Abstract: A package structure includes a package substrate, a first semiconductor package and a second semiconductor package, an underfill material, a gap filling structure and a heat dissipation structure. The first semiconductor package and the second semiconductor package are electrically bonded to the package substrate. The underfill material is disposed to fill a first space between the first semiconductor package and the package substrate and a second space between the second semiconductor package and the package substrate. The gap filling structure is disposed over the package substrate and in a first gap laterally between the first semiconductor package and the second semiconductor package. The heat dissipation structure is disposed on the package substrate and attached to the first semiconductor package and the second semiconductor package through a thermal conductive layer.

Abstract: The present invention discloses an electrical control light valve apparatus having liquid gallium. The invention comprises the transparent glass as a substrate, ITO transparent conductive film as the electrodes, the liquid gallium as the valve located on the ITO transparent conductive film, and the partial-transparent glass is located on the top of the electrical control light valve apparatus.

Abstract: The present invention discloses an electrical control light valve apparatus having liquid gallium. The invention comprises the transparent glass as a substrate, ITO transparent conductive film as the electrodes, the liquid gallium as the valve located on the ITO transparent conductive film, and the partial-transparent glass is located on the top of the electrical control light valve apparatus.