Abstract: A protecting method for preventing solder crack failure in an electronic product is provided. Firstly, a step (a) is performed to confirm that a crack incidence rate of a metallic solder material in a printed circuit board is high. In a step (b), a protecting mechanism of controlling the electronic product to enter an idle mode and leave the idle mode is activated. Consequently, an operating temperature of the electronic product decreases at a first average drop rate.

Abstract: In an embodiment, a chemical mechanical planarization (CMP) system includes: a monolithic platen within a platen housing, wherein the monolithic platen is formed of a single piece of material, wherein the monolithic platen includes: a first portion within a first opening, and a second portion within a second opening, wherein the first portion has a different diameter than the second portion; and a polishing fluid delivery module above the monolithic platen, wherein the polishing fluid delivery module is configured to deliver slurry to the monolithic platen during performance of CMP.

Abstract: A bicycle packaging structure for a bicycle including a bicycle frame is provided. The bicycle packaging structure includes an exhibition box and at least one fixing member. The exhibition box includes a lower plate, a side plate surrounding the lower plate, an accommodating space formed by the lower plate and the side plate, and an exhibition opening at one side of the side plate away from the lower plate. The bicycle frame is accommodated in the accommodating space and mounted on the lower plate by the at least one fixing member. Thus, the bicycle frame may be directly exhibited through the exhibition opening and be sold to eliminate conventional complications of box opening and assembly for exhibition and post-exhibition re-boxing. The bicycle frame is placed in the exhibition box for carrying outdoors to achieve objects of recycling and reducing costs and burden on the environment.

Abstract: A bicycle packaging structure for a bicycle including a bicycle frame is provided. The bicycle packaging structure includes an exhibition box and at least one fixing member. The exhibition box includes a lower plate, a side plate surrounding the lower plate, an accommodating space formed by the lower plate and the side plate, and an exhibition opening at one side of the side plate away from the lower plate. The bicycle frame is accommodated in the accommodating space and mounted on the lower plate by the at least one fixing member. Thus, the bicycle frame may be directly exhibited through the exhibition opening and be sold to eliminate conventional complications of box opening and assembly for exhibition and post-exhibition re-boxing. The bicycle frame is placed in the exhibition box for carrying outdoors to achieve objects of recycling and reducing costs and burden on the environment.

Abstract: A display device includes a chassis, an electronic module, and a waterproof breathable member. The chassis has a front frame and a rear cover installed on the front frame. The rear cover has a plurality of heat-dissipating holes and an intake port, and the chassis is configured to allow a heat-dissipating airflow to pass through the accommodating space via the heat-dissipating holes and the intake port. The electronic module arranged in the chassis has a circuit board, and the heat-dissipating holes are arranged above the circuit board. The waterproof breathable member is disposed on an inner surface of the rear cover and entirely shields the heat-dissipating holes, so the heat-dissipating airflow only passes through the waterproof breathable member when the heat-dissipating airflow flows out of the chassis via the heat-dissipating holes. The waterproof breathable member is configured to avoid any liquid flowing into the chassis via the heat-dissipating holes.

Abstract: A multi-directional display device includes a base body, a support frame, and a display module. The base body includes a first rotatable module. The support frame is movably disposed on the base body via the first rotatable module. The support frame has a first viewable position and a second viewable position. The support frame is rotatable between the first and the second viewable position. The support frame includes a second rotatable module. The display module is rotatably disposed on the support frame via the second rotatable module. When the support frame rotates between the first and the second viewing positions, the display module is rotatable on the support frame and a display surface of the display module faces outward with respect to the base body.

