Abstract: An electronic device includes a processor, a modulator, and a power amplifier. The processor receives a baseband signal and executes a first ET shaping function on the baseband signal. The modulator receives the baseband signal, detects the magnitude of the baseband signal, and outputs the first voltage according to the magnitude of the baseband signal. The power amplifier outputs an amplified signal based on the first voltage. The first ET shaping function enables the relationship between the baseband signal and the first voltage to be Vpa=a|X|2+b. X is the baseband signal, Vpa is the first voltage, and a and b are constants. The look-up table records the relation curve between the power of the amplified signal and the first voltage when the second ET shaping function is used for envelope tracking.

Abstract: In an embodiment, a method includes: attaching a package component to a package substrate, the package component includes: a first die being disposed over an interposer; a second die being disposed over the interposer and laterally adjacent to the first die; and an encapsulant being disposed around the first die and the second die; attaching a thermal interface material to the first die and the second die; and attaching a lid structure to the package substrate, the lid structure includes: a lid cap being disposed over the thermal interface material; and a plurality of lid feet connecting the lid cap to the package substrate, in a plan view the plurality of lid feet forming a discontinuous loop around the package component.

Abstract: A package structure and method for forming the same are provided. The package structure includes a first through via structure formed in a substrate and a semiconductor die formed below the first through via structure. The package structure further includes a conductive structure formed in a passivation layer over the substrate. The conductive structure includes a first via portion and a second via portion, the first via portion is directly over the first through via structure, and there is no conductive material directly below and in direct contact with the second via portion.

Abstract: A method for tuning an envelope tracking (ET) system includes: determining a setting combination from a plurality of setting available to the ET system, wherein determining the setting combination from the plurality of setting available to the ET system includes: determining, by a processing module, a first setting in a plurality of first settings included in the plurality of settings, and configuring the ET system by the first setting; and after the ET system is configured by the first setting, determining, by the processing module, a second setting in a plurality of second settings included in the plurality of settings, and configuring the ET system by the second setting. In addition, the setting combination includes the first setting and the second setting.

Abstract: A method for tuning an envelope tracking (ET) system includes: determining a setting combination from a plurality of setting available to the ET system, wherein determining the setting combination from the plurality of setting available to the ET system includes: determining, by a processing module, a first setting in a plurality of first settings included in the plurality of settings, and configuring the ET system by the first setting; and after the ET system is configured by the first setting, determining, by the processing module, a second setting in a plurality of second settings included in the plurality of settings, and configuring the ET system by the second setting. In addition, the setting combination includes the first setting and the second setting.