Abstract: A method for forming an interconnect of a solid oxide fuel cell includes the following steps. First of all, a powder mixture substantially including equal to or more than 90 wt % chromium powder, with the balance being iron powder and inevitable impurities, is provided. Then the powder mixture is pressurized by a pressing process with a pressure equal to or over 8 mt/cm2 to form a green interconnect with a density being equal to or over 90% of the theoretical density. Next the green interconnect is sintered by a sintering process to form an interconnect body. Finally, a protection process is performed on at least one surface of the interconnect body to form an interconnect.

Abstract: A transmission device includes an antenna and a first transceiver. The antenna receives a current channel information. The current channel information includes an unlicensed channel information of an unlicensed channel. The first transceiver measures an energy information of a current channel according to the unlicensed information. When the first transceiver determines that the energy information is higher than a triggering threshold, the first transceiver accumulates an energy intensity of the current channel and detects an energy feature. The first transceiver determines a spectrum range occupied by a user of the unlicensed channel, avoids transmitting a to-be transmitted data through the spectrum range, and measures an another unlicensed channel, according to an accumulated result of the energy intensity and the energy feature.

Abstract: A method for forming an interconnect of a solid oxide fuel cell includes the following steps. First of all, a powder mixture substantially including equal to or more than 90 wt % chromium powder, with the balance being iron powder and inevitable impurities, is provided. Then the powder mixture is pressurized by a pressing process with a pressure equal to or over 8 mt/cm2 to form a green interconnect with a density being equal to or over 90% of the theoretical density. Next the green interconnect is sintered by a sintering process to form an interconnect body. Finally, a protection process is performed on at least one surface of the interconnect body to form an interconnect.

Abstract: A display panel includes a first row line, a second row line, a first column line, a first transistor, and a second transistor. The second row line is parallel to the first row line. The first column line is vertical to the first row line and the second row line. The first transistor includes a first terminal, a second terminal, and a first control terminal coupled to the first row line. The second transistor includes a third terminal coupled to the first column line, a fourth terminal coupled to the first terminal, and a second control terminal coupled to the second row line.

Abstract: A display panel includes a first row line, a second row line, a first column line, a first transistor, and a second transistor. The second row line is parallel to the first row line. The first column line is vertical to the first row line and the second row line. The first transistor includes a first terminal, a second terminal, and a first control terminal coupled to the first row line. The second transistor includes a third terminal coupled to the first column line, a fourth terminal coupled to the first terminal, and a second control terminal coupled to the second row line.