Abstract: A chip packaging device includes a chip carrier, a chip and a packaging structure that includes a packaging plate and a connecting unit. The chip carrier includes a substrate and the chip is disposed thereon. The packaging plate and the substrate are respectively disposed at two opposite sides of the chip. The connecting unit has first and a second ends, which are respectively connected to the packaging plate and the chip. The first and second ends respectively have first and second cross-sectional areas perpendicular to an axis, and the second cross-sectional area is smaller than the first cross-sectional area.