Patents by Inventor Tsung-Liang Lin

Tsung-Liang Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210005554
    Abstract: In an embodiment, a device includes: a back-side redistribution structure including: a metallization pattern on a first dielectric layer; and a second dielectric layer on the metallization pattern; a through via extending through the first dielectric layer to contact the metallization pattern; an integrated circuit die adjacent the through via on the first dielectric layer; a molding compound on the first dielectric layer, the molding compound encapsulating the through via and the integrated circuit die; a conductive connector extending through the second dielectric layer to contact the metallization pattern, the conductive connector being electrically connected to the through via; and an intermetallic compound at the interface of the conductive connector and the metallization pattern, the intermetallic compound extending only partially into the metallization pattern.
    Type: Application
    Filed: September 21, 2020
    Publication date: January 7, 2021
    Inventors: Tzu-Sung Huang, Hsiu-Jen Lin, Hao-Yi Tsai, Ming Hung Tseng, Tsung-Hsien Chiang, Tin-Hao Kuo, Yen-Liang Lin
  • Patent number: 10784203
    Abstract: In an embodiment, a device includes: a back-side redistribution structure including: a metallization pattern on a first dielectric layer; and a second dielectric layer on the metallization pattern; a through via extending through the first dielectric layer to contact the metallization pattern; an integrated circuit die adjacent the through via on the first dielectric layer; a molding compound on the first dielectric layer, the molding compound encapsulating the through via and the integrated circuit die; a conductive connector extending through the second dielectric layer to contact the metallization pattern, the conductive connector being electrically connected to the through via; and an intermetallic compound at the interface of the conductive connector and the metallization pattern, the intermetallic compound extending only partially into the metallization pattern.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: September 22, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Sung Huang, Hsiu-Jen Lin, Hao-Yi Tsai, Ming Hung Tseng, Tsung-Hsien Chiang, Tin-Hao Kuo, Yen-Liang Lin
  • Publication number: 20200070005
    Abstract: A muscle training equipment configured to train at least one target muscle of human body and including frame, at least one vibration detector, and at least one resistance adjustment assembly. The at least one vibration detector is configured to be disposed on the at least one target muscle so as to produce at least one muscle vibration signal based on the activity of the at least one target muscle. The at least one resistance adjustment assembly includes motor, handle and linkage assembly. The motor is disposed on the frame and has resistance-adjustable shaft. An end of the linkage assembly is fixed to the resistance-adjustable shaft, and another end of the linkage assembly is pivotally connected to the handle. The at least one resistance adjustment assembly is configured to adjust a resistance force applied on the resistance-adjustable shaft according to the at least one muscle vibration signal.
    Type: Application
    Filed: August 16, 2019
    Publication date: March 5, 2020
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Tsung-Chi LIN, Jyun-Liang PAN, Kai-Jen PAI, Zhong-We LIAO, Yen-Chung CHANG, Szu-Han TZAO, Ching Yi LIU
  • Patent number: 10572929
    Abstract: A decision factors analyzing device and a decision factors analyzing device for analyzing a plurality of decision factors which cause a product of a product type to be purchased are provided. The method includes identifying a plurality of product sequences corresponding to the product type from a plurality of browse history data and a plurality of purchase history data corresponding to a plurality of consumers of a consumer database, wherein each of the product sequences includes a unpurchased product and a purchased product; obtaining a feature sequence according to the produce sequences and a plurality of product information; training a regression model corresponding to the product type according to K decision factors of the feature sequence to obtain an optimized regression model, and obtaining K decision values respectively corresponding to the K decision factors according to the optimized regression model to generate a decision factor sequence corresponding to the product type.
    Type: Grant
    Filed: December 25, 2017
    Date of Patent: February 25, 2020
    Assignee: Industrial Technology Research Institute
    Inventors: Cheng-Liang Lin, Jie-Sin Li, En-Tzu Wang, Jyun-Tang Huang, Tsung-Wen Tso
  • Publication number: 20190164213
    Abstract: A decision factors analyzing device and a decision factors analyzing device for analyzing a plurality of decision factors which cause a product of a product type to be purchased are provided. The method includes identifying a plurality of product sequences corresponding to the product type from a plurality of browse history data and a plurality of purchase history data corresponding to a plurality of consumers of a consumer database, wherein each of the product sequences includes a unpurchased product and a purchased product; obtaining a feature sequence according to the produce sequences and a plurality of product information; training a regression model corresponding to the product type according to K decision factors of the feature sequence to obtain an optimized regression model, and obtaining K decision values respectively corresponding to the K decision factors according to the optimized regression model to generate a decision factor sequence corresponding to the product type.
