Patents by Inventor Tsung-Hsuan CHIANG

Tsung-Hsuan CHIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11929318
    Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
  • Patent number: 11458533
    Abstract: A measuring device includes a furnace, a draining vessel, a loader and a computing system for physical properties. The draining vessel with molten metal fluid is in the furnace. The loader accumulates the molten metal fluid from the draining vessel. The computing system includes a recording unit, transform unit, computing unit and processor. The recording unit records the vessel information. By the assumed physical parameters and the vessel information, the transform unit transforms a weight of the molten metal fluid in the loader into a first length criterion, and the computing unit simulates the flowing of the molten metal fluid to have a second length criterion. The processor minimizes the difference of the first and the second length criterion by changing the assumed physical parameters. The physical properties of the molten metal fluid are determined when the difference is minimized.
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: October 4, 2022
    Assignee: National Central University
    Inventors: Chih-Ang Chung, Ya-Huan Lee, Tsung-Han Chuang, Tsung-Hsuan Chiang, Chih-Shan Yen, Jeng-Rong Ho, Jason Shian-Ching Jang
  • Publication number: 20210060637
    Abstract: A measuring device includes a furnace, a draining vessel, a loader and a computing system for physical properties. The draining vessel with molten metal fluid is in the furnace. The loader accumulates the molten metal fluid from the draining vessel. The computing system includes a recording unit, transform unit, computing unit and processor. The recording unit records the vessel information. By the assumed physical parameters and the vessel information, the transform unit transforms a weight of the molten metal fluid in the loader into a first length criterion, and the computing unit simulates the flowing of the molten metal fluid to have a second length criterion. The processor minimizes the difference of the first and the second length criterion by changing the assumed physical parameters. The physical properties of the molten metal fluid are determined when the difference is minimized.
    Type: Application
    Filed: September 2, 2020
    Publication date: March 4, 2021
    Inventors: Chih-Ang CHUNG, Ya-Huan LEE, Tsung-Han CHUANG, Tsung-Hsuan CHIANG, Chih-Shan YEN, Jeng-Rong HO, Jason Shian-Ching JANG