Abstract: An optical connector assembly (2) has two optical connectors (3) and a combiner (5). Each optical connector has a connector body (30) with an angled latching arm (4) formed on the connector body. The latching arm has a fixed end (41) on the connector body and a free distal end. A groove (430) is defined on the distal end. The combiner has a combiner body (6) holding the optical connectors and a cantilevered trigger arm (7). The trigger arm has a fixed end on the combiner body and a free distal end. A rod (72) is formed on the distal end of the trigger arm, and is received in the grooves of the optical connectors.

Abstract: A flipping algorithm for the hardware realization of Lifting-based DWT, relates a flipping algorithm and hardware architecture for the hardware realization of Lifting-based DWT, by using lifting architecture as starting point, by multiplying the edge of the cutset which is through the multiplier and the basic computing unit by the reciprocal of multiplier coefficient in order to cut off the accumulation effect of timing delay.

Abstract: An optical package structure (2) includes a cover (21) defining an aperture (212) in a top portion for transmission of optical signals, a lens part (22) secured to the cover and a base member (23) combining with the cover to define a closed space in which to package optical components. A plurality of solder pads (2311-2314, 2391-2394, 2391′, 2392′) is provided on both a top and a bottom surfaces (2321,2342) of the base member, and a plurality of inner conductive traces (236,239) extends through the base member and provides an electrical connection of the solder pads on the top surface to the solder pads on the bottom surface. All the solder pads on the top surface are connected to a complementary solder pad located along a first side edge of the bottom surface, and at least one of the solder pads on the top surface is electrically connected to one of the solder pads on the bottom surface, which is not located along the first side edge.

Abstract: An optoelectronic package (10) includes a base substrate (40), a plurality of solder pads (21) and a can (30). The base substrate includes a mounting seat (41) laminated first and second layer (421,422). The solder pads (21) respectively attach to a top surface (412) and a bottom surface (4212) of the base substrate and are electrically interconnected with each other via conductive material filled the through-holes (411,4223,4213) and conductor trace (45,45′). Optoelectronic components (not shown) are attached to the top surface of the base substrate and make electrical connection with the solder pads. The can includes a transparent device (31), an metal enclosure (32) and a housing (33), which hermetically seals to the base substrate protecting the optoelectronic components.

Abstract: An optical package structure (2) includes a cover (21) with a lens part (22), and a base member (23) which combines with the cover to define a closed space in which to package optical components. The base member has a bottom panel (232) and a substrate (234). A plurality of solder pads (231, 237) is provided on a top and bottom surfaces (2321, 2342) of the bottom panel and of the substrate. The solder pads on the top surface electrically connect with the optical components. A plurality of inner conductive traces (236, 238) is provided through the bottom panel and the substrate which electrically connect the solder pads on the top surface of the bottom panel with corresponding solder pads on the bottom surface of the substrate via printed circuits (235) on the substrate. Thus, an external electrical connection of the optical components is attained without wires and electrical pins.

Abstract: A method for reading flash memory cell with SONOS structure is disclosed. The flash memory cell with SONOS structure includes a P-well in a substrate, a tunneling oxide layer on the substrate, a charge trapping layer on the tunneling oxide layer, a dielectric layer on the charge trapping layer, a gate conductive layer on the dielectric layer, and source and drain regions in the substrate adjacent to the gate conductive layer. The flash memory cell with SONOS structure is read by applying a positive voltage to the drain region, floating the source region, grounding the P-well to generate gate induced drain leakage current and determining the gate induced drain leakage from the drain region to read the data in the memory cell.

Abstract: A method for manufacturing a semiconductor laser package in accordance with a preferred embodiment of the present invention includes the following steps: providing a housing (20) with a top portion (21), the top portion defining an optical cavity (23) composed of a window (231) and a sprue (232); disposing the housing in a cavity of a mold (not shown); closing the mold and injecting a melted transparent plastic resin into the sprue to fill the sprue and the window, thereby forming an integrated optical element; and taking the package out of the mold after curing of the injected plastic resin. The optical element is integrated with the housing, permitting light to pass therethrough. The package has a strong structure and is not as easily damaged when subjected to impacts. The optical element is made of a plastic material which is comparatively inexpensive. Therefore, the manufacturing cost is further reduced.

Abstract: A lens cap (40) for a transistor outline package includes a lens part (3) and a hollow main part (2) adapted for receiving optoelectronic components. The lens part includes a ball lens (30) having a first groove (27) and a sprue filling portion (31) having a second groove (25). The main part defines an opening (23) which comprises a ball lens receiving hole (231) and a sprue (232). A protruding sidestep (24) is formed along an inner surface of the sprue. The lens part is firmly coupled to the main part through engagement of the protruding sidestep with the second groove and a circular rim (26) of the main part with the first groove. The lens cap is manufactured by insert molding the lens part in the opening, with an injection hole (53) feeding into the sprue. Thus, gluing is avoided, and the ball lens optics are consistently good.

Abstract: A laser diode (LD) module includes a base (20), a four contacts (21), (22), (23) and (24) and package sealing material (25). The base is made of a metal material has three through holes (203), and defines a channel (204) in a bottom side thereof and in communication with the through holes. The four contacts, one is soldered to the base, and the others three inserted through the three through holes. The insulative package sealing material is plastic inserted molded into the channel and connecting through holes to fix the three contacts in the base while preventing electrical connection between the base and the contacts.