    Type: Application
    Filed: December 25, 2017
    Publication date: May 30, 2019
    Applicant: Industrial Technology Research Institute
    Inventors: Cheng-Liang Lin, Jie-Sin Li, En-Tzu Wang, Jyun-Tang Huang, Tsung-Wen Tso
  • Publication number: 20190148301
    Abstract: In an embodiment, a device includes: a back-side redistribution structure including: a metallization pattern on a first dielectric layer; and a second dielectric layer on the metallization pattern; a through via extending through the first dielectric layer to contact the metallization pattern; an integrated circuit die adjacent the through via on the first dielectric layer; a molding compound on the first dielectric layer, the molding compound encapsulating the through via and the integrated circuit die; a conductive connector extending through the second dielectric layer to contact the metallization pattern, the conductive connector being electrically connected to the through via; and an intermetallic compound at the interface of the conductive connector and the metallization pattern, the intermetallic compound extending only partially into the metallization pattern.
    Type: Application
    Filed: February 28, 2018
    Publication date: May 16, 2019
    Inventors: Tzu-Sung Huang, Hsiu-Jen Lin, Hao-Yi Tsai, Ming Hung Tseng, Tsung-Hsien Chiang, Tin-Hao Kuo, Yen-Liang Lin
  • Publication number: 20140157297
    Abstract: A marketing method for combining a plurality of marketing information and a cloud system including a display device, a network server and a mobile device is disclosed. The marketing method includes obtaining a recognition information corresponding to at least a marketing information to process a video information to be a processed video information, installing an application software in the mobile device, displaying the processed video information on the display device, utilizing the application software and a detection module of the mobile device to obtain the recognition information while displaying the processed video information, and utilizing the network server to obtain a search result corresponding to the marketing information according to the recognition information.
    Type: Application
    Filed: February 26, 2013
    Publication date: June 5, 2014
    Applicant: WISTRON CORPORATION
    Inventors: Ko-Li Chao, Tsung-Liang Lin, Bee Chien Jenny Chew, Ming-Hung Cheng, Kai-Hsien Yang, Ding-Teng Shih
  • Patent number: 7430235
    Abstract: An apparatus for providing a multi-mode interface between a baseband receiver and radio frequency (RF) circuitry. According to a preferred embodiment of the invention, the apparatus includes a first differential-to-single-ended converter, a second differential-to-single-ended converter and an analog-to-digital converter. The first differential-to-single-ended converter receives an incoming differential current pair to be converted into a first single-ended voltage signal. The second differential-to-single-ended converter receives an incoming differential voltage pair to be converted into a second single-ended voltage signal. Further, the analog-to-digital converter selectively receives an incoming single-ended voltage signal, the first single-ended voltage signal, or the second single-ended voltage signal to be converted into a digital signal to be further processed by the baseband processor.
    Type: Grant
    Filed: February 8, 2006
    Date of Patent: September 30, 2008
    Assignee: Mediatek Inc.
    Inventors: Tai-Yuan Cheng, Yi-Huei Chen, Jui-Hsi Cheng, Tsung-Liang Lin, Shu-Ping Hsu
  • Patent number: 7088789
    Abstract: An apparatus for providing a multi-mode interface between a baseband receiver and radio frequency (RF) circuitry. According to a preferred embodiment of the invention, the apparatus includes a first differential-to-single-ended converter, a second differential-to-single-ended converter and an analog-to-digital converter. The first differential-to-single-ended converter receives an incoming differential current pair to be converted into a first single-ended voltage signal. The second differential-to-single-ended converter receives an incoming differential voltage pair to be converted into a second single-ended voltage signal. Further, the analog-to-digital converter selectively receives an incoming single-ended voltage signal, the first single-ended voltage signal, or the second single-ended voltage signal to be converted into a digital signal to be further processed by the baseband processor.
    Type: Grant
    Filed: November 18, 2002
    Date of Patent: August 8, 2006
    Assignee: Mediatek Inc.
    Inventors: Tai-Yuan Cheng, Yi-Huei Chen, Jui-Hsi Cheng, Tsung-Liang Lin, Shu-Ping Hsu
  • Patent number: 7071880
    Abstract: An antenna structure has a substrate, having a first-side surface and a second-side surface. A first antenna substructure on the first-side surface has a first straight metal line and a second straight metal line. The second straight metal line joins to the first straight metal line, and is substantially perpendicular to the first straight metal line. A second antenna substructure disposed on the second-side surface has a metal plate, serving as a ground, wherein the first straight metal line is overlapping with the metal plate. An L-shape metal line protrudes from the metal plate, wherein a portion of the L-shape metal line is parallel and overlapping with the second straight metal line, and a portion of the L-shape metal line is parallel to the first straight metal line without overlapping.
