Patents by Inventor Tsung-Sheng Kuo

Tsung-Sheng Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200294831
    Abstract: A system for sending a cassette pod is provided. The system includes a processing machine having a load port for receiving the cassette pod. The system further includes a manipulating apparatus positioned above the processing machine. The manipulating apparatus includes an intermediate module having a stage and a driving mechanism connected to the stage to change the position of the stage. The manipulating apparatus further includes a conveyor module having a gripper assembly for grasping the cassette pod.
    Type: Application
    Filed: June 1, 2020
    Publication date: September 17, 2020
    Inventor: Tsung-Sheng KUO
  • Publication number: 20200243393
    Abstract: Some embodiments relate to a processing tool for processing a singulated semiconductor die. The tool includes an evaluation unit, a drying unit, and a die wipe station. The evaluation unit is configured to subject the singulated semiconductor die to a liquid to detect flaws in the singulated semiconductor die. The drying unit is configured to dry the liquid from a frontside of the singulated semiconductor die. The die wipe station includes an absorptive drying structure configured to absorb the liquid from a backside of the singulated semiconductor die after the drying unit has dried the liquid from the frontside of the singulated semiconductor die.
    Type: Application
    Filed: April 15, 2020
    Publication date: July 30, 2020
    Inventors: Tsung-Sheng Kuo, Hsu-Shui Liu, Jiun-Rong Pai, Shou-Wen Kuo, Yang-Ann Chu
  • Publication number: 20200227283
    Abstract: An apparatus for handling wafer carriers in a semiconductor fabrication facility (FAB) is disclosed. In one example, the apparatus includes: a table configured to receive a wafer carrier having a first door and operable to hold a plurality of wafers; an opening mechanism configured to open the first door of the wafer carrier; and a door storage space configured to store the first door. The apparatus may be either located on a floor of the FAB or physically coupled to a ceiling of the FAB.
    Type: Application
    Filed: March 30, 2020
    Publication date: July 16, 2020
    Inventors: Tsung-Sheng KUO, Yang-Ann CHU, Alan YANG, Vic HUANG, Hsu-Shui LIU, Jiun-Rong PAI
  • Publication number: 20200202235
    Abstract: A model-based machine learning system for calculating optimum molding conditions includes a data storage device providing a set of training data; an injection molding process emulator producing a set of emulated sensing data according to molding conditions as inputted; an injection molding process state observation unit, determining an injection molding process state from molding conditions, sensing data and a quality state, wherein the quality state at least includes an acceptance state; and an injection molding process optimization unit including an injection molding condition optimizer, wherein a molding condition optimization model constructed in the injection molding condition optimizer is trained according to the injection molding process state as determined, and the molding condition optimization model after training is introduced into an injection molding production line.
    Type: Application
    Filed: December 21, 2018
    Publication date: June 25, 2020
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ying-Hsiang CHEN, Cheng-Ying LIU, Tsung-Sheng KUO
  • Patent number: 10672639
    Abstract: A system for sending a cassette pod is provided. The system includes a processing machine having a load port for receiving the cassette pod. The system further includes a manipulating apparatus positioned above the processing machine. The manipulating apparatus includes an intermediate module having a stage and a driving mechanism connected to the stage to change the position of the stage. The manipulating apparatus further includes a conveyor module having a gripper assembly for grasping the cassette pod.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: June 2, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventor: Tsung-Sheng Kuo
  • Patent number: 10665507
    Abstract: Some embodiments relate to a processing tool for processing a singulated semiconductor die. The tool includes an evaluation unit, a drying unit, and a die wipe station. The evaluation unit is configured to subject the singulated semiconductor die to a liquid to detect flaws in the singulated semiconductor die. The drying unit is configured to dry the liquid from a frontside of the singulated semiconductor die. The die wipe station includes an absorptive drying structure configured to absorb the liquid from a backside of the singulated semiconductor die after the drying unit has dried the liquid from the frontside of the singulated semiconductor die.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: May 26, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Sheng Kuo, Hsu-Shui Liu, Jiun-Rong Pai, Shou-Wen Kuo, Yang-Ann Chu
  • Publication number: 20200156884
    Abstract: In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.
