Abstract: The present disclosure provides a multi-state one-time programmable (MSOTP) memory circuit including a memory cell and a programming voltage driving circuit. The memory cell includes a MOS storage transistor, a first MOS access transistor and a second MOS access transistor electrically connected to store two bits of data. When the memory cell is in a writing state, the programming voltage driving circuit outputs a writing control potential to the gate of the MOS storage transistor, and when the memory cell is in a reading state, the programming voltage driving circuit outputs a reading control potential to the gate of the MOS storage transistor.

Abstract: A light-emitting device includes a substrate including circuit pads and a resin portion. A frame disposed on the substrate to form a first space, first to third light sources, and first and second encapsulants. The frame includes an outer wall and a first partition in the first space to form the first space as independent second and third spaces. A first and second light sources are disposed at the second space and provide first and second light beams respectively. A third light source is disposed at the third space and provides a third light beam. A first encapsulant is filled at the second space to seal the first and second light sources. A second encapsulant is filled at the third space to seal the third light source. The second encapsulant includes a first wavelength conversion material converting the third light beam into a fourth light beam.

Abstract: A light-emitting device includes a substrate including circuit pads and a resin portion. A frame disposed on the substrate to form a first space, first to third light sources, and first and second encapsulants. The frame includes an outer wall and a first partition in the first space to form the first space as independent second and third spaces. A first and second light sources are disposed at the second space and provide first and second light beams respectively. A third light source is disposed at the third space and provides a third light beam. A first encapsulant is filled at the second space to seal the first and second light sources. A second encapsulant is filled at the third space to seal the third light source. The second encapsulant includes a first wavelength conversion material converting the third light beam into a fourth light beam.

Abstract: A light emitting diode (LED) device and a method of manufacturing the LED device aforementioned are provided. The LED device (400) includes a LED chip (430), an encapsulant (440) and a ring-shape barrier (450?). The LED chip has a first surface and a reflection surface, and the encapsulant covers the LED chip. Wherein the reflection surface (450a) is inclined with respect to a side surface (430b) of the LED chip. A light output angle can be effectively adjusted, and the needs to re-design lenses when market demand changes may be reduced.

Abstract: A light emitting diode (LED) packaging structure including a metal pad, an electric static discharge (ESD) protection element and an LED chip is provided. The metal pad has a first pad portion having a first top surface with a first concave configured thereon and a second pad portion having a second top surface with a second concave configured thereon. The ESD protection element has two first electrode portions respectively configured in the first concave and the second concave. The LED chip is located above the ESD protection element and has two second electrode portions respectively configured on the first top surface and the second top surface. A frame and a light emitting device having the frame that both include the above LED packaging structure are described herein. A light emitting device having an omni-directional light emitting effect is also described and includes the above LED packaging structure.

Abstract: A light emitting diode (LED) packaging structure including a metal pad, an electric static discharge (ESD) protection element and an LED chip is provided. The metal pad has a first pad portion having a first top surface with a first concave configured thereon and a second pad portion having a second top surface with a second concave configured thereon. The ESD protection element has two first electrode portions respectively configured in the first concave and the second concave. The LED chip is located above the ESD protection element and has two second electrode portions respectively configured on the first top surface and the second top surface. A frame and a light emitting device having the frame that both include the above LED packaging structure are described herein. A light emitting device having an omni-directional light emitting effect is also described and includes the above LED packaging structure.

Abstract: A light emitting device includes a substrate; an LED chip, disposed on the substrate; and a fluorescent layer. The fluorescent layer is at least partially and conformally coated on the LED chip and the substrate.

Abstract: A light emitting diode (LED) packaging structure including a metal pad, an electric static discharge (ESD) protection element and an LED chip is provided. The metal pad has a first pad portion having a first top surface with a first concave configured thereon and a second pad portion having a second top surface with a second concave configured thereon. The ESD protection element has two first electrode portions respectively configured in the first concave and the second concave. The LED chip is located above the ESD protection element and has two second electrode portions respectively configured on the first top surface and the second top surface. A frame and a light emitting device having the frame that both include the above LED packaging structure are described herein. A light emitting device having an omni-directional light emitting effect is also described and includes the above LED packaging structure.

Abstract: A substrate transportation device includes a housing for transporting substrates. The housing is formed of an upper surface, a lower surface, and opposing sidewalls. The housing has a rear opening through which the substrates enter the housing and a front opening through which the substrates exit the housing. A plurality of hollow supporting members are disposed within the housing and affixed to the opposing sidewalls which are formed by a plurality of columns. The hollow supporting members have a plurality of apertures in an upper surface for supplying a medium to a lower surface of the plurality of substrates. A medium supply member transfers the medium toward the hollow supporting member. The medium transferred by the medium supply member is delivered through the apertures in the upper surface of the plurality of hollow supporting members to float the substrates on a cushion of air.

Abstract: A substrate transportation device includes a housing formed of an upper surface, a lower surface, and opposing sidewalls. The housing has a rear opening through which the substrate enters the housing and a front opening through which the substrate exit the housing. A plurality supporting members are disposed within the housing and operatively connected to the opposing sidewalls which can be formed as a plurality of columns. A motor and motor shaft transmit a rotational force to an axle system, which transmits rotational force to the supporting members to transfer the substrate into or out of the housing randomly.

