Abstract: Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) package comprising a wire-bond damper. A housing structure overlies a support substrate, and a MEMS structure is between the support substrate and the housing structure. The MEMS structure comprises an anchor, a spring, and a movable mass. The spring extends from the anchor to the movable mass to suspend and allow movement of the movable mass in a cavity between the support substrate and the housing structure. The wire-bond damper is on the movable mass or structure surrounding the movable mass. For example, the wire-bond damper may be on a top surface of the movable mass. As another example, the wire-bond damper may be on the support substrate, laterally between the anchor and the movable mass. Further, the wire-bond damper comprises a wire formed by wire bonding and configured to dampen shock to the movable mass.

Abstract: Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) package comprising a wire-bond damper. A housing structure overlies a support substrate, and a MEMS structure is between the support substrate and the housing structure. The MEMS structure comprises an anchor, a spring, and a movable mass. The spring extends from the anchor to the movable mass to suspend and allow movement of the movable mass in a cavity between the support substrate and the housing structure. The wire-bond damper is on the movable mass or structure surrounding the movable mass. For example, the wire-bond damper may be on a top surface of the movable mass. As another example, the wire-bond damper may be on the support substrate, laterally between the anchor and the movable mass. Further, the wire-bond damper comprises a wire formed by wire bonding and configured to dampen shock to the movable mass.

Abstract: Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) package comprising a wire-bond damper. A housing structure overlies a support substrate, and a MEMS structure is between the support substrate and the housing structure. The MEMS structure comprises an anchor, a spring, and a movable mass. The spring extends from the anchor to the movable mass to suspend and allow movement of the movable mass in a cavity between the support substrate and the housing structure. The wire-bond damper is on the movable mass or structure surrounding the movable mass. For example, the wire-bond damper may be on a top surface of the movable mass. As another example, the wire-bond damper may be on the support substrate, laterally between the anchor and the movable mass. Further, the wire-bond damper comprises a wire formed by wire bonding and configured to dampen shock to the movable mass.

Abstract: An antenna includes a circuit board, a primary antenna, a secondary antenna, and a feeder. The primary antenna is n-shaped and consists of a first middle section, and a first subsection and a second subsection which are connected to the first middle section. The first subsection and the second subsection have different lengths, the first subsection has a first feed point. The secondary antenna has a second feed point which is connected therewith. The primary antenna and the secondary antenna are disposed on the circuit board, and the feeder feeds an electrical signal to the first feed point and the second feed point.

Abstract: The mobile phone includes a printed circuit board (PCB), a metal hinged shield, and a connecting member. The metal hinged shield is pivoted on the PCB by the connecting member. The metal hinged shield further comprises a high metal body and a low metal body. The high metal body partially overlaps the low metal body.

Abstract: The mobile phone includes a printed circuit board (PCB), a metal hinged shield, and a connecting member. The metal hinged shield is pivoted on the PCB by the connecting member. The metal hinged shield further comprises a high metal body and a low metal body. The high metal body partially overlaps the low metal body.

Abstract: An dual-band antenna (100) used in a portable electronic device includes a first antenna unit (10) configured for receiving and/or sending wireless signals in low frequency bands, a second antenna unit (20) configured for receiving and/or sending wireless signals in high frequency bands; a feed unit (30) and a grounding unit (40). The first antenna unit, the second antenna unit and the feed unit are all connected to the grounding unit. A portion of the first antenna unit is positioned between the second antenna unit and the grounding unit. The first antenna unit and the second antenna unit are respectively positioned in different parallel planes.

Abstract: An antenna module used in a portable wireless communication device includes an antenna and a base board. The antenna includes a main portion, a feeding portion, and a grounding portion. The feeding portion and the grounding portion connect to the base board. The base board defines a first slit and a second slit. A coupling area is formed between the first slit and the second slit to resonate with the antenna.

Abstract: A dual-band antenna used in a portable wireless communication device includes a main antenna body, a feed end, and a grounding end. The feed end and the grounding end are positioned on the main antenna body. The main antenna body includes a matching portion for adjusting the match impendence of the dual-band antenna, a first antenna portion a for transmitting/receiving wireless signals in high frequency bands, and a second antenna portion for transmitting/receiving wireless signals in low frequency bands. The first antenna and the second antenna are connected to two opposition end of the matching portion. The matching portion, the first antenna, and the second antenna are coplanar.

Abstract: An dual-band antenna (100) used in a portable electronic device includes a first antenna unit (10) configured for receiving and/or sending wireless signals in low frequency bands, a second antenna unit (20) configured for receiving and/or sending wireless signals in high frequency bands; a feed unit (30) and a grounding unit (40). The first antenna unit, the second antenna unit and the feed unit are all connected to the grounding unit. A portion of the first antenna unit is positioned between the second antenna unit and the grounding unit. The first antenna unit and the second antenna unit are respectively positioned in different parallel planes.