Patents by Inventor Tsung-Hsuan Chiu

Tsung-Hsuan Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7003195
    Abstract: A dynamic power equalizer comprises an array waveguide grating having an input waveguide and an output waveguide at one end, and an input waveguide group and an output waveguide group at the other end. The double loops are composed of the input waveguide and the output waveguide group, and the input waveguide group and the output waveguide are used to process the input optical signal components having different powers into the output optical signal having a single and equalized optical power through wavelength-division de-multiplexing and wavelength-division multiplexing, thus achieving dynamic optical power equalization.
    Type: Grant
    Filed: April 6, 2005
    Date of Patent: February 21, 2006
    Assignee: Industrial Technology Research Institute
    Inventors: Ding-Wei Huang, Shih-Jung Chang, Tsung-Hsuan Chiu
  • Patent number: 6912344
    Abstract: A thermo-optic wave-guide switch. The switch selectively switches the paths of an optical signal. The thermo-optic wave-guide switch includes a multi-mode wave-guide having an input port, a first output port and a second output port, and a thin film heater formed on the side of the multi-mode wave-guide. When the thin film heater does not provide the multi-mode wave-guide with heat and a signal is received by the input port, the first output port outputs the signal in a cross state according to the self-image theorem, and when the thin film heater provides the multi-mode wave-guide with heat and a signal is received by the input port, the second output port outputs the signal in a bar state.
    Type: Grant
    Filed: May 6, 2002
    Date of Patent: June 28, 2005
    Assignee: Industrial Technology Research Institute
    Inventors: King-Chang Shu, Ding-Wei Huang, Tsung-Hsuan Chiu, Yinchieh Lai
  • Publication number: 20030099421
    Abstract: A thermo-optic wave-guide switch. The switch selectively switches the paths of an optical signal. The thermo-optic wave-guide switch includes a multi-mode wave-guide having an input port, a first output port and a second output port, and a thin film heater formed on the side of the multi-mode wave-guide. When the thin film heater does not provide the multi-mode wave-guide with heat and a signal is received by the input port, the first output port outputs the signal in a cross state according to the self-image theorem, and when the thin film heater provides the multi-mode wave-guide with heat and a signal is received by the input port, the second output port outputs the signal in a bar state.
    Type: Application
    Filed: May 6, 2002
    Publication date: May 29, 2003
    Inventors: King-Chang Shu, Ding-Wei Huang, Tsung-Hsuan Chiu, Yinchieh Lai
  • Patent number: 6560380
    Abstract: Along with several few-channel and low-density wavelength division multiplexer/de-multiplexer, a novel planar lightwave circuit (PLC) interleaver is invented to achieve high-density wavelength division multiplexing and de-multiplexing in a wavelength division multiplexing fiber communication system. The invention uses a PLC as its basic structure and applies the principle that the product of the number of output optical waveguides and the channel spacing is equal to the free spectral range of the spectrum of any output optical waveguide to make a compact PLC interleaver.
    Type: Grant
    Filed: June 25, 2001
    Date of Patent: May 6, 2003
    Assignee: Industrial Technology Research Institute
    Inventors: Ding-Wei Huang, Tsung-Hsuan Chiu, Yin-Chieh Lai
  • Patent number: 6511235
    Abstract: The present invention pertains to an integrated surface-emitting optoelectronic module and the method for making the same. The yellow light procedure is performed to define a V-groove width for disposing an optical fiber on a silicon substrate. After dry etching a vertical groove, a dielectric layer is grown on the surface of the silicon substrate to protect the vertical wall, preventing the groove from getting wider due to subsequent wet etching. A 45-degree mirror surface is formed so that an optoelectronic device can be disposed on the mirror surface in the flip chip method. The optoelectronic module employs a complete silicon substrate to assemble a surface-emitting optoelectronic devices and an optical fiber by passive alignment, and therefore can be free from misalignment due to separate assembly.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: January 28, 2003
    Assignee: Industrial Technology Research Institute
    Inventors: Weng-Jin Wu, Yih-Der Guo, Tsung-Hsuan Chiu, Rong-Heng Yuang, Mu-Tao Chu
  • Publication number: 20020159675
    Abstract: Along with several few-channel and low-density wavelength division multiplexer/de-multiplexer, a novel planar lightwave circuit(PLC) interleaver is invented to achieve high-density wavelength division multiplexing and de-multiplexing in a wavelength division multiplexing fiber communication system. The invention uses a PLC as its basic structure and applies the principle that the product of the number of output optical waveguides and the channel spacing is equal to the free spectral range of the spectrum of any output optical waveguide to make a compact PLC interleaver.
    Type: Application
    Filed: June 25, 2001
    Publication date: October 31, 2002
    Inventors: Ding-Wei Huang, Tsung-Hsuan Chiu, Yin-Chieh Lai
  • Publication number: 20020037137
    Abstract: The present invention pertains to an integrated surface-emitting optoelectronic module and the method for making the same. The yellow light procedure is performed to define a V-groove width for disposing an optical fiber on a silicon substrate. After dry etching a vertical groove, a dielectric layer is grown on the surface of the silicon substrate to protect the vertical wall, preventing the groove from getting wider due to subsequent wet etching. A 45-degree mirror surface is formed so that an optoelectronic device can be disposed on the mirror surface in the flip chip method. The optoelectronic module employs a complete silicon substrate to assemble a surface-emitting optoelectronic devices and an optical fiber by passive alignment, and therefore can be free from misalignment due to separate assembly.
    Type: Application
    Filed: December 19, 2000
    Publication date: March 28, 2002
    Inventors: Wing-Jin Wu, Yih-Der Guo, Tsung-Hsuan Chiu, Rong-Heng Yuang, Mu-Tao Chu