    Type: Grant
    Filed: April 26, 2005
    Date of Patent: July 4, 2006
    Assignee: MediaTek Incorporation
    Inventors: Ming-Chou Lee, Jan-Kwo Leeng, Tsung-Liang Lin
  • Publication number: 20060126758
    Abstract: An apparatus for providing a multi-mode interface between a baseband receiver and radio frequency (RF) circuitry. According to a preferred embodiment of the invention, the apparatus includes a first differential-to-single-ended converter, a second differential-to-single-ended converter and an analog-to-digital converter. The first differential-to-single-ended converter receives an incoming differential current pair to be converted into a first single-ended voltage signal. The second differential-to-single-ended converter receives an incoming differential voltage pair to be converted into a second single-ended voltage signal. Further, the analog-to-digital converter selectively receives an incoming single-ended voltage signal, the first single-ended voltage signal, or the second single-ended voltage signal to be converted into a digital signal to be further processed by the baseband processor.
    Type: Application
    Filed: February 8, 2006
    Publication date: June 15, 2006
    Inventors: Tai-Yuan Cheng, Yi-Huei Chen, Jui-Hsi Cheng, Tsung-Liang Lin, Shu-Ping Hsu
  • Patent number: 7012570
    Abstract: An antenna on a printed circuit board (PCB) with a compensating capacitor. The antenna has a radiator disposed over a first surface of the PCB. Wherein the radiator includes a signal feeding section and a tuning section coupled together at a joint. The tuning section includes a bending portion. Also and, a ground layer with or without a protuding portion is disposed on a second surface of the PCB, wherein the bending portion of the tuning section is overlapping with the ground layer to form the compensating capacitor. In addition, the radiator can also have a short circuit stub section, electrically coupled to the ground layer.
    Type: Grant
    Filed: September 8, 2003
    Date of Patent: March 14, 2006
    Assignee: Mediatek Incorporation
    Inventors: Kai-Te Chen, Jan-Kwo Leeng, Tsung-Liang Lin
  • Publication number: 20050237240
    Abstract: An antenna structure has a substrate, having a first-side surface and a second-side surface. A first antenna substructure on the first-side surface has a first straight metal line and a second straight metal line. The second straight metal line joins to the first straight metal line, and is substantially perpendicular to the first straight metal line. A second antenna substructure disposed on the second-side surface has a metal plate, serving as a ground, wherein the first straight metal line is overlapping with the metal plate. An L-shape metal line protrudes from the metal plate, wherein a portion of the L-shape metal line is parallel and overlapping with the second straight metal line, and a portion of the L-shape metal line is parallel to the first straight metal line without overlapping.
    Type: Application
    Filed: April 26, 2005
    Publication date: October 27, 2005
    Inventors: Ming-Chou Lee, Jan-Kwo Leeng, Tsung-Liang Lin
  • Publication number: 20050159180
    Abstract: A preferred embodiment of the invention advantageously provides a method for integrating a plurality of radio systems in a unified transceiver structure and the device of the same. According to this general embodiment of the invention, all components for the necessary communication protocols of a device are determined by selecting the operation ranges of the components and designing a mechanism to adjust the operation parameters of the shared components for conforming to the utilized communications system. Therefore, only one radio frequency (RF) module is required for a communications device having a plurality of communication systems. An end user can advantageously carry a single and compact wireless device for various communications systems.
    Type: Application
    Filed: February 23, 2005
    Publication date: July 21, 2005
    Inventors: Jui-Hsi Cheng, Tsung-Liang Lin
  • Patent number: 6876836
    Abstract: A layout of a wireless communication circuit on a printed circuit board (PCB), which is a rectangular board wherein a first side is a Y-axis and a second side is an X-axis. The layout has a first antenna located at a corner between the first side and the second side. An antenna switch and a first filter are located at middle y-coordinate and a X-coordinate. A RF integrated circuit (RFIC) is located after the first filter. A first regulator is located near the second side and higher than the RFIC. A media access control (MAC) is located at about a middle y-coordinate and higher than the first regulator. An oscillator is located at a corner between the second side and the third side. A second regulator is located near the fourth side and above the first regulator. A power amplifier is located near the fourth side above the RFIC. A second filter and a transmitting/receiving (T/R) switch are located before the power amplifier. A second antenna is located at a corner between the first side and the fourth side.
