Patents by Inventor TSUNG-PO HSU

TSUNG-PO HSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11778746
    Abstract: An assembly structure of a transformer and a circuit board includes: a circuit board, a packaging chip, a transformer, a first conductive plate, a second conductive plate and a first heat sink. The packaging chip is disposed on the circuit board. The transformer has at least one first output electrode and at least one second output electrode connected to the first output electrode. The first conductive plate is disposed on the transformer and connected to the at least one first output electrode. The second conductive plate is disposed on the transformer and connected to the at least one second output electrode and the circuit board. The first heat sink is connected to the packaging chip and the first conductive plate, is disposed on the circuit board, and is connected to the circuit board and the first conductive plate.
    Type: Grant
    Filed: April 9, 2021
    Date of Patent: October 3, 2023
    Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATION
    Inventors: Tsung-Po Hsu, Yung-Chou Li, Yu-Jen Wei, Chih-Chun Yang
  • Publication number: 20220201862
    Abstract: An assembly structure of a transformer and a circuit board includes: a circuit board, a packaging chip, a transformer, a first conductive plate, a second conductive plate and a first heat sink. The packaging chip is disposed on the circuit board. The transformer has at least one first output electrode and at least one second output electrode connected to the first output electrode. The first conductive plate is disposed on the transformer and connected to the at least one first output electrode. The second conductive plate is disposed on the transformer and connected to the at least one second output electrode and the circuit board. The first heat sink is connected to the packaging chip and the first conductive plate, is disposed on the circuit board, and is connected to the circuit board and the first conductive plate.
    Type: Application
    Filed: April 9, 2021
    Publication date: June 23, 2022
    Inventors: Tsung-Po HSU, Yung-Chou LI, Yu-Jen WEI, Chih-Chun YANG
  • Publication number: 20170141593
    Abstract: The present disclosure provides a power saving device with power supply, comprising a charger power circuit, a receptacle, a plug detection unit, an ON/OFF control circuit and a power output enable circuit. The plug detection unit uses a mechanical or electrical detection apparatus to detect whether a plug-in device is inserted or not. When there is no plug-in device in the receptacle, the power output enable circuit will cut off the power to the charger power circuit. So the power consumption of the power saving device is reduced while no plug-in device is inserted into the receptacle.
    Type: Application
    Filed: April 21, 2016
    Publication date: May 18, 2017
    Inventors: WEN-SHENG CHEN, KUN-HUNG LEE, CHIH-TAI CHEN, HAN-JU CHIANG, BO-CHIH LIN, TSUNG-PO HSU, WEI-TING LIN
  • Patent number: 9131628
    Abstract: A circuit board device includes a heat dissipation housing, a circuit board, and a heat conductive adhesive. The heat dissipation housing includes a panel, and at least one end plate connected to one end of the panel and formed with a retaining groove. The circuit board is disposed in the heat dissipation housing spaced apart from the panel and has one end inserted into the retaining groove. The heat conductive adhesive is adhered to the panel and the end plate, and covers the circuit board.
    Type: Grant
    Filed: June 7, 2012
    Date of Patent: September 8, 2015
    Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology Corp.
    Inventors: Yi-Jen Lu, Shuo-Jen Shieh, Tsung-Po Hsu
  • Publication number: 20130021754
    Abstract: A circuit board device includes a heat dissipation housing, a circuit board, and a heat conductive adhesive. The heat dissipation housing includes a panel, and at least one end plate connected to one end of the panel and formed with a retaining groove. The circuit board is disposed in the heat dissipation housing spaced apart from the panel and has one end inserted into the retaining groove. The heat conductive adhesive is adhered to the panel and the end plate, and covers the circuit board.
    Type: Application
    Filed: June 7, 2012
    Publication date: January 24, 2013
    Applicants: LITE-ON TECHNOLOGY CORP., SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.
    Inventors: YI-JEN LU, SHUO-JEN SHIEH, TSUNG-PO HSU