Abstract: The present invention provides a method for acquiring a boundary line of an alignment film, including the steps of: processing an edge of an image and determining the boundary line of the alignment film; conducting a first screen over the determined boundary line, and excluding a straight boundary line; and conducting a second screen toward the firstly-screened boundary line, and selecting the outmost boundary line as the actual boundary line of the alignment film. The present invention further provides a method for inspecting an alignment film.

Abstract: The present invention provides a method for acquiring a boundary line of an alignment film, including the steps of: processing an edge of an image and determining the boundary line of the alignment film; conducting a first screen over the determined boundary line, and excluding a straight boundary line; and conducting a second screen toward the firstly-screened boundary line, and selecting the outmost boundary line as the actual boundary line of the alignment film. The present invention further provides a method for inspecting an alignment film.

Abstract: The present invention provides a cutting device for liquid crystal substrate and cutting monitoring method thereof. The monitoring method includes: using a plurality of cutters to cut a liquid crystal substrate into a plurality of liquid crystal panels; inspecting respective cutting precision data of different cutting edges of a same liquid crystal panel; summarizing cutting precision data of liquid crystal panels cut by a same cutter; and monitoring cutting characteristics of cutter according to average, maximum and/or minimum of the summarized cutting precision data. Through associating cutter and cutting precision data and summarizing the cutting precision data corresponding to a same cutter, the present invention can accurately monitor the cutting characteristics of cutter in real time and can identify the corresponding cutter when abnormal situation of cutting characteristics occurs.

Abstract: A transferring apparatus includes a main body, at least one suction cup, and a vacuum generating device. The main body is used for supporting a liquid crystal panel. The at least one suction cup is disposed in the main body and is adhered to the liquid crystal panel. The vacuum generating device is disposed in the main body and communicates with the at least one suction cup for generating negative-pressure gas when the at least one suction cup contacts the liquid crystal panel to allow the at least one suction cup to be adhered to the liquid crystal panel. With the vacuum generating device, the suction cup is capable of being adhered to the liquid crystal panel tightly, thus, the transferring apparatus can carry and transfer the liquid crystal panel stably after the liquid crystal panel contacts the suction cups, and further avoid damage to the liquid crystal panel.

Abstract: A cutting machine for cutting a liquid crystal panel includes a transferring device for transferring the panel, a positioning device for positioning the panel, and a main body for driving the transferring device and the positioning device to position the panel and for cutting the panel after the panel is positioned. The transferring device includes a first roller array for supporting and transferring the panel along a first direction and a second roller array for supporting and transferring the panel along a second direction. The positioning device includes a first positioning assembly, a second positioning assembly, a third positioning assembly, and a forth positioning assembly. The first positioning assembly cooperates with the second positioning assembly to position the panel along the first direction before the panel is cut, and the third positioning assembly cooperates with the forth positioning assembly to position the panel along the second direction.