Patents by Inventor Tsung-Li Lin
Tsung-Li Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11947251Abstract: An illumination system provides an illumination beam and includes a red light source, a green light source, a blue light source, a first supplementary light source, a first X-shaped light-splitting assembly, a first light-splitting element, and a light-uniforming element. The red light source provides a red beam. The green light source provides a green beam. The blue light source provides a blue beam. The first supplementary light source provides a first supplementary beam. The first X-shaped light-splitting assembly guides the first supplementary beam and the blue beam to the first light-splitting element. The first light-splitting element guides the red beam, the green beam, the blue beam, and the first supplementary beam to the light-uniforming element. The first supplementary beam is a red supplementary beam or a blue supplementary beam, and the illumination system includes at least five light-emitting elements. A projection apparatus including the above illumination system is also provided.Type: GrantFiled: March 23, 2022Date of Patent: April 2, 2024Assignee: Coretronic CorporationInventors: Chi-Fu Liu, Tsung-Hsin Liao, Chun-Li Chen, Hung-Yu Lin
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Patent number: 11929318Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.Type: GrantFiled: May 10, 2021Date of Patent: March 12, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
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Patent number: 11917340Abstract: A projection device, including an illumination system, a control element, a driving element, a light valve, and a projection lens, is provided. The illumination system includes multiple light sources for providing multiple light beams to be combined into an illumination light beam. The driving element respectively drives the light sources in a first mode or a second mode, so that the light beams have respective luminous brightness, and the driving element is switched from the first mode to the second mode according to a first signal. The control element provides the first signal to the driving element according to an optical state or a time state of the projection device. The light valve is adapted to convert the illumination light beam into an image light beam. The projection lens is adapted to project the image light beam out of the projection device.Type: GrantFiled: March 24, 2022Date of Patent: February 27, 2024Assignee: Coretronic CorporationInventors: Chi-Fu Liu, Tsung-Hsin Liao, Chun-Li Chen, Hung-Yu Lin
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Publication number: 20230230912Abstract: An electronic package is provided, which includes a substrate structure and an electronic element and a passive element disposed on the substrate structure, where a die placement area and a functional area separated from each other are defined on a surface of a substrate body of the substrate structure, so that a routing layer is arranged with linear conductive traces with a smaller width in the die placement area, and a sheet-shaped circuit with a larger width and electrically connected to the linear conductive traces is arranged in the functional area, so as to reduce a metal area on the surface of the substrate body, thereby avoiding the problem of warpage caused by stress concentration in the die placement area.Type: ApplicationFiled: December 8, 2022Publication date: July 20, 2023Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Wan-Rou CHEN, Yi-Wen LIU, Hsiu-Jung LI, Yi-Chen CHI, Tsung-Li LIN
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Patent number: 11476572Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.Type: GrantFiled: January 23, 2020Date of Patent: October 18, 2022Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Chih-Yuan Shih, Chih-Hsien Chiu, Yueh-Chiung Chang, Tsung-Li Lin, Chi-Pin Tsai, Chien-Cheng Lin, Tsung-Hsien Tsai, Heng-Cheng Chu, Ming-Fan Tsai
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Patent number: 11437325Abstract: An electronic package is provided and has a packaging substrate including a ground pad and a power pad. The power pad surrounds at least three directions of the ground pad so as to increase the footprint of the power pad on the packaging substrate, thereby avoiding cracking of an electronic element disposed on the packaging substrate and effectively reducing the voltage drop.Type: GrantFiled: July 30, 2020Date of Patent: September 6, 2022Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Ho-Chuan Lin, Hsiu-Fang Chien, Chih-Yuan Shih, Tsung-Li Lin
