Patents by Inventor Tsung-Lin Liu
Tsung-Lin Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250126750Abstract: A flow guiding device in an immersion-cooled chassis of a server comprises at least one deflector located above a chip on a mainboard in the chassis, each deflector comprises a first end for mounting to the mainboard above the chip and a second end inclined away from the mainboard. The first end is immersed in coolant, the second end is higher than the first end; the deflector further comprises a hollow part including multiple through holes for interrupting upward movement vapor bubbles generated by the hot chip, which reduces probability of the vapor bubbles escaping from the coolant liquid and the chassis. A liquid-cooled chassis having the flow guiding device is also disclosed.Type: ApplicationFiled: December 23, 2024Publication date: April 17, 2025Inventors: SUNG TSANG, TSUNG-LIN LIU, YU-CHIA TING, CHENG-YI HUANG, CHIA-NAN PAI
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Patent number: 12238893Abstract: A flow guiding device in an immersion-cooled chassis of a server comprises at least one deflector located above a chip on a mainboard in the chassis, each deflector comprises a first end for mounting to the mainboard above the chip and a second end inclined away from the mainboard. The first end is immersed in coolant, the second end is higher than the first end; the deflector further comprises a hollow part including multiple through holes for interrupting upward movement vapor bubbles generated by the hot chip, which reduces probability of the vapor bubbles escaping from the coolant liquid and the chassis. A liquid-cooled chassis having the flow guiding device is also disclosed.Type: GrantFiled: December 30, 2022Date of Patent: February 25, 2025Assignee: Fulian Precision Electronics (Tianjin) Co., LTD.Inventors: Sung Tsang, Tsung-Lin Liu, Yu-Chia Ting, Cheng-Yi Huang, Chia-Nan Pai
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Publication number: 20240397673Abstract: A liquid cooling device comprises a cabinet, a liquid flowing unit, a liquid tray, and a liquid sensor. The cabinet is configured for containing an electronic component. The liquid flowing unit comprises a plurality of liquid delivery pieces connected and configured for circulating coolant to cool the electronic component. The liquid tray defines a confluence groove configured for gathering the coolant leaking from two connected ones of the plurality of liquid delivery pieces. The liquid sensor is placed in the confluence groove and is configured for sending a signal when contacting with the coolant. When the coolant leaks from two connected ones of the plurality of liquid delivery pieces then drops on the liquid tray and flows into the confluence groove by gravity, the liquid sensor contacts with the coolant in the confluence groove and sends the signal. A server with the liquid cooling device is also disclosed.Type: ApplicationFiled: May 15, 2024Publication date: November 28, 2024Inventors: YU-CHIA TING, CHIA-NAN PAI, TSUNG-LIN LIU, YEN-LU CHENG, CHUANG-WEI TSENG, HAO-WEN CHENG
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Publication number: 20240381574Abstract: An immersion cooling device includes a housing defining a receiving chamber, a working liquid received in the receiving chamber, a condenser received in the receiving chamber and located outside the working liquid, and a blocking member received in the receiving chamber. The blocking member includes a plurality of blocking bodies dispersed on a top surface of the working liquid.Type: ApplicationFiled: July 13, 2023Publication date: November 14, 2024Inventors: TSUNG-LIN LIU, CHUN-WEI LIN, YU-CHIA TING, CHIA-NAN PAI
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Publication number: 20240381573Abstract: An immersion cooling device includes a housing defining a chamber, a working liquid received in the chamber, a condenser received in the chamber and located outside the working liquid, and at least one support plate received in the chamber. Each of the at least one support plate includes a first portion and a second portion connected to the first portion. The first portion is immersed in the working liquid and configured to hold an electronic device. The second portion protrudes from the working liquid. The second portion defines a slot extending through the second portion, and an opening of the slot faces the condenser.Type: ApplicationFiled: July 13, 2023Publication date: November 14, 2024Applicant: Fulian Precision Electronics (Tianjin) Co., LTD.Inventors: CHUN-WEI LIN, TSUNG-LIN LIU, YU-CHIA TING, CHIA-NAN PAI
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Publication number: 20240381587Abstract: An immersion cooling device includes a box body containing coolant, a heat-generating component received in the box body and immersed in the coolant, a slide rail received in the box body, fixed to the box body and located above the coolant, a condenser slidably disposed on the slid rail, a cover body adapted to cover the box body and to be opened relative to the box body, and an inlet pipe connected to the condenser and passing through and sealed from the cover body.Type: ApplicationFiled: November 27, 2023Publication date: November 14, 2024Inventors: TSUNG-LIN LIU, CHUN-WEI LIN, CHIA-NAN PAI