    Type: Grant
    Filed: July 25, 2002
    Date of Patent: April 5, 2005
    Assignee: Integrated Programmable Communications, Inc.
    Inventors: Tsung-Liang Lin, Tsung-Lu Tsai, Jan-Kwo Leeng
  • Publication number: 20040227672
    Abstract: An antenna on a printed circuit board (PCB) with a compensating capacitor. The antenna has a radiator disposed over a first surface of the PCB. Wherein the radiator includes a signal feeding section and a tuning section coupled together at a joint. The tuning section includes a bending portion. Also and, a ground layer with or without a protuding portion is disposed on a second surface of the PCB, wherein the bending portion of the tuning section is overlapping with the ground layer to form the compensating capacitor. In addition, the radiator can also have a short circuit stub section, electrically coupled to the ground layer.
    Type: Application
    Filed: September 8, 2003
    Publication date: November 18, 2004
    Inventors: Kai-Te Chen, Jan-Kwo Leeng, Tsung-Liang Lin
  • Publication number: 20040222833
    Abstract: The embodiment of the present invention provides a joint clock source coupling architecture of a time division duplex (TDD) transceiver to minimize a circuit element interference and stabilize a performance of a circuit element within the TDD transceiver. Thereby, a communication link of the TDD transceiver is ensured, and a throughput of the TDD transceiver is increased.
    Type: Application
    Filed: August 22, 2003
    Publication date: November 11, 2004
    Inventors: Tsung-Liang Lin, Chung-Ju Tsai, Jan-Kwo Leeng
  • Publication number: 20040018815
    Abstract: A wireless communication circuit has a first and second antennas. The second antenna is also set for use as a transmitting antenna. An antenna switch respectively receives signals from the first and second antennas and selects one of the signals. A first filter is used to receive the output signal from the antenna switch. A RFIC unit is used to receive an output signal from the first filter during the receiving mode as well as output a transmitting signal during the transmitting mode. A power amplifier is used to receive the signal and amplify the signal. A second filter receives the amplified transmitting signal to filter away an undesired frequency noise. Also and, a transmission/receiving (T/R) switch receives the transmitting signal from the second filter, wherein the T/R switch can also be switched to allow the signal received from the second antenna to be output to the second terminal of the antenna switch.
    Type: Application
    Filed: July 25, 2002
    Publication date: January 29, 2004
    Inventors: Tsung-Liang Lin, Jan-Kwo Leeng
  • Publication number: 20040018814
    Abstract: A layout of a wireless communication circuit on a printed circuit board (PCB), which is a rectangular board wherein a first side is a Y-axis and a second side is an X-axis. The layout has a first antenna located at a corner between the first side and the second side. An antenna switch and a first filter are located at middle y-coordinate and a X-coordinate. A RF integrated circuit (RFIC) is located after the first filter. A first regulator is located near the second side and higher than the RFIC. A media access control (MAC) is located at about a middle y-coordinate and higher than the first regulator. An oscillator is located at a corner between the second side and the third side. A second regulator is located near the fourth side and above the first regulator. A power amplifier is located near the fourth side above the RFIC. A second filter and a transmitting/receiving (T/R) switch are located before the power amplifier. A second antenna is located at a corner between the first side and the fourth side.
    Type: Application
    Filed: July 25, 2002
    Publication date: January 29, 2004
    Inventors: Tsung-Liang Lin, Tsung-Lu Tsai, Jan-Kwo Leeng
  • Publication number: 20040013181
    Abstract: An apparatus for providing a multi-mode interface between a baseband receiver and radio frequency (RF) circuitry. According to a preferred embodiment of the invention, the apparatus includes a first differential-to-single-ended converter, a second differential-to-single-ended converter and an analog-to-digital converter. The first differential-to-single-ended converter receives an incoming differential current pair to be converted into a first single-ended voltage signal. The second differential-to-single-ended converter receives an incoming differential voltage pair to be converted into a second single-ended voltage signal. Further, the analog-to-digital converter selectively receives an incoming single-ended voltage signal, the first single-ended voltage signal, or the second single-ended voltage signal to be converted into a digital signal to be further processed by the baseband processor.
    Type: Application
    Filed: November 18, 2002
    Publication date: January 22, 2004
    Inventors: Tai-Yuan Cheng, Yi-Huei Chen, Jui-Hsi Cheng, Tsung-Liang Lin, Shu-Ping Hsu