Abstract: In an embodiment, a package includes an integrated circuit device attached to a substrate; an encapsulant disposed over the substrate and laterally around the integrated circuit device, wherein a top surface of the encapsulant is coplanar with the top surface of the integrated circuit device; and a heat dissipation structure disposed over the integrated circuit device and the encapsulant, wherein the heat dissipation structure includes a spreading layer disposed over the encapsulant and the integrated circuit device, wherein the spreading layer includes a plurality of islands, wherein at least a portion of the islands are arranged as lines extending in a first direction in a plan view; a plurality of pillars disposed over the islands of the spreading layer; and nanostructures disposed over the pillars.

Abstract: The present disclosure is directed to a semiconductor device. The semiconductor device includes a substrate, an insulating layer disposed on the substrate, a first conductive feature disposed in the insulating layer, and a capacitor structure disposed on the insulating layer. The capacitor structure includes a first electrode, a first dielectric layer, a second electrode, a second dielectric layer, and a third electrode sequentially stacked. The semiconductor device also includes a first via connected to the first electrode and the third electrode, a second via connected to the second electrode, and a third via connected to the first conductive feature. A part of the first via is disposed in the insulating layer. A portion of the first conductive feature is directly under the capacitor structure.

Abstract: The present disclosure provides an electronic device that comprises a memory and a controller. The memory includes a first memory location and a second memory location, which are configured to store data in an alternate manner The controller is configured to write, when connection of a display to the electronic device is detected, extended display identification data (EDID) of the display through a first channel to one of the first and second memory locations, and to enable the EDID of the display to be accessible to hosts through second channels.

Abstract: The present disclosure provides an electronic apparatus that comprises a number of Universal Serial Bus (USB) device control modules, a microprocessor, a priority arbitration module, a USB host control module and a USB hub module. The USB device control modules are configured to receive from and send to a host a USB electric signal. The microprocessor is configured to generate a number of virtual USB hub modules in a memory. Each of the virtual USB hub modules is configured to generate a USB device enumeration signal, in response to an electric connection status between a USB electronic device and the USB hub module, and to send the USB device enumeration signal via a corresponding one of the USB device control modules to the host. The priority arbitration module is configured to, in response to the availability of the USB electronic device, transmit the USB electric signal issued from the host to the USB electronic device via the USB host control module and the USB hub module.