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Publication number: 20210358851Abstract: An electronic package is provided and has a packaging substrate including a ground pad and a power pad. The power pad surrounds at least three directions of the ground pad so as to increase the footprint of the power pad on the packaging substrate, thereby avoiding cracking of an electronic element disposed on the packaging substrate and effectively reducing the voltage drop.Type: ApplicationFiled: July 30, 2020Publication date: November 18, 2021Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Ho-Chuan Lin, Hsiu-Fang Chien, Chih-Yuan Shih, Tsung-Li Lin
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Publication number: 20200161756Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.Type: ApplicationFiled: January 23, 2020Publication date: May 21, 2020Inventors: Chih-Yuan Shih, Chih-Hsien Chiu, Yueh-Chiung Chang, Tsung-Li Lin, Chi-Pin Tsai, Chien-Cheng Lin, Tsung-Hsien Tsai, Heng-Cheng Chu, Ming-Fan Tsai
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Patent number: 10587041Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.Type: GrantFiled: May 16, 2017Date of Patent: March 10, 2020Assignee: Silicon Precision Industries Co., Ltd.Inventors: Chih-Yuan Shih, Chih-Hsien Chiu, Yueh-Chiung Chang, Tsung-Li Lin, Chi-Pin Tsai, Chien-Cheng Lin, Tsung-Hsien Tsai, Heng-Cheng Chu, Ming-Fan Tsai
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Publication number: 20180090835Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.Type: ApplicationFiled: May 16, 2017Publication date: March 29, 2018Inventors: Chih-Yuan Shih, Chih-Hsien Chiu, Yueh-Chiung Chang, Tsung-Li Lin, Chi-Pin Tsai, Chien-Cheng Lin, Tsung-Hsien Tsai, Heng-Cheng Chu, Ming-Fan Tsai
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Patent number: 9527962Abstract: A series of novel phosphorus-containing compounds having the following formula is provided: in which: R1-R4, A, Q and m are as defined in the specification. A process for the preparation of the compound of formula (I) is also provided. A polymer of formula (PA), and preparation process and use thereof are further provided. A polymer of formula (PI), and preparation process and use thereof are also provided.Type: GrantFiled: April 14, 2015Date of Patent: December 27, 2016Assignees: Chang Chun Plastics Co., Ltd., National Chung Hsing UniversityInventors: Ching-Hsuan Lin, Tsung Li Lin, Yu-Ting Fang, Kuen-Yuan Hwang, An-Pang Tu
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Patent number: 9217061Abstract: A series of novel phosphorus-containing compounds having the formula: is provided in which R1-R4, A, Q and m are as defined in the specification. A process for the preparation of the compound of formula (I) is also provided. A polymer of formula (PA), and preparation process and use thereof, as well as a polymer of formula (PI), and preparation process and use thereof are also provided.Type: GrantFiled: October 31, 2013Date of Patent: December 22, 2015Assignees: Chang Chun Plastics Co., Ltd., National Chung Hsing UniversityInventors: Ching-Hsuan Lin, Tsung Li Lin, Yu-Ting Fang, Kuen-Yuan Hwang, An-Pang Tu
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Publication number: 20150218316Abstract: A series of novel phosphorus-containing compounds having the following formula is provided: in which: R1-R4, A, Q and m are as defined in the specification. A process for the preparation of the compound of formula (I) is also provided. A polymer of formula (PA), and preparation process and use thereof are further provided. A polymer of formula (PI), and preparation process and use thereof are also provided.Type: ApplicationFiled: April 14, 2015Publication date: August 6, 2015Inventors: Ching-Hsuan LIN, Tsung Li LIN, Yu-Ting FANG, Kuen-Yuan HWANG, An-Pang TU
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Patent number: 8791229Abstract: A series of novel phosphorus-containing compounds having the following formula is provided: in which: R1-R4, A, Q and m are as defined in the specification. A process for the preparation of the compound of formula (I) is also provided. A polymer of formula (PA), and preparation process and use thereof are further provided. A polymer of formula (PI), and preparation process and use thereof are also provided.Type: GrantFiled: September 14, 2012Date of Patent: July 29, 2014Assignees: Chang Chun Plastics Co., Ltd., National Chung Hsing UniversityInventors: Ching-Hsuan Lin, Tsung Li Lin, Yu-Ting Fang, Kuen-Yuan Hwang, An-Pang Tu
