Abstract: Some implementations described herein provide a semiconductor structure. The semiconductor structure includes a first conductive structure disposed within a first layer of the semiconductor structure. The semiconductor structure includes a dielectric structure disposed within a second layer of the semiconductor structure, with the second layer being disposed on the first layer. The semiconductor structure includes a second conductive structure disposed within a recessed portion of the dielectric structure that extends to the first conductive structure, with the second conductive structure having a concave recessed portion on a top surface of the second conductive structure. The semiconductor structure includes multiple layers of conductive material disposed within the concave recessed portion of the second conductive structure.

Abstract: A method and a system for mental index prediction are provided. The method includes the following steps. A plurality of images of a subject person are obtained. A plurality of emotion tags of the subject person in the images are analyzed. A plurality of integrated emotion tags in a plurality of predetermined time periods are calculated according to the emotion tags respectively corresponding to the images. A plurality of preferred features are determined according to the integrated emotion tags. A mental index prediction model is established according to the preferred features to predict a mental index according to the emotional index prediction model.

Abstract: A method for removing a heavy metal from water includes subjecting a microbial solution containing a liquid culture of a urease-producing bacterial strain and a reaction solution containing a manganese compound and urea to a microbial-induced precipitation reaction, so as to obtain biomineralized manganese carbonate (MnCO3) particles, admixing the biomineralized MnCO3 particles with water containing a heavy metal, so that the biomineralized MnCO3 particles adsorb the heavy metal in the water to form a precipitate, and removing the precipitate from the water.

Abstract: In order to reduce the occurrence of current alarms in a semiconductor etching or deposition process, a controller determines an offset in relative positions of a cover ring and a shield over a wafer within a vacuum chamber. The controller provides a position alarm and/or adjusts the position of the cover ring or shield when the offset is greater than a predetermined value or outside a range of acceptable values.

Abstract: A sealing structure is provided. The sealing structure is adapted to be disposed in an opening. The sealing structure includes a moveable block, a deformable bracket and an elastic member. When the moveable block is moved in a first direction, the deformable bracket pushes the elastic member, and the elastic member is deformed in a second direction and abuts the opening to seal the opening. The sealing structure is disposed in the opening to create a seal.

Abstract: A waterproof module includes a frame, a sliding member, a ring-shaped sealing member, a cover and an adjusting member. The frame has an accommodating recess. The sliding member is disposed in the accommodating recess and has a tapered structure. An end of the tapered structure is between the frame and the ring-shaped sealing member. The cover is disposed on the frame. The adjusting member is connected to the sliding member. When the adjusting member drives the sliding member to move within the accommodating recess towards a first direction, the tapered structure pushes the ring-shaped sealing member to move towards a second direction, wherein the first direction is different from the second direction.

Abstract: A charging station is provided herein for being adapted to bear an unmanned vehicle. The charging station includes a platform and a charging mechanism. The charging mechanism is disposed on the platform, and the charging mechanism may be electrically connected to the unmanned vehicle for charging by a movement over the platform. In addition, a charging station module including a plurality of the aforesaid charging stations is also provided.

Abstract: An LED illumination apparatus module includes a light-emitting component and a mounting base. The light-emitting component includes a load board, a wire, a circuit board, and one or more light-emitting diodes. The light-emitting diode is disposed on the load board, and the wire electrically connects the light-emitting diode and the circuit board. The mounting base includes an LED assembly portion and a frame. The LED assembly portion includes a mounting surface and the load board is fixed on the mounting surface. An end of the frame is connected to the mounting surface of the LED assembly portion. The frame includes a body portion and a circuit board fixing structure. The circuit board fixing structure is disposed on the body portion, and the circuit board is fixed to the circuit board fixing structure. The light-emitting components are mounted on the base in a modularized manner.

Abstract: A waterproof module includes a frame, a sliding member, a ring-shaped sealing member, a cover and an adjusting member. The frame has an accommodating recess. The sliding member is disposed in the accommodating recess and has a tapered structure. An end of the tapered structure is between the frame and the ring-shaped sealing member. The cover is disposed on the frame. The adjusting member is connected to the sliding member. When the adjusting member drives the sliding member to move within the accommodating recess towards a first direction, the tapered structure pushes the ring-shaped sealing member to move towards a second direction, wherein the first direction is different from the second direction.

