Patents by Inventor Tsung-Lung Yang

Tsung-Lung Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6870939
    Abstract: This invention mainly provides a SMT-type structure of the minimized and low-power silicon-based electret condenser microphone. Primarily integrates with the electret, silicon-based, MEMS and microphone techniques to implement the minimized and low-power silicon-based electret condenser microphone. The Silicon-based bi-diaphragm of the composite diaphragm-chip was coated with the low-dielectric macromolecule material to allow the microphone acquires the sufficient electrical charges. Moreover, the impedance matching element of the microphone that MOSFET was implemented by the MEMS technology. Conclusively, this silicon-based electret condenser microphone gains several achievements as the smallest volume, a lower bias voltage, a SMT-type structure, a lower residue stress and a lower assembly cost.
    Type: Grant
    Filed: November 28, 2001
    Date of Patent: March 22, 2005
    Assignee: Industrial Technology Research Institute
    Inventors: Dar-Ming Chiang, Tsung-Lung Yang
  • Publication number: 20030166773
    Abstract: A fluoropolymer composite with high ionic conductivity that may be applied in electroactive polymer composite includes following components: PVDF-g-SPS; PVDF; and hydrocarbon- or fluoro-elastomer. After being mixed with specific proportion and being dissolved in an oily or non-oily solvent of non-proton or proton of high boiling point, the invention is coated on a substrate and is heated to get rid of the solvent afterwards to get a compound membrane. Then, a compound membrane of PVDF-g-SPS may be obtained by sulphonating the aforementioned compound membrane. The obtained compound membrane has excellent properties, such as thermal stability, acid-alkali resistance, good mechanical performance, excellent flexibility, and capability for processing appropriate cross-link for further enhancing the mechanical performance of this membrane.
    Type: Application
    Filed: March 1, 2002
    Publication date: September 4, 2003
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jen-Luan Chen, Jhi-Hsien Huang, Wen-Liang Liu, Chih-Yang Yeh, Tsung-Lung Yang, Lon-Cheng Cheng
  • Publication number: 20030099368
    Abstract: This invention mainly provides a structure and its implementation of the minimized and low-power silicon-based electret condenser microphone. Primarily integrates with the electret, silicon-based, MEMS and microphone techniques to implement the minimized and low-power silicon-based electret condenser microphone. The Silicon-based bi-diaphragm of the composite diaphragm-chip was coated with the low-dielectric macromolecule material to allow the microphone acquires the sufficient electrical charges. Moreover, the impedance matching element of the microphone that MOSFET was implemented by the MEMS technology. Conclusively, this silicon-based electret condenser microphone gains several achievements as the smallest volume, a lower bias voltage, a lower residue stress and a lower assembly cost.
    Type: Application
    Filed: November 28, 2001
    Publication date: May 29, 2003
    Inventors: Dar-Ming Chiang, Tsung-Lung Yang