected to the oxygen content detector and the keys. A first terminal of the first valve is connected to the controller. A second terminal of the first valve is connected to the oxygen source. A third terminal of the first valve is connected to the first nozzle. A first terminal of the second valve is connected to the controller. A second terminal of the second valve is connected to the flame retardant gas source. A third terminal of the second valve is connected to the second nozzle.Type: ApplicationFiled: September 20, 2010Publication date: February 9, 2012Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: TSUNG-HAN SU, CHUN-MING CHEN
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Publication number: 20120031633Abstract: A fire suppression apparatus includes a fire detector, a controller, a flame retardant gas source, a nozzle, and a valve. The fire detector detects fires in a container data center. An input of the controller is connected to the fire detector. An output of the controller is connected to a control terminal of the valve. An input of the valve is connected to the flame retardant gas source. An output of the valve is connected to the nozzle.Type: ApplicationFiled: September 20, 2010Publication date: February 9, 2012Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: TSUNG-HAN SU, CHUN-MING CHEN
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Publication number: 20120006507Abstract: A multi-modular data center includes at least one modular computing module and at least one modular power supply module. The modular computing module includes a transportable container, a plurality of computing systems, a cooling system, a surveillance system, and a network interface. The modular power supply module includes a transportable container and a plurality of power supply systems. The transportable containers are configured for transport via a transport infrastructure. The plurality of computing systems is mounted within the transportable container. The cooling system is disposed in the transportable container. The surveillance system is configured to monitor the transportable container. The network interface is configured to interface between an Internet access connection and the computing systems. The plurality of power supply systems is mounted within the transportable container.Type: ApplicationFiled: August 19, 2010Publication date: January 12, 2012Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Tsung-Han Su, Chung-I Lee, Chun-Ming Chen