Patents by Inventor Tsung-Liang Lin
Tsung-Liang Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210005554Abstract: In an embodiment, a device includes: a back-side redistribution structure including: a metallization pattern on a first dielectric layer; and a second dielectric layer on the metallization pattern; a through via extending through the first dielectric layer to contact the metallization pattern; an integrated circuit die adjacent the through via on the first dielectric layer; a molding compound on the first dielectric layer, the molding compound encapsulating the through via and the integrated circuit die; a conductive connector extending through the second dielectric layer to contact the metallization pattern, the conductive connector being electrically connected to the through via; and an intermetallic compound at the interface of the conductive connector and the metallization pattern, the intermetallic compound extending only partially into the metallization pattern.Type: ApplicationFiled: September 21, 2020Publication date: January 7, 2021Inventors: Tzu-Sung Huang, Hsiu-Jen Lin, Hao-Yi Tsai, Ming Hung Tseng, Tsung-Hsien Chiang, Tin-Hao Kuo, Yen-Liang Lin
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Patent number: 10784203Abstract: In an embodiment, a device includes: a back-side redistribution structure including: a metallization pattern on a first dielectric layer; and a second dielectric layer on the metallization pattern; a through via extending through the first dielectric layer to contact the metallization pattern; an integrated circuit die adjacent the through via on the first dielectric layer; a molding compound on the first dielectric layer, the molding compound encapsulating the through via and the integrated circuit die; a conductive connector extending through the second dielectric layer to contact the metallization pattern, the conductive connector being electrically connected to the through via; and an intermetallic compound at the interface of the conductive connector and the metallization pattern, the intermetallic compound extending only partially into the metallization pattern.Type: GrantFiled: February 28, 2018Date of Patent: September 22, 2020Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tzu-Sung Huang, Hsiu-Jen Lin, Hao-Yi Tsai, Ming Hung Tseng, Tsung-Hsien Chiang, Tin-Hao Kuo, Yen-Liang Lin
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Publication number: 20200070005Abstract: A muscle training equipment configured to train at least one target muscle of human body and including frame, at least one vibration detector, and at least one resistance adjustment assembly. The at least one vibration detector is configured to be disposed on the at least one target muscle so as to produce at least one muscle vibration signal based on the activity of the at least one target muscle. The at least one resistance adjustment assembly includes motor, handle and linkage assembly. The motor is disposed on the frame and has resistance-adjustable shaft. An end of the linkage assembly is fixed to the resistance-adjustable shaft, and another end of the linkage assembly is pivotally connected to the handle. The at least one resistance adjustment assembly is configured to adjust a resistance force applied on the resistance-adjustable shaft according to the at least one muscle vibration signal.Type: ApplicationFiled: August 16, 2019Publication date: March 5, 2020Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Tsung-Chi LIN, Jyun-Liang PAN, Kai-Jen PAI, Zhong-We LIAO, Yen-Chung CHANG, Szu-Han TZAO, Ching Yi LIU
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Patent number: 10572929Abstract: A decision factors analyzing device and a decision factors analyzing device for analyzing a plurality of decision factors which cause a product of a product type to be purchased are provided. The method includes identifying a plurality of product sequences corresponding to the product type from a plurality of browse history data and a plurality of purchase history data corresponding to a plurality of consumers of a consumer database, wherein each of the product sequences includes a unpurchased product and a purchased product; obtaining a feature sequence according to the produce sequences and a plurality of product information; training a regression model corresponding to the product type according to K decision factors of the feature sequence to obtain an optimized regression model, and obtaining K decision values respectively corresponding to the K decision factors according to the optimized regression model to generate a decision factor sequence corresponding to the product type.Type: GrantFiled: December 25, 2017Date of Patent: February 25, 2020Assignee: Industrial Technology Research InstituteInventors: Cheng-Liang Lin, Jie-Sin Li, En-Tzu Wang, Jyun-Tang Huang, Tsung-Wen Tso
