Abstract: A layer stack including a first bonding dielectric material layer, a dielectric metal oxide layer, and a second bonding dielectric material layer is formed over a top surface of a substrate including a substrate semiconductor layer. A conductive material layer is formed by depositing a conductive material over the second bonding dielectric material layer. The substrate semiconductor layer is thinned by removing portions of the substrate semiconductor layer that are distal from the layer stack, whereby a remaining portion of the substrate semiconductor layer includes a top semiconductor layer. A semiconductor device may be formed on the top semiconductor layer.

Abstract: A display device includes first and second display modules and first and second turning pieces that include a first coupling piece, a first turning piece, a second turning piece, and a third turning piece, a second coupling piece and a guiding device. When the first and second display modules are switched between folding and unfolding, the first turning piece pivots relative to the first coupling piece and the second turning piece, and the third turning piece pivots relative to the second coupling piece and the second turning piece. When the display module is switched from folded to unfolded, the other side of the first display module relative to the side is pulled, the side of the first display module is guided by one end of the guiding device and slides to the other end, the first and second display modules are symmetrically unfolded with the side edge as the center.

Abstract: A semiconductor structure includes a substrate with a first surface and a second surface opposite to the first surface, a first and a second shallow trench isolations disposed in the substrate and on the second surface, a deep trench isolation structure in the substrate and coupled to the first shallow trench isolation, a first dielectric layer disposed on the first surface and coupled to the deep trench isolation structure, a second dielectric layer disposed over the first dielectric layer and coupled to the deep trench isolation structure, a third dielectric layer comprising a horizontal portion disposed over the second dielectric layer and a vertical portion coupled to the horizontal portion, and a through substrate via structure penetrating the substrate from the first surface to the second surface and penetrating the second shallow trench isolation.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: A method and structure for compensating tolerances in assembling modules are provided. The method applies to a pressing fixture and a module with a baseline reference plane and an assembly baseline plane. The assembly baseline plane has at least three compensation baseline bumps, having the height greater than the compensation amount. The pressing fixture has a calibration reference plane. The method comprises: adjusting the position of the module or the pressing fixture to make the baseline reference plane parallel to the calibration reference plane; the pressing fixture using the calibration reference plane to press on the compensation baseline bumps, and changing the position of bump top of each compensation baseline bump; removing the pressing fixture from the compensation baseline bumps, and the plurality of the bump tops forming a preliminary baseline plane, and the preliminary baseline plane being parallel to the baseline reference plane.

Abstract: A method and structure for compensating tolerances in assembling modules are provided. The method applies to a pressing fixture and a module with a baseline reference plane and an assembly baseline plane. The assembly baseline plane has at least three compensation baseline bumps, having the height greater than the compensation amount. The pressing fixture has a calibration reference plane. The method comprises: adjusting the position of the module or the pressing fixture to make the baseline reference plane parallel to the calibration reference plane; the pressing fixture using the calibration reference plane to press on the compensation baseline bumps, and changing the position of bump top of each compensation baseline bump; removing the pressing fixture from the compensation baseline bumps, and the plurality of the bump tops forming a preliminary baseline plane, and the preliminary baseline plane being parallel to the baseline reference plane.

Abstract: A storage method comprises storing a retry table; wherein the retry table recites a plurality of error type patterns, the error type patterns comprises a plurality of default error types; accessing data stored in the flash memory; wherein an access error caused when a control circuit reads the data, the control circuit reads the retry table and performs testing according to the error type patterns sequentially to determine a current error type of the access error, and the control circuit performs an adjusted accessing action according to the current error type.

Abstract: A storage method comprises storing a retry table; wherein the retry table recites a plurality of error type patterns, the error type patterns comprises a plurality of default error types; accessing data stored in the flash memory; wherein an access error caused when a control circuit reads the data, the control circuit reads the retry table and performs testing according to the error type patterns sequentially to determine a current error type of the access error, and the control circuit performs an adjusted accessing action according to the current error type.

Abstract: An electret electroacoustic transducer comprises first porous complex electrode, support member, electret vibrating film and first adjustment member. Support member is configured on the first porous complex electrode. The fixed portion of the electret vibrating film is fixed on the support member. Adjustment member is set between the first porous complex electrode and the electret vibrating film. A sectional difference is formed between the fixed portion and the adjusted portion of the electret vibrating film.

Abstract: A flexible speaker structure, includes, a first electret film having a first surface, a second electret film having a second surface, a conductive film positioned between the first electret and the second electret, a first spacer disposed on the first surface for supporting a first electrode, and a second spacer disposed on the second surface for supporting a second electrode. A first interior angle is defined by the first electret and the first spacer, and the first interior angle is between 60 to 80 degrees.

Abstract: The present invention provides a tilt angle adjusting mechanism for adjusting the tilt angle of the optical axis of a pickup head relative to the optical disc. The pickup head is furnished with an elongated hole, a slot or an L-shape base, several pre-loaded pressing elements and adjusting elements for a three-point mounting on two guide rods. The adjusting elements make the optical pickup head rotatably on two axes so as to adjust the tilt angle. An adaptive mechanism can also be incorporated for adjusting the tilt angle of the pickup head without modifying the original structure of an optical disc driver.

Abstract: The present invention provides a tilt angle adjusting mechanism for adjusting the tilt angle of the optical axis of a pickup head relative to the optical disc. The tilt angle adjusting mechanism includes two guide rods supported by a fixed holder and an adjusting holder. The adjusting holder receives an adjusting element for adjusting the guide rod moving toward or away from the optical disc. By adjusting one or both adjusting elements to move the guide rods in different axes, the correct tilt angle can be attained.

Abstract: A vibration absorber includes at least one damping means attached to an optical disk drive for absorbing vibration of a base frame of the optical disk drive. The damping means includes at least one elastic member with proper stiffness and a damping coefficient and a rigid body providing mass and moment inertia effect.