Abstract: A multiple pixel package structure with a buried chip and an electronic device using the same are provided. The multiple pixel package structure includes a multi-layered circuit board, a plurality of pixels, a protective layer, and a control chip. The pixels are arranged on the multi-layered circuit board and into an array. Each of the pixels includes a plurality of light emitting elements of different colors. The protective layer is formed on the multi-layered circuit board and covers the pixels. The control chip is buried in the multi-layered circuit board and electrically connected to the light emitting elements of each of the pixels, so as to allow each of the pixels to produce a target luminous characteristic.

Abstract: A light emitting diode (LED) package structure including a first light emitting portion, a second light emitting portion, a partition, and a surrounding wall is provided. The first light emitting portion includes a first LED chip emitting a first initial light, and the first initial light passes through the first light emitting portion to form a first white light. The second light emitting portion includes a second LED chip, a third LED chip, and a fourth LED chip. The partition is disposed between the first light emitting portion and the second light emitting portion. The surrounding wall is disposed around the partition, the first light emitting portion, and the second light emitting portion. The first white light has a view angle offset less than 1 degree.

Abstract: A substrate structure with a buried chip and a light emitting device using the same are provided. The substrate structure includes a base layer, a control chip, a filling layer, a first upper resin layer and a first lower resin layer. The substrate layer has a first surface, a second surface opposite to the first surface, and an opening passing through the first surface and the second surface. The control chip is disposed in the opening, and an annular space having a specific width is defined by an outer wall surface of the control chip and an inner wall surface of the opening. The filling layer is filled in the annular space. The first upper resin layer and the first lower resin layer are respectively disposed on the first surface and the second surface of the base layer.

Abstract: A multiple pixel package structure with a buried chip and an electronic device using the same are provided. The multiple pixel package structure includes a multi-layered circuit board, a plurality of pixels, a protective layer, and a control chip. The pixels are arranged on the multi-layered circuit board and into an array. Each of the pixels includes a plurality of light emitting elements of different colors. The protective layer is formed on the multi-layered circuit board and covers the pixels. The control chip is buried in the multi-layered circuit board and electrically connected to the light emitting elements of each of the pixels, so as to allow each of the pixels to produce a target luminous characteristic.

Abstract: A light emitting diode (LED) package structure including a first light emitting portion, a second light emitting portion, a partition, and a surrounding wall is provided. The first light emitting portion includes a first LED chip emitting a first initial light, and the first initial light passes through the first light emitting portion to form a first white light. The second light emitting portion includes a second LED chip, a third LED chip, and a fourth LED chip. The partition is disposed between the first light emitting portion and the second light emitting portion. The surrounding wall is disposed around the partition, the first light emitting portion, and the second light emitting portion. The first white light has a view angle offset less than 1 degree.

Abstract: A substrate structure with a buried chip and a light emitting device using the same are provided. The substrate structure includes a base layer, a control chip, a filling layer, a first upper resin layer and a first lower resin layer. The substrate layer has a first surface, a second surface opposite to the first surface, and an opening passing through the first surface and the second surface. The control chip is disposed in the opening, and an annular space having a specific width is defined by an outer wall surface of the control chip and an inner wall surface of the opening. The filling layer is filled in the annular space. The first upper resin layer and the first lower resin layer are respectively disposed on the first surface and the second surface of the base layer.

Abstract: An LED package structure includes a multilayer circuit board, an LED chip, and a cover. The multilayer circuit board has a conductive layer, a first resin layer disposed on the conductive layer, and a first circuit layer disposed on the first resin layer. The first resin layer has a first opening, and a portion of the conductive layer is partially exposed from the first resin layer via the first opening such that a mounting region is exposed. The first circuit layer has a second opening, and the second opening exposes the mounting region. The LED chip is fixed on the mounting region by passing it through the first and second openings, and the LED chip is connected to the first circuit layer by wires. The cover is disposed on the first resin layer and covers the LED chip and the first circuit layer.

Abstract: An LED package structure includes a multilayer circuit board, an LED chip, and a cover. The multilayer circuit board has a conductive layer, a first resin layer disposed on the conductive layer, and a first circuit layer disposed on the first resin layer. The first resin layer has a first opening, and a portion of the conductive layer is partially exposed from the first resin layer via the first opening such that a mounting region is exposed. The first circuit layer has a second opening, and the second opening exposes the mounting region. The LED chip is fixed on the mounting region by passing it through the first and second openings, and the LED chip is connected to the first circuit layer by wires. The cover is disposed on the first resin layer and covers the LED chip and the first circuit layer.

