Abstract: A heat dissipation system of an electronic device including a body, a plurality of heat sources disposed in the body, and at least one centrifugal heat dissipation fan disposed in the body is provided. The centrifugal heat dissipation fan includes a housing and an impeller disposed in the housing on an axis. The housing has at least one inlet on the axis and has a plurality of outlets in different radial directions, and the plurality of outlets respectively correspond to the plurality of heat sources.

Abstract: A centrifugal heat dissipation fan of a portable electronic device. The centrifugal heat dissipation fan includes a hub, multiple metal blades, and at least one ring. The metal blades are disposed surrounding the hub. The metal blades include multiple radial dimensions, and the structure of the metal blade with a shorter radial dimension is a part of the structure of the metal blade with a longer radial dimension. The metal blades having different radial dimensions form at least two ring areas, and the distribution numbers of the metal blades in the at least two ring areas are different from each other. The ring surrounds the hub and connects the metal blades.

Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one inlet disposed along an axis and at least one first outlet and a second outlet located in different radial directions, wherein the first outlet and the second outlet are opposite to and separated from each other. The impeller is disposed in the housing along the axis. A heat dissipation system of an electronic device is also provided.

Abstract: A fan is provided herein, including a housing, a hub, and a plurality of blades. The housing includes a top case and a bottom case. The hub is rotatably disposed between the top case and the bottom case in an axial direction. The blades extend from the hub in a radial direction, located between the top case and the bottom case. Each of the blades has a proximal end and a distal end. The proximal end is connected to the hub. The distal end is opposite from the proximal end, located at the other side of the blade, having at least one recessed portion. Each of the recessed portions form a passage for air.

Abstract: A centrifugal heat dissipation fan including a housing and an impeller disposed in the housing on an axis is provided. The housing has at least one inlet on the axis and has a plurality of outlets in different radial directions. A heat dissipation system of an electronic device is also provided.

Abstract: A cord lock device includes a seat extended from a base for engaging with a cord and a shaft also extended from the base, and a pawl rotatably engaged onto the shaft and having a protrusion for engaging with the cord and for clamping and sandwiching the cord between the protrusion of the pawl and the seat of the plate member when the pawl is rotated in an active direction relative to the shaft, and the cord may be released from the protrusion of the pawl and the seat of the plate member when the pawl is rotated in a reverse direction relative to the shaft. The pawl and the seat may include a number of teeth for frictionally engaging with the cord. The base includes a projection having an orifice for receiving the cord.

Abstract: A backlight unit has a light guide plate with a diffusive layer therein. The light guide plate has a first side, a second side opposite to the first side and a third side. The diffusive layer has a base and a plurality of grains in the base. A lamp is arranged beside the third side of the light plate to provide light to the light guide plate. A reflective film is attached on the second side of the light guide plate to reflect light. A brightness enhance member is provided at the first side of the light guide plate.

Abstract: A substrate has a substrate member, which is made of a polar material, such as Polymethyl methacrylate (PMMA), Methyl methacrylate/Styrene copolymer (MS) or Polycarbonate (PC), having a first side and a second side. On the fist side and the second side of the substrate member provided with an insulating layers respectively, wherein the insulating layers are made of a non-polar material with a low water absorption, such as Cyclic Olefin Polymer (COP) or Cyclic Olefin Copolymer (COC). The water absorption of COP or COC is less than the water absorption of PMMA, MS or PC to prevent the substrate member from warping while the substrate is heated at a single side. Two adhesive layers, which is made of a material with a chemical structure with a non-polar segment and a polar segment, such as olefin/acrylate copolymer, to bond the insulating layers on the substrate member.

Abstract: A method for fabricating on-chip spacers for a TFT panel exposes a photoresist layer on top of the TFT panel using two exposure processes, one through the bottom of the TFT and the other through a mask over the TFT panel. The exposure process through the bottom exposes all photoresist covering windows on the TFT panel and leaves all photoresist corresponding to an opaque grid corresponding a TFT driving circuit. A second exposure process through a mask above the photoresist leaves part of the photoresist in the opaque grid unexposed. The exposed photoresist is removed leaving on-chip spacers only on the opaque grid. Therefore, the on-chip spacers can not affect the display quality and can be easily formed on a high dpi TFT panel.

Abstract: A substrate has a substrate member, which is made of Cyclic Olefins Polymer (COP) or Cyclic Olefins Copolymer (COC), and two protective layers, which are made of Polymethyl methacrylate (PMMA) or Polycarbonate (PC), provided on opposite side of the substrate member. The COP or COC substrate member has a less water absorption (<0.01%) to prevent the substrate from warping while it is irradiated at single side. The PMMA or PC protective layer has a greater hardness to protect the substrate from damage.