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Publication number: 20190164213Abstract: A decision factors analyzing device and a decision factors analyzing device for analyzing a plurality of decision factors which cause a product of a product type to be purchased are provided. The method includes identifying a plurality of product sequences corresponding to the product type from a plurality of browse history data and a plurality of purchase history data corresponding to a plurality of consumers of a consumer database, wherein each of the product sequences includes a unpurchased product and a purchased product; obtaining a feature sequence according to the produce sequences and a plurality of product information; training a regression model corresponding to the product type according to K decision factors of the feature sequence to obtain an optimized regression model, and obtaining K decision values respectively corresponding to the K decision factors according to the optimized regression model to generate a decision factor sequence corresponding to the product type.Type: ApplicationFiled: December 25, 2017Publication date: May 30, 2019Applicant: Industrial Technology Research InstituteInventors: Cheng-Liang Lin, Jie-Sin Li, En-Tzu Wang, Jyun-Tang Huang, Tsung-Wen Tso
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Publication number: 20190148301Abstract: In an embodiment, a device includes: a back-side redistribution structure including: a metallization pattern on a first dielectric layer; and a second dielectric layer on the metallization pattern; a through via extending through the first dielectric layer to contact the metallization pattern; an integrated circuit die adjacent the through via on the first dielectric layer; a molding compound on the first dielectric layer, the molding compound encapsulating the through via and the integrated circuit die; a conductive connector extending through the second dielectric layer to contact the metallization pattern, the conductive connector being electrically connected to the through via; and an intermetallic compound at the interface of the conductive connector and the metallization pattern, the intermetallic compound extending only partially into the metallization pattern.Type: ApplicationFiled: February 28, 2018Publication date: May 16, 2019Inventors: Tzu-Sung Huang, Hsiu-Jen Lin, Hao-Yi Tsai, Ming Hung Tseng, Tsung-Hsien Chiang, Tin-Hao Kuo, Yen-Liang Lin
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Publication number: 20140157297Abstract: A marketing method for combining a plurality of marketing information and a cloud system including a display device, a network server and a mobile device is disclosed. The marketing method includes obtaining a recognition information corresponding to at least a marketing information to process a video information to be a processed video information, installing an application software in the mobile device, displaying the processed video information on the display device, utilizing the application software and a detection module of the mobile device to obtain the recognition information while displaying the processed video information, and utilizing the network server to obtain a search result corresponding to the marketing information according to the recognition information.Type: ApplicationFiled: February 26, 2013Publication date: June 5, 2014Applicant: WISTRON CORPORATIONInventors: Ko-Li Chao, Tsung-Liang Lin, Bee Chien Jenny Chew, Ming-Hung Cheng, Kai-Hsien Yang, Ding-Teng Shih
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Patent number: 7430235Abstract: An apparatus for providing a multi-mode interface between a baseband receiver and radio frequency (RF) circuitry. According to a preferred embodiment of the invention, the apparatus includes a first differential-to-single-ended converter, a second differential-to-single-ended converter and an analog-to-digital converter. The first differential-to-single-ended converter receives an incoming differential current pair to be converted into a first single-ended voltage signal. The second differential-to-single-ended converter receives an incoming differential voltage pair to be converted into a second single-ended voltage signal. Further, the analog-to-digital converter selectively receives an incoming single-ended voltage signal, the first single-ended voltage signal, or the second single-ended voltage signal to be converted into a digital signal to be further processed by the baseband processor.Type: GrantFiled: February 8, 2006Date of Patent: September 30, 2008Assignee: Mediatek Inc.Inventors: Tai-Yuan Cheng, Yi-Huei Chen, Jui-Hsi Cheng, Tsung-Liang Lin, Shu-Ping Hsu
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Patent number: 7088789Abstract: An apparatus for providing a multi-mode interface between a baseband receiver and radio frequency (RF) circuitry. According to a preferred embodiment of the invention, the apparatus includes a first differential-to-single-ended converter, a second differential-to-single-ended converter and an analog-to-digital converter. The first differential-to-single-ended converter receives an incoming differential current pair to be converted into a first single-ended voltage signal. The second differential-to-single-ended converter receives an incoming differential voltage pair to be converted into a second single-ended voltage signal. Further, the analog-to-digital converter selectively receives an incoming single-ended voltage signal, the first single-ended voltage signal, or the second single-ended voltage signal to be converted into a digital signal to be further processed by the baseband processor.Type: GrantFiled: November 18, 2002Date of Patent: August 8, 2006Assignee: Mediatek Inc.Inventors: Tai-Yuan Cheng, Yi-Huei Chen, Jui-Hsi Cheng, Tsung-Liang Lin, Shu-Ping Hsu
