Patents by Inventor Tsung-Lin Chuang

Tsung-Lin Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240134631
    Abstract: An information handling system includes a memory and a processor. The memory stores a current basic input/output system (BIOS) firmware image. During a regular boot mode of the information handling, the processor creates a first set of tables associated with the current BIOS firmware image, stores the first tables to the memory, and receives a BIOS firmware update image. During a BIOS update boot mode of the information handling system, the processor creates a second plurality of tables associated with the BIOS firmware update image, and compares the first and second tables. In response to a difference being determined between the first and second tables, the processor aborts the BIOS update boot mode and generate an error log.
    Type: Application
    Filed: October 20, 2022
    Publication date: April 25, 2024
    Inventors: Shekar Babu Suryanarayana, Karunakar Poosapalli, Hung V. Ho, James L. Walker, Tsung-Lin Chuang, Chia-Hao Chang, Te-Lung Lin
  • Publication number: 20240087877
    Abstract: A backside metallized compound semiconductor device includes a compound semiconductor wafer and a metal layered structure. The compound semiconductor wafer includes a substrate having opposite front and back surfaces, and a ground pad structure formed on the front surface. The substrate is formed with a via extending from the back surface to the front surface to expose a side wall of the substrate and a portion of the ground pad structure. The metal layered structure is disposed on the back surface, and covers the side wall and the portion of the ground pad structure. The metal layered structure includes an adhesion layer, a seed layer, a gold layer, and an electroplated copper layer that are formed on the back surface in such order. The method for manufacturing the backside metallized compound semiconductor device is also disclosed.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Inventors: Tsung-Te CHIU, Kechuang LIN, Houng-Chi WEI, Chia-Chu KUO, Bing-Han CHUANG