    Type: Application
    Filed: October 10, 2019
    Publication date: May 21, 2020
    Inventors: Tsung-Sheng Kuo, Chih-Hung Huang, Yi-Fam Shiu, Chueng-Jen Wang, Hsuan Lee, Jiun-Rong Pai
  • Publication number: 20200161160
    Abstract: In an embodiment, a system includes: a tool port of a semiconductor processing tool; a processing port with an internal processing port location and an external processing port location; a robot configured to move a die vessel between the internal processing port location and the tool port; and an actuator configured to move the die vessel between the internal processing port location and the external processing port location.
    Type: Application
    Filed: September 30, 2019
    Publication date: May 21, 2020
    Inventors: Tsung-Sheng KUO, Yi-Fam SHIU, Eason CHEN, Yang-Ann CHU, Jiun-Rong PAI
  • Publication number: 20200130874
    Abstract: In certain embodiments, a system includes: an inspection station configured to receive a die vessel, wherein the inspection station is configured to inspect the die vessel for defects; a desiccant station configured to receive the die vessel from the inspection station, wherein the desiccant station is configured to add a desiccant to the die vessel; a bundle station configured to receive the die vessel from the desiccant station, wherein the bundle station is configured to combine the die vessel with another die vessel as a die bundle; and a bagging station configured to receive the die bundle from the bundle station, wherein the bagging station is configured to dispose the die bundle in a die bag and to heat seal the die bag with the die bundle inside.
    Type: Application
    Filed: June 14, 2019
    Publication date: April 30, 2020
    Inventors: Tsung-Sheng KUO, Hsu-Shui LIU, Jiun-Rong PAI, Yang-Ann CHAU, Chih-Chun LIN, Shine CHEN
  • Publication number: 20200118857
    Abstract: An operating method of a wafer cassette handling apparatus includes at least the following steps. A stage that carries a wafer cassette is moved into a main body of a wafer cassette handling apparatus to open a cassette door of the wafer cassette. The stage that carries the wafer cassette is moved out of the main body after the cassette door is opened. A wafer is extracted from the wafer cassette and transferred to a processing system. Another operating method and a wafer cassette handling apparatus are also provided.
    Type: Application
    Filed: December 15, 2019
    Publication date: April 16, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Sheng Kuo, Hsuan Lee, Hsu-Shui Liu, Jiun-Rong Pai, Chih-Hung Huang, Yang-Ann Chu
  • Patent number: 10622236
    Abstract: An apparatus for handling wafer carriers in a semiconductor fabrication facility (FAB) is disclosed. In one example, the apparatus includes: a table configured to receive a wafer carrier having a first door and operable to hold a plurality of wafers; an opening mechanism configured to open the first door of the wafer carrier; and a door storage space configured to store the first door. The apparatus may be either located on a floor of the FAB or physically coupled to a ceiling of the FAB.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: April 14, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Sheng Kuo, Yang-Ann Chu, Alan Yang, Vic Huang, Hsu-Shui Liu, Jiun-Rong Pai
  • Publication number: 20200075371
    Abstract: In certain embodiments, a workstation includes: a cleaning station configured to clean a die vessel, wherein the die vessel is configured to secure a semiconductor die; an inspection station configured to inspect the die vessel after cleaning to determine whether the die vessel is identified as passing inspection; and a conveyor configured to move the die vessel between the cleaning station and the inspection station.
    Type: Application
    Filed: July 22, 2019
    Publication date: March 5, 2020
    Inventors: Tsung-Sheng KUO, Guan-Wei Huang, Chih-Hung Huang, Yang-Ann Chu, Hsu-Shui Liu, Jiun-Rong Pai
  • Publication number: 20200058534
    Abstract: Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.
    Type: Application
    Filed: July 30, 2019
    Publication date: February 20, 2020
    Inventors: Tsung-Sheng KUO, Kai-Chieh HUANG, Wei-ting HSIAO, Yang-Ann CHU, 1-Lun YANG, Hsuan LEE
  • Publication number: 20200058535
    Abstract: A wafer carrier handling apparatus includes a housing, a platform, a moving mechanism and a door storage device. The platform is configured to hold a wafer carrier. The moving mechanism is connected to the housing and configured to move the platform with respect to the housing. The door storage device is disposed above the housing. The door storage device has a first door storage zone. The first door storage zone is configured to allow a door of the wafer carrier to be held thereon.
