Patents by Inventor Tsung-Ping Hsu

Tsung-Ping Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020167564
    Abstract: A jet, and a method thereof, use bubbles as virtual valves to eject droplets of different sizes. The jet is in fluid communication with a reservoir and has a substrate, an orifice layer, first nozzles, and second nozzles. The substrate has a manifold for receiving ink from the reservoir. The orifice layer is positioned on the top of the substrate to form first chambers and second chambers. First orifices of the first nozzles and second orifices of the second nozzles are formed on the orifice layer. The jet has at least one of following characteristics: (a) the first chambers are larger than the second chambers; (b) an interval between two heating units of the first nozzle is larger than an interval between two heating units of the second nozzle; and (c) the apertures of the first orifices are larger than the apertures of the second orifices.
    Type: Application
    Filed: May 10, 2002
    Publication date: November 14, 2002
    Inventors: Chung-Cheng Chou, Wei-Lin Chen, In-Yao Lee, Tsung-Ping Hsu, Hung-Sheng Hu
  • Publication number: 20020163564
    Abstract: An apparatus for using the bubble as a virtual valve to eject ink comprises a chamber, orifice, and heaters. The chamber, having a top surface and a bottom surface, is connected to the ink reservoir by a manifold. Two heaters, connected in series to a common electrode, are located on the bottom surface of the chamber. One heater having higher resistance is positioned adjacent to the manifold, and the other heater having lower resistance is positioned away from the manifold. When an electrical pulse is applied to activate the heaters, the heater close to the manifold heats up first, and generates a first bubble to isolate the ink flow between the chamber and manifold, thereby reducing the effects of cross talk. Subsequently, the heater away from the manifold generates the second bubble to pressurize the ink in the chamber with the first bubble, and the ink is ejected through the orifice. Then, the first bubble collapses, and breaks the isolation between the manifold and the chamber.
    Type: Application
    Filed: May 6, 2002
    Publication date: November 7, 2002
    Inventors: Yi-Jing Leu, Hung-Sheng Hu, Tsung-Ping Hsu, Wei-Lin Chen, In-Yao Lee, Chung-Cheng Chou
  • Publication number: 20020123232
    Abstract: A gradational etching method for high density wafer production. The gradational etching method acts on a substrate having a first passivation layerand a second passivation layer on a top surface and a bottom surface, respectively, of the substrate. A first etching process is performed to simultaneously etch the substrate and the first passivation layer to remove the first passivation layer. Finally, a second etching process is performed to etch the substrate to a designated depth that is used to control the thickness of the wafer after the second etching process.
    Type: Application
    Filed: February 4, 2002
    Publication date: September 5, 2002
    Inventors: Tsung-Ping Hsu, In-Yao Lee, Hung-Sheng Hu, Chung-Cheng Chou, Wei-Lin Chen
  • Publication number: 20020109753
    Abstract: A high density jetting apparatus for a print head of an inkjet printer includes a manifold, at least two fluid chambers, orifices located on two sides of the manifold, and several bubble generating devices installed adjacent to two sides of the orifices. These bubble generating devices heat fluid inside the fluid chamber to generate two consecutive bubbles and eject fluid between the first and second bubbles from the orifice. The fluid chambers and orifices are arranged symmetrically or asymmetrically with respect to the manifold to increase the number of orifices and decrease turbulent effect, thereby improving print quality.
    Type: Application
    Filed: January 29, 2002
    Publication date: August 15, 2002
    Inventors: Yi-Jing Leu, Hung-Sheng Hu, Chung-Cheng Chou, Tsung-Ping Hsu, In-Yao Lee, Wei-Lin Chen