Abstract: A package structure and method for forming the same are provided. The package structure includes a first through via structure formed in a substrate and a semiconductor die formed below the first through via structure. The package structure further includes a conductive structure formed in a passivation layer over the substrate. The conductive structure includes a first via portion and a second via portion, the first via portion is directly over the first through via structure, and there is no conductive material directly below and in direct contact with the second via portion.

Abstract: A foldable computer cover includes: a first panel, a second panel, a third panel, a fourth panel, and a fifth panel, wherein a front end of the fifth panel is foldably connected to a back end edge of the fourth panel, a front end of the fourth panel is foldably connected to a back end edge of the third panel, and so on, so all the panels are connected together. The user can open the first panel and fold it to support the portable computer, and places the bottom of the portable computer along one of the stop ridges of the saw-toothed shaped stop on the third panel to hold the portable computer upright. The user can choose different stop ridges for placement of the portable computer at different viewing angles.

Abstract: A portable computer having a hidden keyboard structure is disclosed. The portable computer comprises: a shell having installed in the top face thereof a LCD panel and a keyboard, a protective cover pivoted to one peripheral side of the shell by a coupling mechanism and adaptable to cover the keyboard, the protective cover having a plurality of buttons mounted on the outer face and a cursor control device mounted on the inner face, and a flexible printed circuit connected between the shell and the protective cover for transmitting signals from the buttons and the cursor-control.