Abstract: A test device uses a single probe to test plurality of pads of at least one chip, and includes a test circuit, a plurality of short-circuit elements and a plurality of probes. The plurality of short-circuit elements is formed in scribe lines around the at least one chip, where each of the plurality of short-circuit elements connects the plurality of pads, and the plurality of pads includes one testing pad and at least one non-testing pad. The plurality of probes receives a plurality of test signals generated by the at least one chip from the testing pad via the plurality of short-circuit elements, so the test circuit generates a test result according to the plurality of test signals.

Abstract: A test device uses a single probe to test plurality of pads of at least one chip, and includes a test circuit, a plurality of short-circuit elements and a plurality of probes. The plurality of short-circuit elements is formed in scribe lines around the at least one chip, where each of the plurality of short-circuit elements connects the plurality of pads, and the plurality of pads includes one testing pad and at least one non-testing pad. The plurality of probes receives a plurality of test signals generated by the at least one chip from the testing pad via the plurality of short-circuit elements, so the test circuit generates a test result according to the plurality of test signals.

Abstract: An active probe card capable of improving testing bandwidth of a device under (DUT) test includes a printed circuit board; at least one probe needle, affixed to a first surface of the printed circuit board for probing the DUT; at least one connection member, electrically connected to the at least one probe needle; and an amplification circuit, formed on the printed circuit board and coupled to the at least one connection member for amplifying an input or output signal of the DUT.

Abstract: An integrated circuit (IC) testing interface capable of upgrading an automatic test equipment (ATE) for testing a semiconductor device includes at least one pin for receiving or transmitting at least a test signal to a tester of the automatic test equipment, a plurality of digitizers coupled to the at least one pin for generating a digital signal, a processing means coupled to the plurality of digitizers for processing the digital signal, and a connection unit for connecting the processing means with a computing device for transmitting an output signal from the processing means to the computing device, where the IC testing interface is disposed between the tester and a prober of the automatic test equipment.

Abstract: An integrated circuit (IC) testing interface capable of upgrading an automatic test equipment (ATE) for testing a semiconductor device includes at least one pin for receiving or transmitting at least a test signal to a tester of the automatic test equipment, a plurality of digitizers coupled to the at least one pin for generating a digital signal, a processing means coupled to the plurality of digitizers for processing the digital signal, and a connection unit for connecting the processing means with a computing device for transmitting an output signal from the processing means to the computing device, where the IC testing interface is disposed between the tester and a prober of the automatic test equipment.

Abstract: An active probe card capable of improving testing bandwidth of a device under (DUT) test includes a printed circuit board; at least one probe needle, affixed to a first surface of the printed circuit board for probing the DUT; at least one connection member, electrically connected to the at least one probe needle; and an amplification circuit, formed on the printed circuit board and coupled to the at least one connection member for amplifying an input or output signal of the DUT.