Abstract: A semiconductor packaging substrate with improved capability of electrostatic dissipation comprises a dielectric layer, a plurality of leads, a plurality of first electrostatic guiding traces, a plurality of second electrostatic guiding traces and a solder mask. The first electrostatic guiding traces and the second electrostatic guiding traces are formed in pairs in a plurality of electrostatic dissipation regions on the dielectric layer, where each pair of the first and second electrostatic guiding traces are disposed in equal line spacing and are electrically isolated from each other. The solder mask partially covers the leads but exposes the first electrostatic guiding traces and the second electrostatic guiding traces. The first electrostatic guiding traces are connected to some of the leads to enhance protection against electrostatic discharge.

Abstract: A semiconductor packaging substrate with improved capability of electrostatic dissipation comprises a dielectric layer, a plurality of leads, a plurality of first electrostatic guiding traces, a plurality of second electrostatic guiding traces and a solder mask. The first electrostatic guiding traces and the second electrostatic guiding traces are formed in pairs in a plurality of electrostatic dissipation regions on the dielectric layer, where each pair of the first and second electrostatic guiding traces are disposed in equal line spacing and are electrically isolated from each other. The solder mask partially covers the leads but exposes the first electrostatic guiding traces and the second electrostatic guiding traces. The first electrostatic guiding traces are connected to some of the leads to enhance protection against electrostatic discharge.

Abstract: A semiconductor packaging substrate with improved capability of electrostatic dissipation comprises a dielectric layer, a plurality of leads, a plurality of first electrostatic guiding traces, a plurality of second electrostatic guiding traces and a solder mask. The first electrostatic guiding traces and the second electrostatic guiding traces are formed in pairs in a plurality of electrostatic dissipation regions on the dielectric layer, where each pair of the first and second electrostatic guiding traces are disposed in equal line spacing and are electrically isolated from each other. The solder mask partially covers the leads but exposes the first electrostatic guiding traces and the second electrostatic guiding traces. The first electrostatic guiding traces are connected to some of the leads to enhance protection against electrostatic discharge.

Abstract: A semiconductor packaging substrate with improved capability of electrostatic dissipation comprises a dielectric layer, a plurality of leads, a plurality of first electrostatic guiding traces, a plurality of second electrostatic guiding traces and a solder mask. The first electrostatic guiding traces and the second electrostatic guiding traces are formed in pairs in a plurality of electrostatic dissipation regions on the dielectric layer, where each pair of the first and second electrostatic guiding traces are disposed in equal line spacing and are electrically isolated from each other. The solder mask partially covers the leads but exposes the first electrostatic guiding traces and the second electrostatic guiding traces. The first electrostatic guiding traces are connected to some of the leads to enhance protection against electrostatic discharge.

Abstract: A method of fabricating a non-volatile memory is described. A substrate having a tunneling layer and a floating gate layer thereon is provided. A mask layer is formed on the floating gate. The mask layer has openings that expose a portion of the floating gate layer. Then, a portion of the floating gate layer is removed from the openings to form sunken regions on the surface of the floating gate layer. An inter-gate dielectric layer is formed on the floating gate layer. A control gate layer is formed on the inter-gate dielectric layer. After that, the mask layer and the floating gate layer under the mask layer are removed to form another opening. A select gate layer is formed inside the opening.

Abstract: A low-profile heavy-duty buckle includes a male member having two forward elastic retaining arms, and a female member having two receiving spaces corresponding to the retaining arms of the male member. The retaining arm is elastically exposed from and retained to a side opening provided on a sidewall of the receiving space when the male member is plugged into the female member. The retaining arm further includes an inward extended extension portion having a first retaining block with a first toothed face provided near a distal end thereof. The receiving space is internally provided with a downward extended second retaining block having a second toothed face opposite to the first toothed face. The first and the second toothed face firmly engage with one another to provide the buckle with an enhanced force-bearing strength when the connected male and female members are subjected to two opposite pull forces.

