Patents by Inventor Tsung-Sheng Chuang

Tsung-Sheng Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240142428
    Abstract: A water quality detection device including a detection tank, a sensor, the cleaner and a processor is provided. The sensor is disposed on the detection tank and is configured to sense a to-be-detected liquid within the detection tank. The cleaner is configured to clean the sensor. The processor is electrically connected to the sensor and the cleaner and is configured to: execute an initialization procedure, which includes driving the sensor to sense the to-be-detected liquid to obtain a number of initial sensing values and calculating a threshold value according to the initial sensing values; drive the sensor to sense the to-be-detected liquid to obtain a sensing value of the to-be-detected liquid, and determine whether the sensing value of the to-be-detected liquid reaches the threshold value; drive the cleaner to operate when the sensing value of the to-be-detected liquid reaches the threshold value.
    Type: Application
    Filed: February 17, 2023
    Publication date: May 2, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Tsung-Yu TSAI, Hung-Sheng LIN, Cheng-Da KO, Chun-Te CHUANG
  • Publication number: 20160351465
    Abstract: An assembly layer structure applicable to a touch control integrated circuit (IC) module and manufacturing method thereof are described. The assembly layer structure comprises a substrate; a package layer, for being formed on the substrate; a color layer, for being formed on a upper surface of the package layer using a colorant in order to change color of the upper surface on the package layer; at least one intermediate layer, for connecting the color layer to a protection layer; and the protection layer, for being formed on the at least one intermediate layer wherein the protection layer is selected from one group consisting of epoxy resin, methyl methacrylate (MMA) and polyester resin.
    Type: Application
    Filed: May 31, 2016
    Publication date: December 1, 2016
    Inventors: Tsung-Sheng Chuang, Chien-Le Lee
  • Patent number: 9290039
    Abstract: A production method of workpiece is provided. First, an adhesive layer is applied on a workpiece. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. A first curing process with a first irradiating energy is performed on the adhesive layer. The workpiece is punched after the first curing process is performed on the adhesive layer, so that the workpiece forms a three-dimensional workpiece. A second curing process with a second irradiating energy is performed on the adhesive layer after the workpiece is punched, wherein the second irradiating energy intensity is higher than the first irradiating energy intensity.
    Type: Grant
    Filed: November 24, 2011
    Date of Patent: March 22, 2016
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Wan-Li Chuang, Chien-Min Chang, Tsung-Sheng Chuang
  • Patent number: 9242505
    Abstract: A production method of workpiece is provided. First, an adhesive layer is applied on a workpiece, wherein a material of the adhesive layer includes thermosetting resin and radiationcurable resin. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. A first curing process is performed on the adhesive layer by one of radiation-curing and thermal-curing. The workpiece is punched after the first curing process is performed on the adhesive layer, so that the workpiece forms a three-dimensional workpiece. A second curing process is performed on the adhesive layer by another one of radiation-curing and thermal-curing after the workpiece is punched. In addition, a workpiece with three-dimensional pattern is also provided.
    Type: Grant
    Filed: November 24, 2011
    Date of Patent: January 26, 2016
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Wan-Li Chuang, Chien-Min Chang, Ju-Chen Chiu, Chih-Hua Liu, Tsung-Sheng Chuang
  • Publication number: 20120088074
    Abstract: A workpiece with three-dimensional pattern having a three-dimensional surface and suitable for an electronic device is provided. A multiple three-dimensional micro patterns formed on the three-dimensional surface reflects an environment light to form images with a visual effect. The workpiece with three-dimensional pattern includes a workpiece and an adhesive layer. The adhesive layer is disposed on the workpiece and impressed to form the multiple three-dimensional micro patterns, and the workpiece is punched to form the three-dimensional surface. A first part of the multiple three-dimensional micro patterns on the three-dimensional surface reflects the environment light to form a first reflecting light beam. A second part of the multiple three-dimensional micro patterns on the three-dimensional surface reflects the environment light to form a second reflecting light beam.
    Type: Application
    Filed: December 19, 2011
    Publication date: April 12, 2012
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Wan-Li Chuang, Chien-Min Chang, Li-Jung Yu, Yung-Ching Chang, Ying-Ching Chen, Tsung-Sheng Chuang
  • Publication number: 20120070631
    Abstract: A production method of workpiece is provided. First, an adhesive layer is applied on a workpiece. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. A first curing process with a first irradiating energy is performed on the adhesive layer. The workpiece is punched after the first curing process is performed on the adhesive layer, so that the workpiece forms a three-dimensional workpiece. A second curing process with a second irradiating energy is performed on the adhesive layer after the workpiece is punched, wherein the second irradiating energy intensity is higher than the first irradiating energy intensity.
    Type: Application
    Filed: November 24, 2011
    Publication date: March 22, 2012
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Wan-Li Chuang, Chien-Min Chang, Tsung-Sheng Chuang
  • Publication number: 20120070639
    Abstract: A production method of workpiece is provided. First, an adhesive layer is applied on a workpiece, wherein a material of the adhesive layer includes thermosetting resin and radiationcurable resin. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. A first curing process is performed on the adhesive layer by one of radiation-curing and thermal-curing. The workpiece is punched after the first curing process is performed on the adhesive layer, so that the workpiece forms a three-dimensional workpiece. A second curing process is performed on the adhesive layer by another one of radiation-curing and thermal-curing after the workpiece is punched. In addition, a workpiece with three-dimensional pattern is also provided.
    Type: Application
    Filed: November 24, 2011
    Publication date: March 22, 2012
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Wan-Li Chuang, Chien-Min Chang, Ju-Chen Chiu, Chih-Hua Liu, Tsung-Sheng Chuang