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Publication number: 20240344626Abstract: A pressure protection device includes a housing, a sliding block, and an adjusting block. The housing includes a receiving chamber communicating with a seal chamber and the housing defines a first gas hole and a second gas hole each communicating the receiving chamber to an ambient environment. The sliding block divides the receiving chamber into a first space and a second space and defines a through hole communicating the first space with the second space. The adjusting block is located in the first space and configured to be attracted to the sliding block so that the through hole is selectively blocked by the adjusting block. When the sliding block slides in the receiving chamber, the first gas hole is selectively blocked by the sliding block to isolate from or to communicate with the first space, and the second gas hole always communicates with the second space.Type: ApplicationFiled: November 27, 2023Publication date: October 17, 2024Inventors: TSUNG-LIN LIU, CHUN-WEI LIN
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Publication number: 20240341062Abstract: A two-phase liquid cooling system for cooling electronic devices includes a housing configured for accommodating the electronic devices, a cooling loop connected to the housing, and an impedance device connected to the cooling loop. The cooling loop includes a supply manifold, a return manifold, and multiple cooling branches connected in parallel between the supply manifold and the return manifold, each cooling branch is configured for transferring cooling liquid to cool one electronic device. The impedance device increases impedance in each of the multiple cooling branches to reduce difference in impedance between each cooling branch and balances the pressure drop in each cooling branch, and thus balancing the cooling liquid flow rate in each cooling branch. A two-phase liquid cooling cabinet and method for liquid cooling of multiple electronic devices with different thermal loads are also disclosed.Type: ApplicationFiled: August 2, 2023Publication date: October 10, 2024Inventors: SUNG TSANG, TSUNG-LIN LIU, YU-CHIA TING
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Publication number: 20240334646Abstract: An immersed cooling system for cooling electronic devices includes a cooling tank accommodating coolant and multiple electronic devices and a liquid cooling circuit for circulating coolant, the electronic device includes key components and common components, the liquid cooling circuit includes cooling branches connected to the key components for cooling, the coolant in the cooling branches flows faster than the coolant in the cooling tank, which improves the heat dissipation effect of the key components and the utilization rate of the coolant by cooling the key components and the common components with different flow rates of coolant, reduces the energy consumption of the immersed cooling system and provides a more efficient thermal solution. An immersed cooling cabinet is also provided.Type: ApplicationFiled: July 13, 2023Publication date: October 3, 2024Applicant: Fulian Precision Electronics (Tianjin) Co., LTD.Inventors: TSUNG-LIN LIU, CHIN-HAN CHAN, YU-CHIA TING, CHUN-WEI LIN, CHIA-NAN PAI
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Publication number: 20240147660Abstract: A manifold for cooling server includes an inlet pipe, an outlet pipe, a plurality of first hole groups, and a plurality of second hole groups. The distance between every two adjacent first hole groups is first distance, the distance between every two adjacent second hole groups is second distance, and the first distance is not equal to the second distance. The first distance is designed for one size of server, and the second distance is designed for another size of server. When changing the size of all servers in the rack, turning manifold 100 to 180 degrees to change the first hole groups 30 to the second hole groups 40 for adapting the severs, which makes the manifold 100 adapt two different sizes of server. A rack and a data center cooling system using the manifold are also disclosed.Type: ApplicationFiled: June 12, 2023Publication date: May 2, 2024Inventors: YU-CHIA TING, TSUNG-LIN LIU
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Publication number: 20240147664Abstract: A flow guiding device in an immersion-cooled chassis of a server comprises at least one deflector located above a chip on a mainboard in the chassis, each deflector comprises a first end for mounting to the mainboard above the chip and a second end inclined away from the mainboard. The first end is immersed in coolant, the second end is higher than the first end; the deflector further comprises a hollow part including multiple through holes for interrupting upward movement vapor bubbles generated by the hot chip, which reduces probability of the vapor bubbles escaping from the coolant liquid and the chassis. A liquid-cooled chassis having the flow guiding device is also disclosed.Type: ApplicationFiled: December 30, 2022Publication date: May 2, 2024Inventors: SUNG TSANG, TSUNG-LIN LIU, YU-CHIA TING, CHENG-YI HUANG, CHIA-NAN PAI
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Patent number: 11828379Abstract: A low-profile and small-size valve to a shut off a flow of fluid in a pipeline includes a frame, a tube, a moving part, a lever, an elastic part, a latch, and a trigger. The tube is movable with the moving part. The lever is rotatable around an axis. The elastic part can push the lever to rotate after the trigger pushes the buckle away from the lever to unlatch the lever and allow rotation. During the rotation of the lever, the lever pulls on the moving part, and the moving part pulls on the tube together to disconnect the tube from the pipe. The valve improves the convenience and efficiency of shutting off a flow of fluid. A pipeline and an immersion cooling system is also disclosed.Type: GrantFiled: September 8, 2022Date of Patent: November 28, 2023Assignee: Fulian Precision Electronics (Tianjin) Co., LTD.Inventors: Tung-Ho Shih, Yao-Chih Liu, Chia-Nan Pai, Tsung-Lin Liu
