Abstract: A package structure includes a package substrate, a first semiconductor package and a second semiconductor package, an underfill material, a gap filling structure and a heat dissipation structure. The first semiconductor package and the second semiconductor package are electrically bonded to the package substrate. The underfill material is disposed to fill a first space between the first semiconductor package and the package substrate and a second space between the second semiconductor package and the package substrate. The gap filling structure is disposed over the package substrate and in a first gap laterally between the first semiconductor package and the second semiconductor package. The heat dissipation structure is disposed on the package substrate and attached to the first semiconductor package and the second semiconductor package through a thermal conductive layer.

Abstract: A hard water-repellent structure and a method for fabricating the same are provided. The method adopts an atmospheric pressure plasma deposition (APPD) technique to form a hard coating having a rough surface on a substrate, and form a water-repellent coating on the rough surface. Because the hard water-repellent structure includes the hard coating and the water-repellent coating, hardness, abrasion-resistance, transparency and hydrophobicity of the hard water-repellent structure are improved. The hard water-repellent structure protects the substrate from friction. Moreover, because the disclosure adopts the APPD technique to form the hard water-repellent structure, the cost of production is reduced dramatically. Thus, the disclosure can solve drawbacks of prior art.

Abstract: A method of adjusting a surface characteristic of a substrate is provided, which includes the following steps. A substrate is provided. An atmosphere pressure plasma process is performed on the surface of the substrate to form a film layer on the surface of the substrate, so as to adjust the surface energy of the substrate, wherein a process gas of the atmosphere pressure plasma process includes a surface modifying precursor, a carrier gas and a plasma ignition gas. In particular, the surface modifying precursor is selected from fluorosilane, polysiloxane and a combination thereof, and the ratio of fluorosilane to polysiloxane is between 0 and 1.

Abstract: A water-repellent structure and a method for fabricating the same are provided. The method adopts an atmospheric pressure plasma deposition (APPD) technique to form a hardened coating having a rough surface on a substrate, and form a water-repellent coating on the rough surface. Because the water-repellent structure includes the hardened coating and the water-repellent coating, hardness, abrasion-resistance, transparency and hydrophobicity of the water-repellent structure are improved. The hard water-repellent structure protects the substrate from friction. Moreover, because the present invention adopts the APPD technique to form the water-repellent structure, the cost of production is reduced dramatically. Thus, the present invention can solve drawbacks of prior art.