Abstract: A substrate transportation device includes a housing for transporting substrates. The housing is formed of an upper surface, a lower surface, and opposing sidewalls. The housing has a rear opening through which the substrates enter the housing and a front opening through which the substrates exit the housing. A plurality of hollow supporting members are disposed within the housing and affixed to the opposing sidewalls which are formed by a plurality of columns. The hollow supporting members have a plurality of apertures in an upper surface for supplying a medium to a lower surface of the plurality of substrates. A medium supply member transfers the medium toward the hollow supporting member. The medium transferred by the medium supply member is delivered through the apertures in the upper surface of the plurality of hollow supporting members to float the substrates on a cushion of air.

Abstract: Cassettes for receiving objects. The cassettes include a frame, a sidewall and a cantilever. The sidewall is perpendicular to a horizon. The cantilever for supporting the object includes a fixed-end attached to the sidewall, thereby forming an angle with the horizon.

Abstract: An ionizer for eliminating static electricity on a large size substrate. The ionizer comprises a bar and a plurality of pin sets. The pin sets are located on the bar at a given interval, and a power line is located inside the bar. Each pin set comprises a plurality of pins and a plurality of nozzles. The pins connect to the power line, and the nozzles are located around the pins to spray charges on the substrate at a given spraying angle. By setting more pins in each pin set, the covering angle of the ionizer can be enlarged.

Abstract: An ionizer for eliminating static electricity on a large size substrate. The ionizer comprises a bar and a plurality of pin sets. The pin sets are located on the bar at a given interval, and a power line is located inside the bar. Each pin set comprises a plurality of pins and a plurality of nozzles. The pins connect to the power line, and the nozzles are located around the pins to spray charges on the substrate at a given spraying angle. By setting more pins in each pin set, the covering angle of the ionizer can be enlarged.

Abstract: A locator for a material sheet comprises at least two oppositely disposed stoppers, and a slot sheet. Each of the stoppers provides a flat bearing surface and a slant surface extending outward and upward from the bearing surface with a junction between them. The slot sheet is disposed under the stoppers and joining to a bottom of the respective stopper. The distance between the junctions on the two stoppers is corresponding to the length of the slot sheet.

Abstract: A locator for a material sheet comprises at least two oppositely disposed stoppers, and a slot sheet. Each of the stoppers provides a flat bearing surface and a slant surface extending outward and upward from the bearing surface with a junction between them. The slot sheet is disposed under the stoppers and joining to a bottom of the respective stopper. The distance between the junctions on the two stoppers is corresponding to the length of the slot sheet.

Abstract: A locator for a material sheet comprises a frame with a homogeneous cross section, and a susceptor. The frame at the left, the right, the front, and the rear sides thereof surrounds with an inner wall. The distance between the left and the right sides of the inner wall and the distance between the front and the rear sides thereof are corresponding to the size of the upward projection of the susceptor. The upper end of the inner wall extends outward a horizontal support surface. The distance between the left and the right sides of the support surface and the distance between the front and the rear sides of the support surface are corresponding to the size of the sheet. An upward slant surface extends outward from the support surface. The sheet can slide downward along the slant surface to cover the susceptor while the sheet is laid down from the top of the locator.

Abstract: A method for removing extraneous matters from a stainless device is provided. The method includes the steps of (a) providing a container for holding a fluorine-containing neutral solution therein, (b) immersing said stainless device in said fluorine-containing neutral solution to remove said extraneous matters from said stainless device, and (c) heating and swirling said fluorine-containing solution. The fluorine-containing neutral solution is made from neutralizing hydrofluoric acid (HF) with ammonium hydroxide (NH4OH), neutralizing hydrofluoric acid (HF) with ammonium fluoride (NH4F), or dissolving ammonium acid fluoride (NH4F) in a deionized water (DIW).

Abstract: A semiconductor wafer cassette mapper. A photo-detecting array is used as a receiver. During a mapping process, an accurate and complex driving system is not necessary. The invention provides a semiconductor wafer cassette mapper. A strip light source is used as an emitter and a photo-detecting array is used as a receiver for a semiconductor wafer cassette mapper. During the mapping process, the strip light source, the photo-detecting array and the wafer cassette do not need to move for scanning. The receiver obtains an information about all wafers in the wafer cassette by receiving all signals at one time, so that a mapping time is reduced. The invention provides another semiconductor wafer cassette mapper. A parallel scanning light source serves as an emitter and a photo-detecting array serves as a receiver of semiconductor wafer cassette mapper. During the mapping process, the parallel scanning light source moves quickly to scan the wafers in the wafer cassette. The method can reduce the mapping time.

Abstract: A slit valve with safety detect device to prevent clipping, used to reduce the wafer damaged by the slit valve of the seal plate, further to have the function of the safety interlock and cost down the production. This invention mainly includes a plurality of sensor to detect that whether something in the range of the seal plate moving or not. The sensor consisted of an emitter and a receiver for detecting. If there are something in the range, the moving seal plate will stop moving, avoid the wafer damaged by the seal plate and to cost down.