Abstract: A thermal management system for an electronic device, including: a primary thermal conductivity spreader; a first heat-generating component thermally coupled to the primary thermal conductivity spreader; and a secondary thermal conductivity spreader layer positioned between the primary thermal conductivity spreader and a circuit board, wherein the secondary thermal conductivity spreader layer comprises a thermal conductivity spreader that is thermally coupled to the first heat-generating component and extends toward at least one additional heat-generating component having a lower thermal load than the first heat-generating component, wherein at least a portion of the secondary thermal conductivity spreader layer is disposed at a distance above the circuit board to define airflow channels.

Abstract: An electronic device is provided that implements thermally conductive plastic supports that may replace the typical use of “feet” used in conventional electronic devices. The thermally conductive supports may extend through the bottom chassis cover (e.g. the “D cover”) of the electronic device, and be mechanically and thermally coupled to a heat pipe that is in turn coupled to a heat source for which thermal regulation is utilized. The thermally conductive plastic supports may provide a heat path from the heat source to the bottom chassis cover and, when the electronic device is disposed on a surface, an additional heat path may be provided from the heat source to this surface.

Abstract: Heat exchange apparatuses and methods for hyperbaric cooling fan applications such as computing devices. The apparatus comprises a material with high thermal conductivity and is configured to be overlaid on an internal surface of the housing, such that an internal surface of the apparatus is exposed to the hot air flowing inside the housing, and an external surface of the apparatus occludes at least some of the existing through-holes of the housing. In operation, the apparatus converts the through-holes into passive heat exchanging regions that passively transfer heat from inside the housing to outside the housing, which brings the internal air temperature and junction temperature (Tj) of the heat generating components down. Provided embodiments do not require reworking of the original industrial design (ID) of the housing.

Abstract: A semiconductor device includes a substrate, a 2-D material layer, source/drain contacts, and a gate electrode. The 2-D material layer is over the substrate, the 2-D material layer includes source/drain regions and a channel region between the source/drain regions, in which the 2-D material layer is made of a transition metal dichalcogenide (TMD). The source/drain contacts are in contact with source/drain regions of the 2-D material layer, in which a binding energy of transition metal atoms at the channel region of the 2-D material layer is different from a binding energy of the transition metal atoms at the source/drain regions of the 2-D material layer. The gate electrode is over the substrate.

Abstract: A semiconductor device includes a substrate, a 2-D material layer, source/drain contacts, and a gate electrode. The 2-D material layer is over the substrate, the 2-D material layer includes source/drain regions and a channel region between the source/drain regions, in which the 2-D material layer is made of a transition metal dichalcogenide (TMD). The source/drain contacts are in contact with source/drain regions of the 2-D material layer, in which a binding energy of transition metal atoms at the channel region of the 2-D material layer is different from a binding energy of the transition metal atoms at the source/drain regions of the 2-D material layer. The gate electrode is over the substrate.

Abstract: An alignment jig for an optical lens array is furnished on an optical alignment apparatus. The alignment machine is for performing active optical alignment operations of a sensor chip located on a circuit board and a lens socket plugged with a fiber plug. The alignment jig includes a support arm, a pick-up mechanism and a pushing mechanism. The support arm is fixed to the optical alignment apparatus for supporting the alignment jig. The pick-up mechanism is furnished on the support arm for picking-up and holding the lens socket in a detachable manner at a predetermined position corresponding to the sensor chip. The pushing mechanism holds the plugging status when the fiber plug is plugged into the lens socket and provides a pushing force, such that the fiber plug has a tendency to be pushed toward and engage the lens socket tightly.

Abstract: An alignment jig for an optical lens array is furnished on an optical alignment apparatus. The alignment machine is for performing active optical alignment operations of a sensor chip located on a circuit board and a lens socket plugged with a fiber plug. The alignment jig includes a support arm, a pick-up mechanism and a pushing mechanism. The support arm is fixed to the optical alignment apparatus for supporting the alignment jig. The pick-up mechanism is furnished on the support arm for picking-up and holding the lens socket in a detachable manner at a predetermined position corresponding to the sensor chip. The pushing mechanism holds the plugging status when the fiber plug is plugged into the lens socket and provides a pushing force, such that the fiber plug has a tendency to be pushed toward and engage the lens socket tightly.

Abstract: A digital photo frame includes a body and a stand. The body has a first combining portion, and the stand has a second combining portion. The first combining portion and the second combining portion are combined by magnetic attraction.

Abstract: The present invention concerns to a press key structure with a light module in use of illuminant variation for arrow keys of an appliance. The press key structure with light module comprises a key base plate, a light source, a spread slice and a light guiding cap. The light guiding cap includes a crown part, a chamber, and a mouth part that is set on the key base plate and can exactly cover up the above light source. The spread slice is set in the chamber of the light guiding cap so that the light is evenly spread through the light guiding function of the spread slice. Moreover, by adjusting the thickness, transparency, and inside cambered surface of the spread slice, or the distance between the spread slice and the light source, the light guiding property thereof can be modulated.