Abstract: A side release buckle includes a male member having two forward extended elastic retaining arms, each of which has a curved outer sidewall with a retaining shoulder portion formed near a proximal end thereof and a downward locating block; and a hollow female member having a front opening and two side openings, and two projected stoppers. The curved outer sidewalls of the retaining arms enable the male member to slide into the front opening of the female member from an angular position, and the engagement of the male member with the female member at the retaining shoulder portions and axially front ends of the side openings and at the locating blocks and the stoppers provides the buckle with enhanced force-bearing strength to prevent the male and the female member from easy breakaway.

Abstract: A snap button with pull-apart resisting structure includes a male and a female part. The male part is provided on a bottom surface with a raised portion, and a connecting head having a neck portion centered at and projected from the raised portion. A recess portion is provided on one side of the raised portion to create a difference in the distances from an end surface of the connecting head to the raised portion and to the recess portion. The female part includes a central through hole, a part of which is a non-full circular hole enclosed by an elastic frame and having a diameter slightly smaller than that of the connecting head on the male part, and the other part of the central through hole is an extended curved hole corresponding to the recess portion on the male part and enclosed by a raised frame of a predetermined height.

Abstract: A swivel hook includes a ring portion defining a hollow inner space and having an external engaging section; a first connecting portion having an upper section rotatably received in the inner space of the ring portion; and a second connecting portion rotatably engaged with the engaging section on the ring portion. The swivel hook is integrally formed by positioning the ring portion in a mold, and then injecting plastic material into the mold to sequentially or simultaneously form the first and the second connecting portion, so that the upper section of the first connecting portion is firmly attached to an inner wall surface of the ring portion, and the second connecting portion is engaged with the engaging section on the ring portion; and then downward pulling the first connecting portion of the initially molded swivel hook to allow it to freely rotate in the inner space of the ring portion.

Abstract: A method of fabricating a non-volatile memory is described. A substrate having a tunneling layer and a floating gate layer thereon is provided. A mask layer is formed on the floating gate. The mask layer has openings that expose a portion of the floating gate layer. Then, a portion of the floating gate layer is removed from the openings to form sunken regions on the surface of the floating gate layer. An inter-gate dielectric layer is formed on the floating gate layer. A control gate layer is formed on the inter-gate dielectric layer. After that, the mask layer and the floating gate layer under the mask layer are removed to form another opening. A select gate layer is formed inside the opening.

Abstract: A side release buckle includes a male member having two forward extended elastic retaining arms, each of which has a curved outer sidewall with a retaining shoulder portion formed near a proximal end thereof and a downward locating block; and a hollow female member having a front opening and two side openings, and two projected stoppers. The curved outer sidewalls of the retaining arms enable the male member to slide into the front opening of the female member from an angular position, and the engagement of the male member with the female member at the retaining shoulder portions and axially front ends of the side openings and at the locating blocks and the stoppers provides the buckle with enhanced force-bearing strength to prevent the male and the female member from easy breakaway.

Abstract: The invention provides a flip chip package structure. The flip chip package structure includes a substrate, a flip chip, a plurality of bumps, a first sealing material, and a second sealing material. The substrate has an upper surface and a plurality of pads formed on the upper surface. The flip chip has an active surface. Each of the bumps corresponds to one of the pads of the substrate, and the active surface of the flip chip is electrically connected and is attached to the upper surface of the substrate by the bumps. The first sealing material is coated between the flip chip and the substrate so as to fix the flip chip on the substrate. The second sealing material is coated to cover the first sealing material.

Abstract: A low-profile heavy-duty buckle includes a male member having two forward elastic retaining arms, and a female member having two receiving spaces corresponding to the retaining arms of the male member. The retaining arm is elastically exposed from and retained to a side opening provided on a sidewall of the receiving space when the male member is plugged into the female member. The retaining arm further includes an inward extended extension portion having a first retaining block with a first toothed face provided near a distal end thereof. The receiving space is internally provided with a downward extended second retaining block having a second toothed face opposite to the first toothed face. The first and the second toothed face firmly engage with one another to provide the buckle with an enhanced force-bearing strength when the connected male and female members are subjected to two opposite pull forces.