Abstract: A method includes removing a dummy gate stack to form a trench between gate spacers, depositing a gate dielectric extending into the trench, and performing a first treatment process on the gate dielectric. The first treatment process is performed using a fluorine-containing gas. A first drive-in process is then performed to drive fluorine in the fluorine-containing gas into the gate dielectric. The method further includes performing a second treatment process on the gate dielectric, wherein the second treatment process is performed using the fluorine-containing gas, and performing a second drive-in process to drive fluorine in the fluorine-containing gas into the gate dielectric. After the second drive-in process, conductive layers are formed to fill the trench.

Abstract: The invention provides an adhesive composition for conduction between electrical elements, comprising 25 to 46 parts by weight of nitrile-butadiene rubber with Mooney viscosity ranged from 50 to 75 (ML 1+4@100)° C., 25 to 45 parts by weight of acrylic oligomer, 16 to 32 parts by weight of thermoplastic resin, two organic peroxides having different one-minute half-life temperatures from each other, and a coupling agent. The thermoplastic resin is selected from the group consisting of phenoxy resin, poly(methyl)methacrylate copolymer, polystyrene copolymer and Novolak resin.

Abstract: The invention provides an adhesive composition for conduction between electrical elements, comprising 25 to 46 parts by weight of nitrile-butadiene rubber with Mooney viscosity ranged from 50 to 75 (ML 1+4@100)° C., 25 to 45 parts by weight of acrylic oligomer, 16 to 32 parts by weight of thermoplastic resin, two organic peroxides having different one-minute half-life temperatures from each other, and a coupling agent. The thermoplastic resin is selected from the group consisting of phenoxy resin, poly(methyl)methacrylate copolymer, polystyrene copolymer and Novolak resin.

Abstract: The invention provides a method for preparing nano silver particles comprising mixing polyvinyl pyrrolidone (PVP) and silver nitrate (AgNO3) in a solvent to form a reactive solution, heating the reactive solution to a temperature less than the boiling point of the solvent for the formation reaction of nano silver particles, adding an accelerating agent into the reactive solution during the formation reaction of the nano silver particles, and terminating the formation reaction when the size of the nano silver particles formed in the reaction solution reaches about 50 nm to 120 nm in diameter.

Abstract: An encapsulant composition is provided. The encapsulant composition includes at least one silane-containing monomer and at least one resin monomer selected from the group consisting of acrylic resin monomers and epoxy resin monomers, a filler of about 0.1-15 wt % of the encapsulant composition, and an initiator. The invention also provides a method for fabricating an encapsulant material.

Abstract: The invention provides a method for preparing nano silver particles comprising mixing polyvinyl pyrrolidone (PVP) and silver nitrate (AgNO3) in a solvent to form a reactive solution, heating the reactive solution to a temperature less than the boiling point of the solvent for the formation reaction of nano silver particles, adding an accelerating agent into the reactive solution during the formation reaction of the nano silver particles, and terminating the formation reaction when the size of the nano silver particles formed in the reaction solution reaches about 50 nm to 120 nm in diameter.

Abstract: A flexible transparent conductive film is provided. The conductive film includes a hydrophilic transparent resin and silver nanowires distributed in the resin. A method for manufacturing the flexible transparent conductive film is also disclosed.

Abstract: Silver nanowire with a diameter smaller than 100 nm and an aspect ratio from 150 to 300 is disclosed. The preparation method of the silver nanowires is also disclosed.

Abstract: An encapsulant composition is provided. The encapsulant composition includes at least one silicone resin monomer and at least one resin monomer selected from the group consisting of acrylic resin monomers and epoxy resin monomers, a filler of about 0.1-15 wt % of the encapsulant composition, and an initiator. The invention also provides a method for fabricating an encapsulant material.