Abstract: An LED package structure includes a multilayer circuit board, an LED chip, and a cover. The multilayer circuit board has a conductive layer, a first resin layer disposed on the conductive layer, and a first circuit layer disposed on the first resin layer. The first resin layer has a first opening, and a portion of the conductive layer is partially exposed from the first resin layer via the first opening such that a mounting region is exposed. The first circuit layer has a second opening, and the second opening exposes the mounting region. The LED chip is fixed on the mounting region by passing it through the first and second openings, and the LED chip is connected to the first circuit layer by wires. The cover is disposed on the first resin layer and covers the LED chip and the first circuit layer.

Abstract: The instant disclosure provides a light-emitting module and a method of manufacturing a single light-emitting structure. The light-emitting module includes two identical light-emitting structures disposed on the same plane. One of the two light-emitting structures disposed on the plane is rotated by 180 degrees relative to the other light-emitting structure, and the two light-emitting structures are connected to each other. Each light-emitting structure includes a base, a conducting element, a light-emitting element and an encapsulation element. The conducting element includes a plurality of conductors separated from each other and passing through the base body, where the number of the conductors is N and N>1. The light-emitting element includes at least one light-emitting chip electrically connected between at least two of the conductors. The encapsulation element includes a transparent encapsulation body disposed on the base to cover the conducting element and the light-emitting element.

Abstract: An LED package structure includes a multilayer circuit board, an LED chip, and a cover. The multilayer circuit board has a conductive layer, a first resin layer disposed on the conductive layer, and a first circuit layer disposed on the first resin layer. The first resin layer has a first opening, and a portion of the conductive layer is partially exposed from the first resin layer via the first opening such that a mounting region is exposed. The first circuit layer has a second opening, and the second opening exposes the mounting region. The LED chip is fixed on the mounting region by passing it through the first and second openings, and the LED chip is connected to the first circuit layer by wires. The cover is disposed on the first resin layer and covers the LED chip and the first circuit layer.

Abstract: The instant disclosure provides a light-emitting module and a method of manufacturing a single light-emitting structure. The light-emitting module includes two identical light-emitting structures disposed on the same plane. One of the two light-emitting structures disposed on the plane is rotated by 180 degrees relative to the other light-emitting structure, and the two light-emitting structures are connected to each other. Each light-emitting structure includes a base, a conducting element, a light-emitting element and an encapsulation element. The conducting element includes a plurality of conductors separated from each other and passing through the base body, where the number of the conductors is N and N>1. The light-emitting element includes at least one light-emitting chip electrically connected between at least two of the conductors. The encapsulation element includes a transparent encapsulation body disposed on the base to cover the conducting element and the light-emitting element.

Abstract: The instant disclosure provides a light-emitting module and a method of manufacturing a single light-emitting structure. The light-emitting module includes two identical light-emitting structures disposed on the same plane. One of the two light-emitting structures disposed on the plane is rotated by 180 degrees relative to the other light-emitting structure, and the two light-emitting structures are connected to each other. Each light-emitting structure includes a base, a conducting element, a light-emitting element and an encapsulation element. The conducting element includes a plurality of conductors separated from each other and passing through the base body, where the number of the conductors is N and N>1. The light-emitting element includes at least one light-emitting chip electrically connected between at least two of the conductors. The encapsulation element includes a transparent encapsulation body disposed on the base to cover the conducting element and the light-emitting element.

Abstract: An LED package structure includes: an insulating substrate that has a front bonding pad assembly; a dark-colored die-attach adhesive; blue and green LED chips mounted on the front bonding pad assembly via the dark-colored die-attach adhesive; and a dark-colored and light-transmissible encapsulant that is disposed on the insulating substrate and that encapsulates the blue and green LED chips. The encapsulant has a light transmittance that ranges from 7% to 28% for the blue light and has a light transmittance that ranges from 9% to 30% for the green light.

Abstract: An LED package structure includes: an insulating substrate that has a front bonding pad assembly; a dark-colored die-attach adhesive; blue and green LED chips mounted on the front bonding pad assembly via the dark-colored die-attach adhesive; and a dark-colored and light-transmissible encapsulant that is disposed on the insulating substrate and that encapsulates the blue and green LED chips. The encapsulant has a light transmittance that ranges from 7% to 28% for the blue light and has a light transmittance that ranges from 9% to 30% for the green light.

Abstract: The instant disclosure provides a light-emitting module and a method of manufacturing a single light-emitting structure. The light-emitting module includes two identical light-emitting structures disposed on the same plane. One of the two light-emitting structures disposed on the plane is rotated by 180 degrees relative to the other light-emitting structure, and the two light-emitting structures are connected to each other. Each light-emitting structure includes a base, a conducting element, a light-emitting element and an encapsulation element. The conducting element includes a plurality of conductors separated from each other and passing through the base body, where the number of the conductors is N and N>1. The light-emitting element includes at least one light-emitting chip electrically connected between at least two of the conductors. The encapsulation element includes a transparent encapsulation body disposed on the base to cover the conducting element and the light-emitting element.