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Publication number: 20140088283Abstract: A series of novel phosphorus-containing compounds having the following formula is provided: in which: R1-R4, A, Q and m are as defined in the specification. A process for the preparation of the compound of formula (I) is also provided. A polymer of formula (PA), and preparation process and use thereof are further provided. A polymer of formula (PI), and preparation process and use thereof are also provided.Type: ApplicationFiled: October 31, 2013Publication date: March 27, 2014Applicants: National Chung Hsing University, Chang Chun Plastics Co., Ltd.Inventors: Ching-Hsuan LIN, Tsung Li Lin, Yu-Ting Fang, Kuen-Yuan Hwang, An-Pang Tu
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Patent number: 8598307Abstract: A series of novel phosphorus-containing compounds having the following formula is provided: in which: R1-R4, A, Q and m are as defined in the specification. A process for the preparation of the compound of formula (I) is also provided. A polymer of formula (PA), and preparation process and use thereof are further provided. A polymer of formula (PI), and preparation process and use thereof are also provided.Type: GrantFiled: September 14, 2012Date of Patent: December 3, 2013Assignees: Chang Chun Plastics Co., Ltd., National Chung Hsing UniversityInventors: Ching-Hsuan Lin, Tsung Li Lin, Yu-Ting Fang, Kuen-Yuan Hwang, An-Pang Tu
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Publication number: 20130005938Abstract: A series of novel phosphorus-containing compounds having the following formula is provided: in which: R1-R4, A, Q and m are as defined in the specification. A process for the preparation of the compound of formula (I) is also provided. A polymer of formula (PA), and preparation process and use thereof are further provided. A polymer of formula (PI), and preparation process and use thereof are also provided.Type: ApplicationFiled: September 14, 2012Publication date: January 3, 2013Applicants: NATIONAL CHUNG HSING UNIVERSITY, CHANG CHUN PLASTICS CO., LTD.Inventors: Ching-Hsuan LIN, Tsung Li LIN, Yu-Ting FANG, Kuen-Yuan HWANG, An-Pang TU
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Patent number: 8293865Abstract: A series of novel phosphorus-containing compounds having the following formula is provided: in which: R1-R4, A, Q and m are as defined in the specification. A process for the preparation of the compound of formula (I) is also provided. A polymer of formula (PA), and preparation process and use thereof are further provided. A polymer of formula (PI), and preparation process and use thereof are also provided.Type: GrantFiled: July 2, 2009Date of Patent: October 23, 2012Assignees: Chang Chun Plastics Co., Ltd., National Chung Hsing UniversityInventors: Ching-Hsuan Lin, Tsung Li Lin, Yu-Ting Fang, Kuen-Yuan Hwang, An-Pang Tu
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Patent number: 8242266Abstract: The Phosphorus-containing bisphenols and preparing method thereof are disclosed. A method for producing the phosphorus-containing bisphenol of the formula (1) includes reacting compounds respectively defined by a formula (a), (b), (c) and an acid catalyst to yield compounds of phosphorus-containing bisphenol.Type: GrantFiled: January 19, 2012Date of Patent: August 14, 2012Assignees: National Chunghsing University, Chang Chun Plastics Co., LtdInventors: Ching-Hsuan Lin, Chia-Wei Chang, Tsung-Li Lin, Kuen-Yuan Hwang, An-Pang Tu, Fang-Hsien Su
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Patent number: 8222441Abstract: A series of novel phosphorus-containing compounds having the following formula are disclosed: wherein R1-R12, A, B, D, X, and Y are as defined in the specification. A process for the preparation of the compound of formula (1), a curing agent, and a flame resistant epoxy resin and a preparation process thereof are also provided.Type: GrantFiled: April 13, 2009Date of Patent: July 17, 2012Assignees: Chang Chun Plastics Co., Ltd., National Chung Hsing UniversityInventors: Ching-Hsuan Lin, Tsung Li Lin, Chia Wei Chang, Kuen-Yuan Hwang, An-Pang Tu, Fang-Hsien Su