Abstract: A method of fabricating an optical substrate has the steps of: Heat a first material and a second material to their melt conditions. Stack the first material and the second material. Roll a stack of the first material and the second material and mold a surface profile on the second material by means of a roller calender with a figured texture to mold a substrate with a surface thereon. Cool the substrate and cut the substrate.

Abstract: A substrate has a substrate member, which is made of Polymethyl methacrylate (PMMA) or Polycarbonate (PC), having a first side and a second side. On the fist side and the second side of the substrate member provided with an insulating layers respectively, wherein the insulating layers are made of Cyclic Olefins Polymer (COP). The water absorption of COP is less than the water absorption of PMMA and PC to prevent the substrate member from warping while the substrate is heated at a single side.

Abstract: A method of forming a transparent conductive layer on a substrate has the steps of: forming a transparent conductive layer on a flat surface of a temporary substrate, wherein the transparent conductive layer has a first side attached onto the flat surface directly and a second side opposite to the first side; patterning the transparent conductive layer; providing an insulation layer to cover the second side of the transparent conductive layer; providing a substrate on the insulation layer, and removing the temporary substrate to expose the first side of the transparent conductive layer.

Abstract: A method for fabricating on-chip spacers for a TFT panel exposes a photoresist layer on top of the TFT panel using two exposure processes, one through the bottom of the TFT and the other through a mask over the TFT panel. The exposure process through the bottom exposes all photoresist covering windows on the TFT panel and leaves all photoresist corresponding to an opaque grid corresponding a TFT driving circuit. A second exposure process through a mask above the photoresist leaves part of the photoresist in the opaque grid unexposed. The exposed photoresist is removed leaving on-chip spacers only on the opaque grid. Therefore, the on-chip spacers can not affect the display quality and can be easily formed on a high dpi TFT panel.

Abstract: A reflective type thin film transistor display device and methods for fabricating the same is disclosed. The fabrication process includes a first substrate, multiple layers of thin film transistor built on the top layer over the substrate, multiple layers of metal reflector on the periphery of the thin film transistor, and a second substrate, wherein the metal reflector and the thin film transistor are transferred onto the second substrate by a back-end fabrication process to cause the thin film transistor to be exposed on the back end. The metal reflector is formed in between oxide layers and coated with aluminum material on the back side. Since the back side of the reflective display device is not subjected to any etching process or oxidation at high temperature, it is fully flat for a reflective surface after turning over by the back-end fabrication process.

Abstract: The present invention makes it possible to transfer thin film devices such as integrated semiconductor and optical components from a first substrate onto a second substrate through a thermal process at high temperature, without degradation of device performance. Other devices can be fabricated thereafter on the other side of the second substrate. Since the semiconductor and optical components can be transferred onto the second substrate in a single-step thermal process, in comparison with prior art the number of transfer substrates needed in the fabrication process can be effectively reduced, thus simplifying the fabrication process and realizing cost reduction.

Abstract: The present invention makes it possible to transfer thin film devices such as integrated semiconductor and optical components from a first substrate onto a second substrate through a thermal process at high temperature, without degradation of device performance. Other devices can be fabricated thereafter on the other side of the second substrate. Since the semiconductor and optical components can be transferred onto the second substrate in a single-step thermal process, in comparison with prior art the number of transfer substrates needed in the fabrication process can be effectively reduced, thus simplifying the fabrication process and realizing cost reduction.

Abstract: A panel is implemented by a method from bottom to top includes a display panel, an optical element film formed on the display panel and a semiconductor element film formed on the optical element film. The method discloses that the semiconductor element film is first formed on a temporary substrate and then the optical element film is further formed on the semiconductor element film. When the display panel is bonded on the optical element film the temporary substrate is removed from the semiconductor element film. Therefore, the semiconductor element film and the optical element film are integrated the same display panel.

Abstract: A method of forming a flexible thin film transistor (TFT) display device. A metal foil serving as a flexible metal substrate of a display device is provided, wherein the metal foil is an aluminum alloy foil, a titanium foil or a titanium alloy foil. The thickness of the metal foil is 0.05˜0.8 mm. An insulation layer is formed on the flexible metal substrate. A thin film transistor (TFT) array is formed on the insulation layer. In addition, the aluminum alloy foil can include magnesium of 0.01˜1% wt and/or silicon of 0.01˜1% wt and the titanium alloy foil can include aluminum of 0.01˜20% wt and/or molybdenum of 0.01˜20% wt.

Abstract: A polysilicon thin film transistor with a self-aligned LDD structure has a polysilicon layer formed on a transparent insulating substrate. The polysilicon layer consists of a channel region, an LDD structure on two sides of the channel region, and a source/drain region on two sides of the LDD structure. A gate insulating layer is formed on the polysilicon layer, a first metal layer is patterned on the gate insulating layer to cover the channel region, and a second metal layer is patterned on the first metal layer to cover the channel region.