Abstract: In an embodiment, a package includes an integrated circuit device attached to a substrate; an encapsulant disposed over the substrate and laterally around the integrated circuit device, wherein a top surface of the encapsulant is coplanar with the top surface of the integrated circuit device; and a heat dissipation structure disposed over the integrated circuit device and the encapsulant, wherein the heat dissipation structure includes a spreading layer disposed over the encapsulant and the integrated circuit device, wherein the spreading layer includes a plurality of islands, wherein at least a portion of the islands are arranged as lines extending in a first direction in a plan view; a plurality of pillars disposed over the islands of the spreading layer; and nanostructures disposed over the pillars.

Abstract: A method may include forming a dummy dielectric layer over a substrate, and forming a dummy gate over the dummy dielectric layer. The method may also include forming a first spacer adjacent the dummy gate, and removing the dummy gate to form a cavity, where the cavity is defined at least in part by the first spacer. The method may also include performing a plasma treatment on portions of the first spacer, where the plasma treatment causes a material composition of the portions of the first spacer to change from a first material composition to a second material composition. The method may also include etching the portions of the first spacer having the second material composition to remove the portions of the first spacer having the second material composition, and filling the cavity with conductive materials to form a gate structure.

Abstract: A digital logic circuit and a manufacture method of the digital logic circuit thereof are provided. The digital logic circuit includes a voltage rail, a ground rail, and a plurality of logic circuit rails, wherein each of the logic circuit rails is electrically connected to the voltage rail and the ground rail. The logic circuit rail includes a logic unit and an auxiliary unit electrically connected to the voltage rail and the ground rail. The logic unit includes a logic voltage end electrically connected to the voltage rail and a logic ground end electrically connected to the ground rail. The auxiliary unit includes an auxiliary voltage end electrically connected to the voltage rail and an auxiliary ground end electrically connected to the ground rail. At least one of the width ratio between the auxiliary voltage end and the logic voltage end and the width ratio between the auxiliary ground end and the logic ground end is greater than 1.

Abstract: A digital logic circuit and a manufacture method of the digital logic circuit thereof are provided. The digital logic circuit includes a voltage rail, a ground rail, and a plurality of logic circuit rails, wherein each of the logic circuit rails is electrically connected to the voltage rail and the ground rail. The logic circuit rail includes a logic unit and an auxiliary unit electrically connected to the voltage rail and the ground rail. The logic unit includes a logic voltage end electrically connected to the voltage rail and a logic ground end electrically connected to the ground rail. The auxiliary unit includes an auxiliary voltage end electrically connected to the voltage rail and an auxiliary ground end electrically connected to the ground rail. At least one of the width ratio between the auxiliary voltage end and the logic voltage end and the width ratio between the auxiliary ground end and the logic ground end is greater than 1.