Patents by Inventor Tsung Kai Lin

Tsung Kai Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250133698
    Abstract: An electronic device is provided that implements thermally conductive plastic supports that may replace the typical use of “feet” used in conventional electronic devices. The thermally conductive supports may extend through the bottom chassis cover (e.g. the “D cover”) of the electronic device, and be mechanically and thermally coupled to a heat pipe that is in turn coupled to a heat source for which thermal regulation is utilized. The thermally conductive plastic supports may provide a heat path from the heat source to the bottom chassis cover and, when the electronic device is disposed on a surface, an additional heat path may be provided from the heat source to this surface.
    Type: Application
    Filed: December 20, 2024
    Publication date: April 24, 2025
    Inventors: Chi Chou Cheng, Jeff Ku, Chung Jen Ho, Chihtsung Hu, Tsung-Kai Lin
  • Publication number: 20240431066
    Abstract: Heat exchange apparatuses and methods for hyperbaric cooling fan applications such as computing devices. The apparatus comprises a material with high thermal conductivity and is configured to be overlaid on an internal surface of the housing, such that an internal surface of the apparatus is exposed to the hot air flowing inside the housing, and an external surface of the apparatus occludes at least some of the existing through-holes of the housing. In operation, the apparatus converts the through-holes into passive heat exchanging regions that passively transfer heat from inside the housing to outside the housing, which brings the internal air temperature and junction temperature (Tj) of the heat generating components down. Provided embodiments do not require reworking of the original industrial design (ID) of the housing.
    Type: Application
    Filed: June 23, 2023
    Publication date: December 26, 2024
    Applicant: Intel Corporation
    Inventors: Jeff Ku, Chi Chou Cheng, Jeffrey Ho, Chih-Tsung Hu, Srinivasarao Konakalla, Tsung-Kai Lin, Arnab Sen, Chiu-Chun Wang, Jiacheng Wu
  • Patent number: 12154828
    Abstract: A semiconductor device includes a substrate, a 2-D material layer, source/drain contacts, and a gate electrode. The 2-D material layer is over the substrate, the 2-D material layer includes source/drain regions and a channel region between the source/drain regions, in which the 2-D material layer is made of a transition metal dichalcogenide (TMD). The source/drain contacts are in contact with source/drain regions of the 2-D material layer, in which a binding energy of transition metal atoms at the channel region of the 2-D material layer is different from a binding energy of the transition metal atoms at the source/drain regions of the 2-D material layer. The gate electrode is over the substrate.
    Type: Grant
    Filed: January 13, 2022
    Date of Patent: November 26, 2024
    Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., NATIONAL YANG MING CHIAO TUNG UNIVERSITY
    Inventors: Chiung-Yuan Lin, Tsung-Fu Yang, Weicheng Chu, Ching Liang Chang, Chen Han Chou, Chia-Ho Yang, Tsung-Kai Lin, Tsung-Han Lin, Chih-Hung Chung, Chenming Hu
  • Publication number: 20230023186
    Abstract: A semiconductor device includes a substrate, a 2-D material layer, source/drain contacts, and a gate electrode. The 2-D material layer is over the substrate, the 2-D material layer includes source/drain regions and a channel region between the source/drain regions, in which the 2-D material layer is made of a transition metal dichalcogenide (TMD). The source/drain contacts are in contact with source/drain regions of the 2-D material layer, in which a binding energy of transition metal atoms at the channel region of the 2-D material layer is different from a binding energy of the transition metal atoms at the source/drain regions of the 2-D material layer. The gate electrode is over the substrate.
    Type: Application
    Filed: January 13, 2022
    Publication date: January 26, 2023
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., National Yang Ming Chiao Tung University
    Inventors: Chiung-Yuan LIN, Tsung-Fu YANG, Weicheng CHU, Ching Liang CHANG, Chen Han CHOU, Chia-Ho YANG, Tsung-Kai LIN, Tsung-Han LIN, Chih-Hung CHUNG, Chenming HU
  • Patent number: 9400358
    Abstract: An alignment jig for an optical lens array is furnished on an optical alignment apparatus. The alignment machine is for performing active optical alignment operations of a sensor chip located on a circuit board and a lens socket plugged with a fiber plug. The alignment jig includes a support arm, a pick-up mechanism and a pushing mechanism. The support arm is fixed to the optical alignment apparatus for supporting the alignment jig. The pick-up mechanism is furnished on the support arm for picking-up and holding the lens socket in a detachable manner at a predetermined position corresponding to the sensor chip. The pushing mechanism holds the plugging status when the fiber plug is plugged into the lens socket and provides a pushing force, such that the fiber plug has a tendency to be pushed toward and engage the lens socket tightly.
    Type: Grant
    Filed: March 24, 2015
    Date of Patent: July 26, 2016
    Assignee: Truelight Corporation
    Inventors: Po Hsiang Chen, Tsung-Kai Lin, Yun Cheng Yu
  • Publication number: 20150323750
    Abstract: An alignment jig for an optical lens array is furnished on an optical alignment apparatus. The alignment machine is for performing active optical alignment operations of a sensor chip located on a circuit board and a lens socket plugged with a fiber plug. The alignment jig includes a support arm, a pick-up mechanism and a pushing mechanism. The support arm is fixed to the optical alignment apparatus for supporting the alignment jig. The pick-up mechanism is furnished on the support arm for picking-up and holding the lens socket in a detachable manner at a predetermined position corresponding to the sensor chip. The pushing mechanism holds the plugging status when the fiber plug is plugged into the lens socket and provides a pushing force, such that the fiber plug has a tendency to be pushed toward and engage the lens socket tightly.
    Type: Application
    Filed: March 24, 2015
    Publication date: November 12, 2015
    Applicant: TrueLight Corporation
    Inventors: Po Hsiang Chen, TSUNG-KAI LIN, YUN CHENG YU
  • Publication number: 20080297438
    Abstract: A digital photo frame includes a body and a stand. The body has a first combining portion, and the stand has a second combining portion. The first combining portion and the second combining portion are combined by magnetic attraction.
    Type: Application
    Filed: April 29, 2008
    Publication date: December 4, 2008
    Inventor: Tsung-Kai LIN
  • Patent number: 7350932
    Abstract: The present invention concerns to a press key structure with a light module in use of illuminant variation for arrow keys of an appliance. The press key structure with light module comprises a key base plate, a light source, a spread slice and a light guiding cap. The light guiding cap includes a crown part, a chamber, and a mouth part that is set on the key base plate and can exactly cover up the above light source. The spread slice is set in the chamber of the light guiding cap so that the light is evenly spread through the light guiding function of the spread slice. Moreover, by adjusting the thickness, transparency, and inside cambered surface of the spread slice, or the distance between the spread slice and the light source, the light guiding property thereof can be modulated.
    Type: Grant
    Filed: June 2, 2005
    Date of Patent: April 1, 2008
    Assignee: Tatung Co., Ltd
    Inventors: Tsung Kai Lin, Lii Hwang Chen