Abstract: Disclosed is a method for manufacturing a lens cap (20) for an optical module. The lens cap includes a housing (21) and an optical lens (22). The housing includes a sidewall (23) and a top wall (24) connecting with the sidewall. The top wall has an inclined portion (241) defining a through-hole (243) therein, and the through-hole includes a window (244) and an injection void (245) connecting with the window. The optical lens is made of optical plastic and is formed in the through-hole using insert-molding. The optical lens transmits and reflects light.

Abstract: A lens cap (40) in accordance with a preferred embodiment of the present invention for a semiconductor laser package (not shown) includes an optical element (31) made of a plastic material and a housing (20). The housing includes a top portion (21), a cylindrical sidewall (25) and an annular flange 22. An opening (23) is defined in the top portion. A ridge (24) is formed along an edge of the opening and protrudes into the opening. The optical element is insert molded into the housing, providing a strong structure which is not easily damaged, while still allowing transmittal of light through the opening. Since the optical element is made of a plastic material, the lens cap is comparatively inexpensive.

Abstract: A lens cap (20) for an optical module includes a housing (21) and an optical lens (22). The housing includes a sidewall (23) and a top wall (24) connecting with the sidewall. The top wall has an inclined portion (241) defining a through-hole (243) therein, and the through-hole includes a window (244) and an injection void (245) connecting with window. The optical lens is made of optical plastic and is formed in the through-hole using insert-molding. The optical lens transmits and reflects light.

Abstract: A pluggable optoelectrical transceiver module (99) is adapted to be retained in a metal cage (5). The optoelectrical transceiver module comprises a receptacle (3), a housing (4) covering a front portion (10) of the receptacle, and a releasing mechanism (2). A triangular latch (11) extends from the receptacle and engages with a retaining tab of the cage. A driving device (2) of the releasing mechanism is rotatably attached to the front portion of the receptacle, and moves an ejector (21) forward and rearward. When the driving device is pulled forward, the ejector slides rearward in the receptacle, unlatching the triangular latch from the cage.

Abstract: A transceiver module which is easily and conveniently assembled, and which is reliable. The transceiver module comprises a housing, an optoelectronic subassembly, a receptacle, a chassis and a PCB. The optoelectronic subassembly is received in the receptacle. Conductive leads of the optoelectronic subassembly are soldered to the PCB. The chassis is attached to the PCB with screws, and accommodates and protects the PCB. The housing comprises a top housing and a bottom housing. The top housing is attached to the chassis and the receptacle. The top housing and bottom housings are attached together, enclosing therein the receptacle, the chassis and the PCB.

Abstract: A method of manufacturing a lens cap (40) for a transistor outline package includes the steps of: (a) providing a main part (2) of the lens cap; (b) providing an upper and lower molds (51, 52) and putting the main part into the molds; (c) closing the molds and insert molding a lens part (3). The product lens cap includes the lens part and the hollow main part, which is adapted for receiving optoelectronic components. The formed lens part includes a ball lens (30) and a sprue filling portion (31). The main part defines an opening (23), which includes a ball lens receiving hole (231) and a sprue (232). During the insert molding part of the process, the melted lens part material is injected through an injection hole (53) into the sprue, and then flows into the ball lens receiving hole, assuring good optical quality of the ball lens.

Abstract: A system and method for collecting production information from punch machines (11) at shop floors and for monitoring production performed by the punch machines. The system comprises information collectors (12), a monitoring computer (14) and a database (16). Each information collector is attached to a corresponding punch machine, and obtains real-time production information. The monitoring computer is located remotely from the shop floors, and is respectively connected with the information collectors and the database via first and second communication links (13, 18). The monitoring computer is used for obtaining the information obtained by the information collectors according to pre-installed information obtaining instructions, and for storing the obtained information in the database. The database also stores fundamental data set by users. Therefore, users can know and control real-time production status of all shop floors at personal computers (17) connected to the database via the second communication link.

Abstract: An optical transceiver module comprises a base (1), a pair of metallic releasable latches (4) attached to opposite lateral sides of the base, and a housing. The housing includes an upper housing (71) and a lower housing (72), which are mounted to an upper side and a lower side of the base respectively. Each latch includes a retention portion (41), and a spring portion (42) bent generally perpendicularly from an outer end of the retention portion. The retention portions of the latches are inserted into receiving grooves (17) defined in side walls (14, 15) of the base. The spring portions of the latches sit on the side steps (152) of the base. The upper housing electrically engages with rear parts of the spring portions. Any electrostatic charge that develops on the upper and lower housings is dissipated to external ground via the latches.

Abstract: An optical subassembly includes an optical sleeve (1), a lens holder (2) having a cylindrical cavity (21) defined therein, and an optical element (4) received in the cavity. A stepped fixing hole (11) is longitudinally defined through the optical sleeve, for receiving an optical connector. The lens holder includes the cavity, a lens member (3), and a cylindrical protuberance (23) extending from a top surface of the lens holder. The protuberance is coupled into the fixing hole to ensure precise alignment of the optical connector, an optical axis of the lens member and the optical element. The optical sleeve is readily detachable from the lens holder. Therefore, when the optical connector needs to be changed to another kind of optical connector, the original optical sleeve can be replaced with a new suitable optical sleeve. The same lens holder can continue to be used.