Patents by Inventor Tsung-Hsien Yang
Tsung-Hsien Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9461209Abstract: A semiconductor light-emitting device includes a semiconductor stack comprising a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer, wherein the first semiconductor layer includes a periphery surface surrounding the active layer; a plurality of vias penetrating the semiconductor stack to expose the first semiconductor layer; and a patterned metal layer formed on the plurality of vias and covered the periphery surface of the first semiconductor layer.Type: GrantFiled: September 14, 2015Date of Patent: October 4, 2016Assignee: EPISTAR CORPORATIONInventors: Min-Yen Tsai, Chao-Hsing Chen, Tsung-Hsun Chiang, Wen-Hung Chuang, Bo-Jiun Hu, Tzu-Yao Tseng, Jia-Kuen Wang, Kuan-Yi Lee, Yi-Ming Chen, Chun-Yu Lin, Tsung-Hsien Yang, Tzu-Chieh Hsu, Kun-De Lin, Yao-Ning Chan, Chih-Chiang Lu
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Publication number: 20160141331Abstract: A light-emitting diode is provided. The light-emitting diode comprises: a first light-emitting structure, comprising: a first area; a second area; a first isolation path having an electrode isolation layer between the first area and the second area; an electrode contact layer covering the first area; and an electrical connecting structure covering the second area; wherein each of the first area and the second area sequentially comprises a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, and the electrode contact layer covers a sidewall of the first area.Type: ApplicationFiled: January 26, 2016Publication date: May 19, 2016Inventors: Tsung-Hsien YANG, Han-Min WU, Jhih-Sian WANG, Yi-Ming CHEN, Tzu-Ghieh HSU
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Patent number: 9337394Abstract: A semiconductor light-emitting device comprises a semiconductor stack comprising a side, a first surface and a second surface opposite to the first surface, wherein the semiconductor stack further comprises a conductive via extending from the first surface to the second surface; a transparent conductive layer formed on the second surface; a first pad portion and a second pad portion formed on the first surface and electrically connected to the semiconductor stack; and an insulating layer formed between the first pad portion and the semiconductor stack and between the second pad portion and the semiconductor stack.Type: GrantFiled: November 26, 2014Date of Patent: May 10, 2016Assignee: Epistar CorporationInventors: Yi-Ming Chen, Chun-Yu Lin, Tsung-Hsien Yang, Tzu-Chieh Hsu, Kun-De Lin, Yao-Ning Chan, Chih-Chiang Lu
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Patent number: 9281443Abstract: The application provides a light-emitting diode array, including: a first light-emitting diode including a first area; a second area; a first isolation path between the first area and the second area, and the first isolation path including an electrode isolation layer; and an electrode contact layer covering the first area; a second light-emitting diode including a semiconductor stack layer; and a second electrical bonding pad on the semiconductor stack layer; and a second isolation path between the first light-emitting diode and the second light-emitting diode, wherein the second isolation path includes an electrical connecting structure electrically connected to the first light-emitting diode and the second light-emitting diode.Type: GrantFiled: August 6, 2013Date of Patent: March 8, 2016Assignee: EPISTAR CORPORATIONInventors: Tsung-Hsien Yang, Han-Min Wu, Jhih-Sian Wang, Yi-Ming Chen, Tzu-Ghieh Hsu
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Patent number: 9257481Abstract: An LED array includes: a first LED unit having a first active layer and a first side; a second LED unit having a second active layer and a second side facing the first side; a trench separating the first LED unit from the second LED unit; and a light-guiding structure formed between the first LED unit and the second LED unite for guiding the light emitted by the first active layer and the second active layer away from the LED array.Type: GrantFiled: November 26, 2012Date of Patent: February 9, 2016Assignee: EPISTAR CORPORATIONInventors: Tsung Hsien Yang, Yi Tang Lai, Yao Ning Chan
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Publication number: 20160005941Abstract: A semiconductor light-emitting device includes a semiconductor stack comprising a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer, wherein the first semiconductor layer includes a periphery surface surrounding the active layer; a plurality of vias penetrating the semiconductor stack to expose the first semiconductor layer; and a patterned metal layer formed on the plurality of vias and covered the periphery surface of the first semiconductor layer.Type: ApplicationFiled: September 14, 2015Publication date: January 7, 2016Inventors: Min-Yen Tsai, Chao-Hsing Chen, Tsung-Hsun Chiang, Wen-Hung Chuang, Bo-Jiun Hu, Tzu-Yao Tseng, Jia-Kuen Wang, Kuan-Yi Lee, Yi-Ming Chen, Chun-Yu Lin, Tsung-Hsien Yang, Tzu-Chieh Hsu, Kun-De Lin, Yao-Ning Chan, Chih-Chiang Lu
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Publication number: 20150349848Abstract: A device may include a memory for storing a set of instructions associated with at least one of an orientation and a position of the device. The device may also include a near field communication (NFC) transceiver for pairing the device with a second device. A processor in the device determines that the device is paired with the second device via the NFC transceiver; determines at least one of the orientation and the position of the device; and executes the set of instructions associated with at least one of the determined orientation and position of the device.Type: ApplicationFiled: May 29, 2014Publication date: December 3, 2015Applicant: SYMBOL TECHNOLOGIES, INC.Inventors: Tsung-Hsien Yang, Hughes Cheng, Ching-Rung Lee, Michael A. Tramontano