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Publication number: 20230337395Abstract: An isolation device for isolating leaked liquid coolant and an electronic equipment carrying same are disclosed. The isolation device includes a liquid cooling radiator, a fixing structure, and a detection device. The liquid cooling radiator includes a first housing and a second housing which are connected with each other and enclose a chamber allowing a liquid coolant to flow therethrough. The first housing defines a groove away from the chamber, a bottom wall of the groove including a first end and a second end lower than the first end. The fixing structure is disposed on the bottom wall and configured to fix a pipe. The groove is configured to receive liquid coolant leaked from a connection between the fixing structure and the pipe. The detection device is disposed on the second end and configured to detect presence of liquid.Type: ApplicationFiled: August 18, 2022Publication date: October 19, 2023Inventors: YU-CHIA TING, TSUNG-LIN LIU
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Patent number: 11732809Abstract: A low-profile and small-size valve to a shut off a flow of fluid in a pipeline includes a frame, a tube, a moving part, a lever, an elastic part, a latch, and a trigger. The tube is movable with the moving part. The lever is rotatable around an axis. The elastic part can push the lever to rotate after the trigger pushes the buckle away from the lever to unlatch the lever and allow rotation. During the rotation of the lever, the lever pulls on the moving part, and the moving part pulls on the tube together to disconnect the tube from the pipe. The valve improves the convenience and efficiency of shutting off a flow of fluid. A pipeline and an immersion cooling system is also disclosed.Type: GrantFiled: September 8, 2022Date of Patent: August 22, 2023Assignee: Fulian Precision Electronics (Tianjin) Co., LTD.Inventors: Tung-Ho Shih, Yao-Chih Liu, Chia-Nan Pai, Tsung-Lin Liu
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Publication number: 20230076046Abstract: A low-profile and small-size valve to a shut off a flow of fluid in a pipeline includes a frame, a tube, a moving part, a lever, an elastic part, a latch, and a trigger. The tube is movable with the moving part. The lever is rotatable around an axis. The elastic part can push the lever to rotate after the trigger pushes the buckle away from the lever to unlatch the lever and allow rotation. During the rotation of the lever, the lever pulls on the moving part, and the moving part pulls on the tube together to disconnect the tube from the pipe. The valve improves the convenience and efficiency of shutting off a flow of fluid. A pipeline and an immersion cooling system is also disclosed.Type: ApplicationFiled: September 8, 2022Publication date: March 9, 2023Inventors: TUNG-HO SHIH, YAO-CHIH LIU, CHIA-NAN PAI, TSUNG-LIN LIU
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Patent number: 10881020Abstract: An electronic apparatus including a box body, at least one heat generating element and an immersion cooling module are provided. The immersion cooling module includes a condensing structure and an airflow guiding device. The box body has a containing space, and the containing space is adapted to contain a heat dissipation medium. The heat generating element is disposed in the containing space to be immersed in the heat dissipation medium which is in the liquid state. The condensing structure is disposed in the containing space and includes a first condensing portion. The airflow guiding device is disposed in the box body and is adapted to guide the heat dissipation medium which is in the gaseous state toward the first condensing portion.Type: GrantFiled: September 2, 2019Date of Patent: December 29, 2020Assignee: Wiwynn CorporationInventors: Tsung-Lin Liu, Ting-Yu Pai, Shih-Lung Lin, Chin-Han Chan
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Publication number: 20200393206Abstract: An electronic apparatus including a box body, at least one heat generating element and an immersion cooling module are provided. The immersion cooling module includes a condensing structure and an airflow guiding device. The box body has a containing space, and the containing space is adapted to contain a heat dissipation medium. The heat generating element is disposed in the containing space to be immersed in the heat dissipation medium which is in the liquid state. The condensing structure is disposed in the containing space and includes a first condensing portion. The airflow guiding device is disposed in the box body and is adapted to guide the heat dissipation medium which is in the gaseous state toward the first condensing portion.Type: ApplicationFiled: September 2, 2019Publication date: December 17, 2020Applicant: Wiwynn CorporationInventors: Tsung-Lin Liu, Ting-Yu Pai, Shih-Lung Lin, Chin-Han Chan
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Publication number: 20150288329Abstract: The present invention relates to a junction box comprising a housing, an electric connection module, a monitor module, and a cable module. A solar module transmits electricity generated by the solar module to a power conversion device; moreover, a plurality of signal wires of the cable module transmit the parameter supervised by the monitor module to an external monitoring and controlling device at the same time. Therefore, the monitor module can inform users the using information of the solar module such that users can judge the timing of repairing and replacing the external solar module and so as to achieve an ultimate using benefit of the solar module.Type: ApplicationFiled: April 2, 2014Publication date: October 8, 2015Applicant: Bizlink International CorporationInventors: Jia-Mao Zheng, Tsung-Lin Liu, Shu-Quan Liu, Hao-Ran Zou, Qi-Xing Xu, Chun-Kao Wu