Abstract: A shock absorbing structure includes at least one protruding column and at least one resilient module. The at least one protruding column is fixed on an electronic device and passes through a circuit board of the electronic device. The at least one resilient module is disposed between the at least one protruding column and the circuit board. When the electronic device is affected by an external shock load, the at least one resilient module is forced by the circuit board to be deformed for generating a resilient force. When the at least one resilient module is not forced by the circuit board any more, the resilient force generated by the at least one resilient module drives the circuit board to recover.

Abstract: A shock absorbing structure includes at least one protruding column and at least one resilient module. The at least one protruding column is fixed on an electronic device and passes through a circuit board of the electronic device. The at least one resilient module is disposed between the at least one protruding column and the circuit board. When the electronic device is affected by an external shock load, the at least one resilient module is forced by the circuit board to be deformed for generating a resilient force. When the at least one resilient module is not forced by the circuit board any more, the resilient force generated by the at least one resilient module drives the circuit board to recover.

Abstract: A charging station is provided herein for being adapted to bear an unmanned vehicle. The charging station includes a platform and a charging mechanism. The charging mechanism is disposed on the platform, and the charging mechanism may be electrically connected to the unmanned vehicle for charging by a movement over the platform. In addition, a charging station module including a plurality of the aforesaid charging stations is also provided.

Abstract: A plugging structure applied to an electronic device for detachably electrically connecting to a main unit is disclosed. The electronic device comprises a housing. The plugging structure comprises a cover and a circuit board. The cover plate has two transfer ports, and two transmitting ports are listed in the cover. The circuit board is disposed between the cover and the housing, and the circuit board connects to these transmitting ports.

Abstract: A supporting module includes a frame, a support and a rod. The frame includes a main portion, a first fastening portion and an elastic arm. The main portion has a groove. The first fastening portion and the elastic arm are disposed close to an end of the groove, and the first fastening portion and the elastic arm are disposed in the groove, wherein the first side and the second side are opposite to each other. The support has a first connection portion pivoted on the frame, and a second connection portion. The rod includes a bar portion, a pivotal portion and a movable portion. The pivotal portion and the movable portion are disposed on the bar portion. The pivotal portion is pivoted on the second connection portion. The movable portion is slidable in the groove, and the movable portion includes a second fastening portion.

Abstract: An electronic device with a flexible assembly, comprising a housing, a positioning assembly and a flexible display, is provided. The housing comprises a first cover plate, a second cover plate and a flexible assembly. The flexible assembly is bendably connected to the first and second cover plates, so that the first cover plate closes on the second cover plate or opens to a limit angle with respect to the second cover plate and then stops. The positioning assembly is disposed on the housing for positioning the first cover plate, the flexible assembly and the second cover plate in an open state or a closed state. When the first cover plate opens to the limit angle with respect to the second cover plate, the positioning assembly prevents the first cover plate from rotating in a reverse direction with respect to the second cover plate.

Abstract: A plugging structure applied to an electronic device for detachably electrically connecting to a main unit is disclosed. The electronic device comprises a housing. The plugging structure comprises a cover and a circuit board. The cover plate has two transfer ports, and two transmitting ports are listed in the cover. The circuit board is disposed between the cover and the housing, and the circuit board connects to these transmitting ports.

Abstract: An electronic device for presenting perceivable content(s) is provided. The electronic device includes a presentation unit, a control unit and an operating unit. The operating unit is electrically coupled to the control unit. According to the control of the control unit, the operating unit can present the perceivable content and communicate with an external electronic device.

Abstract: An electronic device includes an electronic module and a protective structure. A protective structure includes a first housing, a second housing and an elastic body. The first housing has a first side face, the first side face has a first normal direction. The second housing has a second side face, the second side face has a second normal direction. The second housing and the first housing are fixed with a fixing direction. A containing portion is formed between the first side face and the second side face, the first normal direction and the second normal direction un-parallel the fixing direction. The elastic body has a resisting portion, the resisting portion sets in the containing portion. The resisting portion abuts against the second side face.

Abstract: An assembly includes an electronic device casing, a heat-dissipating module and a waterproofing module. The electronic device casing is formed with an encircling wall. The encircling wall has a wall body and an apertured portion formed in the wall body. The heat-dissipating module is coupled to the electronic device casing, is surrounded by the encircling wall, and includes a heat pipe extending through the apertured portion. The waterproofing module includes a waterproofing element that has a ring portion disposed on a top rim of the wall body, and a sleeve portion having a first sleeve segment that is connected to the ring portion, that is sleeved on the heat pipe and that engages the apertured portion so as to establish water tightness between the heat pipe and the apertured portion.