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Publication number: 20150144984Abstract: A semiconductor light-emitting device comprises a semiconductor stack comprising a side, a first surface and a second surface opposite to the first surface, wherein the semiconductor stack further comprises a conductive via extending from the first surface to the second surface; a transparent conductive layer formed on the second surface; a first pad portion and a second pad portion formed on the first surface and electrically connected to the semiconductor stack; and an insulating layer formed between the first pad portion and the semiconductor stack and between the second pad portion and the semiconductor stack.Type: ApplicationFiled: November 26, 2014Publication date: May 28, 2015Inventors: Yi-Ming CHEN, Chun-Yu LIN, Tsung-Hsien YANG, Tzu-Chieh HSU, Kun-De LIN, Yao-Ning CHAN, Chih-Chiang LU
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Publication number: 20150137169Abstract: A semiconductor light-emitting device comprises a semiconductor stack having a first surface, wherein the first surface comprises multiple protrusion portions and multiple concave portions; a first electrode on the first surface and electrically connecting with the semiconductor stack; a second electrode on the first surface and electrically connecting with the semiconductor stack; and a transparent conduction layer conformally covering the first surface and between the first electrode and the semiconductor stack, wherein the first electrode comprises a first bonding portion and a first extending portion, and the first extending portion is between the first bonding portion and the transparent conduction layer and conformally covers the transparent conduction layer.Type: ApplicationFiled: November 18, 2014Publication date: May 21, 2015Inventors: Yi-Ming CHEN, Tsung-Hsien YANG
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Patent number: 8936957Abstract: The present disclosure discloses a method of manufacturing a light-emitting device comprising the steps of providing a light-emitting wafer having a semiconductor stacked structure and an alignment mark, sensing the alignment mark, and separating the light-emitting wafer into a plurality of light-emitting diodes and removing the alignment mark accordingly.Type: GrantFiled: December 24, 2013Date of Patent: January 20, 2015Assignee: Epistar CorporationInventor: Tsung-Hsien Yang
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Patent number: 8852974Abstract: A method for manufacturing semiconductor light-emitting devices comprising the steps of: providing a multi-layer semiconductor film comprising a surface; roughening the surface of the multi-layer semiconductor film to form a scattering surface; re-growing a semiconductor layer on the scattering surface; and roughening the semiconductor layer to form a sub-scattering portion on the scattering surface; wherein the sub-scattering portion is structurally smaller than the scattering surface.Type: GrantFiled: December 6, 2012Date of Patent: October 7, 2014Assignee: Epistar CorporationInventors: Chien-Fu Huang, Yi-Ming Chen, Yi-Tang Lai, Chia-Liang Hsu, Tsung-Hsien Yang, Tzu-Chieh Hsu
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Publication number: 20140225138Abstract: A light-emitting device is disclosed and comprises: a transparent substrate; a semiconductor light-emitting stack on the transparent substrate, wherein the semiconductor light-emitting stack comprises a first semiconductor layer close to the transparent substrate, a second semiconductor layer away from the transparent substrate, and a light-emitting layer capable of emitting a light disposed between the first semiconductor layer and the second semiconductor layer; and a bonding layer between the transparent substrate and the semiconductor light-emitting stack, wherein the bonding layer has a gradually changed refractive index, and each of critical angles at the bonding layer and the transparent substrate for the light emitted from the light-emitting layer towards the transparent substrate is larger than 35 degrees.Type: ApplicationFiled: February 6, 2014Publication date: August 14, 2014Applicant: Epistar CorporationInventors: Tsung-Hsien YANG, Tzu-Chieh HSU, Yi-Ming CHEN, Yi-Tang LAI, Jhih-Jheng YANG, Chih-Wei WEI, Ching-Sheng CHEN, Shih-I CHEN, Chia-Liang HSU, Ye-Ming HSU
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Publication number: 20140186976Abstract: The present disclosure discloses a method of manufacturing a light-emitting device comprising the steps of providing a light-emitting wafer having a semiconductor stacked structure and an alignment mark, sensing the alignment mark, and separating the light-emitting wafer into a plurality of light-emitting diodes and removing the alignment mark accordingly.Type: ApplicationFiled: December 24, 2013Publication date: July 3, 2014Applicant: EPISTAR CORPORATIONInventor: Tsung-Hsien YANG
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Publication number: 20140162386Abstract: A method for manufacturing semiconductor light-emitting devices comprising the steps of: providing a multi-layer semiconductor film comprising a surface; roughening the surface of the multi-layer semiconductor film to form a scattering surface; re-growing a semiconductor layer on the scattering surface; and roughening the semiconductor layer to form a sub-scattering portion on the scattering surface; wherein the sub-scattering portion is structurally smaller than the scattering surface.Type: ApplicationFiled: December 6, 2012Publication date: June 12, 2014Applicant: Epistar CorporationInventors: Chien-Fu HUANG, Yi-Ming Chen, Yi-Tang Lai, Chia-Liang Hsu, Tsung-Hsien Yang, Tzu-Chieh Hsu