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Patent number: 7071880Abstract: An antenna structure has a substrate, having a first-side surface and a second-side surface. A first antenna substructure on the first-side surface has a first straight metal line and a second straight metal line. The second straight metal line joins to the first straight metal line, and is substantially perpendicular to the first straight metal line. A second antenna substructure disposed on the second-side surface has a metal plate, serving as a ground, wherein the first straight metal line is overlapping with the metal plate. An L-shape metal line protrudes from the metal plate, wherein a portion of the L-shape metal line is parallel and overlapping with the second straight metal line, and a portion of the L-shape metal line is parallel to the first straight metal line without overlapping.Type: GrantFiled: April 26, 2005Date of Patent: July 4, 2006Assignee: MediaTek IncorporationInventors: Ming-Chou Lee, Jan-Kwo Leeng, Tsung-Liang Lin
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Publication number: 20060126758Abstract: An apparatus for providing a multi-mode interface between a baseband receiver and radio frequency (RF) circuitry. According to a preferred embodiment of the invention, the apparatus includes a first differential-to-single-ended converter, a second differential-to-single-ended converter and an analog-to-digital converter. The first differential-to-single-ended converter receives an incoming differential current pair to be converted into a first single-ended voltage signal. The second differential-to-single-ended converter receives an incoming differential voltage pair to be converted into a second single-ended voltage signal. Further, the analog-to-digital converter selectively receives an incoming single-ended voltage signal, the first single-ended voltage signal, or the second single-ended voltage signal to be converted into a digital signal to be further processed by the baseband processor.Type: ApplicationFiled: February 8, 2006Publication date: June 15, 2006Inventors: Tai-Yuan Cheng, Yi-Huei Chen, Jui-Hsi Cheng, Tsung-Liang Lin, Shu-Ping Hsu
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Patent number: 7012570Abstract: An antenna on a printed circuit board (PCB) with a compensating capacitor. The antenna has a radiator disposed over a first surface of the PCB. Wherein the radiator includes a signal feeding section and a tuning section coupled together at a joint. The tuning section includes a bending portion. Also and, a ground layer with or without a protuding portion is disposed on a second surface of the PCB, wherein the bending portion of the tuning section is overlapping with the ground layer to form the compensating capacitor. In addition, the radiator can also have a short circuit stub section, electrically coupled to the ground layer.Type: GrantFiled: September 8, 2003Date of Patent: March 14, 2006Assignee: Mediatek IncorporationInventors: Kai-Te Chen, Jan-Kwo Leeng, Tsung-Liang Lin
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Publication number: 20050237240Abstract: An antenna structure has a substrate, having a first-side surface and a second-side surface. A first antenna substructure on the first-side surface has a first straight metal line and a second straight metal line. The second straight metal line joins to the first straight metal line, and is substantially perpendicular to the first straight metal line. A second antenna substructure disposed on the second-side surface has a metal plate, serving as a ground, wherein the first straight metal line is overlapping with the metal plate. An L-shape metal line protrudes from the metal plate, wherein a portion of the L-shape metal line is parallel and overlapping with the second straight metal line, and a portion of the L-shape metal line is parallel to the first straight metal line without overlapping.Type: ApplicationFiled: April 26, 2005Publication date: October 27, 2005Inventors: Ming-Chou Lee, Jan-Kwo Leeng, Tsung-Liang Lin
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Publication number: 20050159180Abstract: A preferred embodiment of the invention advantageously provides a method for integrating a plurality of radio systems in a unified transceiver structure and the device of the same. According to this general embodiment of the invention, all components for the necessary communication protocols of a device are determined by selecting the operation ranges of the components and designing a mechanism to adjust the operation parameters of the shared components for conforming to the utilized communications system. Therefore, only one radio frequency (RF) module is required for a communications device having a plurality of communication systems. An end user can advantageously carry a single and compact wireless device for various communications systems.Type: ApplicationFiled: February 23, 2005Publication date: July 21, 2005Inventors: Jui-Hsi Cheng, Tsung-Liang Lin
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Patent number: 6876836Abstract: A layout of a wireless communication circuit on a printed circuit board (PCB), which is a rectangular board wherein a first side is a Y-axis and a second side is an X-axis. The layout has a first antenna located at a corner between the first side and the second side. An antenna switch and a first filter are located at middle y-coordinate and a X-coordinate. A RF integrated circuit (RFIC) is located after the first filter. A first regulator is located near the second side and higher than the RFIC. A media access control (MAC) is located at about a middle y-coordinate and higher than the first regulator. An oscillator is located at a corner between the second side and the third side. A second regulator is located near the fourth side and above the first regulator. A power amplifier is located near the fourth side above the RFIC. A second filter and a transmitting/receiving (T/R) switch are located before the power amplifier. A second antenna is located at a corner between the first side and the fourth side.Type: GrantFiled: July 25, 2002Date of Patent: April 5, 2005Assignee: Integrated Programmable Communications, Inc.Inventors: Tsung-Liang Lin, Tsung-Lu Tsai, Jan-Kwo Leeng