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Publication number: 20140145222Abstract: An LED array includes: a first LED unit having a first active layer and a first side; a second LED unit having a second active layer and a second side facing the first side; a trench separating the first LED unit from the second LED unit; and a light-guiding structure formed between the first LED unit and the second LED unite for guiding the light emitted by the first active layer and the second active layer away from the LED array.Type: ApplicationFiled: November 26, 2012Publication date: May 29, 2014Applicant: Epistar CorporationInventors: Tsung Hsien YANG, Yi Tang LAI, Yao Ning CHAN
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Publication number: 20140034977Abstract: The application provides a light-emitting diode array, including: a first light-emitting diode including a first area; a second area; a first isolation path between the first area and the second area, and the first isolation path including an electrode isolation layer; and an electrode contact layer covering the first area; a second light-emitting diode including a semiconductor stack layer; and a second electrical bonding pad on the semiconductor stack layer; and a second isolation path between the first light-emitting diode and the second light-emitting diode, wherein the second isolation path includes an electrical connecting structure electrically connected to the first light-emitting diode and the second light-emitting diode.Type: ApplicationFiled: August 6, 2013Publication date: February 6, 2014Applicant: Epistar CorporationInventors: Tsung-Hsien YANG, Han-Min WU, Jhih-Sian WANG, Yi-Ming CHEN, Tzu-Ghieh HSU
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Patent number: 8605749Abstract: A frame-merging method is adapted for a network that includes mesh and terminal units, in which any two units capable of communication form a communication pair, and one of the units operates as a key unit to transmit pending frames according to the frame-merging method. The frame-merging method includes: determining whether the key unit is a mesh or a terminal unit; for the communication pair recorded in each pending frame, selecting a suitable scheme from a plurality of frame-merging schemes, and extracting at least one of the pending frames from among the pending frames for use as part or all of a priority frame set; and comparing a total size of all frames included in the priority frame set with a suitable frame size, so as to determine whether the key unit is to send an aggregated frame. A frame-merging apparatus is also disclosed.Type: GrantFiled: June 29, 2009Date of Patent: December 10, 2013Assignee: Realtek Semiconductor Corp.Inventors: Tsung-Hsien Yang, Chia-Yu Ku, Ying-Dar Lin
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Publication number: 20130214294Abstract: A light-emitting device comprises a support base having a planar surface, a semiconductor stacked structure disposed on the planar surface, the semiconductor stacked structure comprising a first semiconductor layer, an active layer, a second semiconductor layer, a current block region formed in one of the first semiconductor layer and the second semiconductor layer and physically contacts the planar surface and an electrode disposed on the semiconductor stacked structure.Type: ApplicationFiled: February 17, 2012Publication date: August 22, 2013Applicant: EPISTAR CORPORATIONInventor: Tsung-Hsien YANG
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Publication number: 20100142555Abstract: A frame-merging method is adapted for a network that includes mesh and terminal units, in which any two units capable of communication form a communication pair, and one of the units operates as a key unit to transmit pending frames according to the frame-merging method. The frame-merging method includes: determining whether the key unit is a mesh or a terminal unit; for the communication pair recorded in each pending frame, selecting a suitable scheme from a plurality of frame-merging schemes, and extracting at least one of the pending frames from among the pending frames for use as part or all of a priority frame set; and comparing a total size of all frames included in the priority frame set with a suitable frame size, so as to determine whether the key unit is to send an aggregated frame. A frame-merging apparatus is also disclosed.Type: ApplicationFiled: June 29, 2009Publication date: June 10, 2010Inventors: Tsung-Hsien YANG, Chia-Yu Ku, Ying-Dar Lin
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Publication number: 20070118683Abstract: An apparatus for updating a television firmware and the method therefor are provided. The television includes a first processor and a first memory unit. The first memory unit is for storing a television firmware. The television firmware updating apparatus includes a second memory unit and a second processor. The second memory unit stores an updating firmware. After the second processor handshakes with the first processor, the second processor reads and encodes a chosen block data of the updating firmware to output an encoded signal. The first processor decodes the encoded signal to generate a chosen block data and write the chosen block data to the first memory unit until all the block data of the updating firmware are written to the first memory unit.Type: ApplicationFiled: May 11, 2006Publication date: May 24, 2007Inventors: Tsung-Hsien Yang, Sheng-Min Hsu, Yu-Lin Lo, Juei-Long Lee