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Publication number: 20040227672Abstract: An antenna on a printed circuit board (PCB) with a compensating capacitor. The antenna has a radiator disposed over a first surface of the PCB. Wherein the radiator includes a signal feeding section and a tuning section coupled together at a joint. The tuning section includes a bending portion. Also and, a ground layer with or without a protuding portion is disposed on a second surface of the PCB, wherein the bending portion of the tuning section is overlapping with the ground layer to form the compensating capacitor. In addition, the radiator can also have a short circuit stub section, electrically coupled to the ground layer.Type: ApplicationFiled: September 8, 2003Publication date: November 18, 2004Inventors: Kai-Te Chen, Jan-Kwo Leeng, Tsung-Liang Lin
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Publication number: 20040222833Abstract: The embodiment of the present invention provides a joint clock source coupling architecture of a time division duplex (TDD) transceiver to minimize a circuit element interference and stabilize a performance of a circuit element within the TDD transceiver. Thereby, a communication link of the TDD transceiver is ensured, and a throughput of the TDD transceiver is increased.Type: ApplicationFiled: August 22, 2003Publication date: November 11, 2004Inventors: Tsung-Liang Lin, Chung-Ju Tsai, Jan-Kwo Leeng
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Publication number: 20040018815Abstract: A wireless communication circuit has a first and second antennas. The second antenna is also set for use as a transmitting antenna. An antenna switch respectively receives signals from the first and second antennas and selects one of the signals. A first filter is used to receive the output signal from the antenna switch. A RFIC unit is used to receive an output signal from the first filter during the receiving mode as well as output a transmitting signal during the transmitting mode. A power amplifier is used to receive the signal and amplify the signal. A second filter receives the amplified transmitting signal to filter away an undesired frequency noise. Also and, a transmission/receiving (T/R) switch receives the transmitting signal from the second filter, wherein the T/R switch can also be switched to allow the signal received from the second antenna to be output to the second terminal of the antenna switch.Type: ApplicationFiled: July 25, 2002Publication date: January 29, 2004Inventors: Tsung-Liang Lin, Jan-Kwo Leeng
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Publication number: 20040018814Abstract: A layout of a wireless communication circuit on a printed circuit board (PCB), which is a rectangular board wherein a first side is a Y-axis and a second side is an X-axis. The layout has a first antenna located at a corner between the first side and the second side. An antenna switch and a first filter are located at middle y-coordinate and a X-coordinate. A RF integrated circuit (RFIC) is located after the first filter. A first regulator is located near the second side and higher than the RFIC. A media access control (MAC) is located at about a middle y-coordinate and higher than the first regulator. An oscillator is located at a corner between the second side and the third side. A second regulator is located near the fourth side and above the first regulator. A power amplifier is located near the fourth side above the RFIC. A second filter and a transmitting/receiving (T/R) switch are located before the power amplifier. A second antenna is located at a corner between the first side and the fourth side.Type: ApplicationFiled: July 25, 2002Publication date: January 29, 2004Inventors: Tsung-Liang Lin, Tsung-Lu Tsai, Jan-Kwo Leeng
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Publication number: 20040013181Abstract: An apparatus for providing a multi-mode interface between a baseband receiver and radio frequency (RF) circuitry. According to a preferred embodiment of the invention, the apparatus includes a first differential-to-single-ended converter, a second differential-to-single-ended converter and an analog-to-digital converter. The first differential-to-single-ended converter receives an incoming differential current pair to be converted into a first single-ended voltage signal. The second differential-to-single-ended converter receives an incoming differential voltage pair to be converted into a second single-ended voltage signal. Further, the analog-to-digital converter selectively receives an incoming single-ended voltage signal, the first single-ended voltage signal, or the second single-ended voltage signal to be converted into a digital signal to be further processed by the baseband processor.Type: ApplicationFiled: November 18, 2002Publication date: January 22, 2004Inventors: Tai-Yuan Cheng, Yi-Huei Chen, Jui-Hsi Cheng, Tsung-Liang Lin, Shu-Ping Hsu