    Type: Application
    Filed: April 26, 2019
    Publication date: February 20, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tsung-Sheng KUO, Chih-Hung HUANG, Ming-Hsien TSAI, Yang-Ann CHU, Hsuan LEE, Jiun-Rong PAI
  • Publication number: 20200043758
    Abstract: In an embodiment, a system includes: a warehousing apparatus configured to interface with a semiconductor die processing tool configured to process a semiconductor die singulated from a wafer, wherein the semiconductor die processing tool comprise an in-port and an out-port, wherein the warehousing apparatus is configured to: move a first die vessel that contains the semiconductor die to the in-port from a first die vessel container, wherein the first die vessel container is configured to house the first die vessel; move the first die vessel from the in-port to a buffer region; and move a second die vessel from the buffer region to the out-port.
    Type: Application
    Filed: July 22, 2019
    Publication date: February 6, 2020
    Inventors: Tsung-Sheng KUO, Chih-Hung Huang, Hsueh-Lei Wang, Yang-Ann Chu, Hsuan Lee, Jiun-Rong Pai
  • Patent number: 10510573
    Abstract: A loading apparatus for processing a wafer cassette containing a plurality of wafers and an operating method thereof are provided. The operating method includes the following steps. The wafer cassette is loaded on a stage of the loading apparatus. The stage is configured to carry the wafer cassette and movably coupled to a main body of the loading apparatus to move within and out of a space of the main body. The stage is vertically moved among a standby position, a lifting position and an intermediate position; horizontally moved from the intermediate position to a door engaging position inside the space; positioned at the door engaging position, and a cassette door of the wafer cassette is opened. The stage is horizontally moved from the door engaging position to the intermediate position, and horizontally moved between the lifting position and an unloading position outside the space after opening the cassette door.
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: December 17, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Sheng Kuo, Hsuan Lee, Hsu-Shui Liu, Jiun-Rong Pai, Chih-Hung Huang, Yang-Ann Chu
  • Publication number: 20190148187
    Abstract: A detaping machine is adapted for removing a tape from a frame, the tape includes a wafer mounting area and a periphery area surrounding the wafer mounting area. The detaping machine includes a carrier and a detaping module. The carrier is for supporting the tape and the frame. The detaping module includes an elastic pressing device and a detaping head, wherein the periphery area of the tape is adapted to be pressed by the elastic pressing device, and the wafer mounting area of the tape is adapted to be pressed by the detaping head. A detaping method is further provided.
    Type: Application
    Filed: January 22, 2018
    Publication date: May 16, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Sheng Kuo, Hsu-Shui Liu, Jiun-Rong Pai, Shou-Wen Kuo, Wen-Chin Kan, Yang-Ann Chu
  • Publication number: 20190148200
    Abstract: A loading apparatus for processing a wafer cassette containing a plurality of wafers and an operating method thereof are provided. The operating method includes the following steps. The wafer cassette is loaded on a stage of the loading apparatus. The stage is configured to carry the wafer cassette and movably coupled to a main body of the loading apparatus to move within and out of a space of the main body. The stage is vertically moved among a standby position, a lifting position and an intermediate position; horizontally moved from the intermediate position to a door engaging position inside the space; positioned at the door engaging position, and a cassette door of the wafer cassette is opened. The stage is horizontally moved from the door engaging position to the intermediate position, and horizontally moved between the lifting position and an unloading position outside the space after opening the cassette door.
    Type: Application
    Filed: January 26, 2018
    Publication date: May 16, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Sheng Kuo, Hsuan Lee, Hsu-Shui Liu, Jiun-Rong Pai, Chih-Hung Huang, Yang-Ann Chu
  • Patent number: 10283388
    Abstract: A detaping machine is adapted for removing a tape from a frame, the tape includes a wafer mounting area and a periphery area surrounding the wafer mounting area. The detaping machine includes a carrier and a detaping module. The carrier is for supporting the tape and the frame. The detaping module includes an elastic pressing device and a detaping head, wherein the periphery area of the tape is adapted to be pressed by the elastic pressing device, and the wafer mounting area of the tape is adapted to be pressed by the detaping head. A detaping method is further provided.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: May 7, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Sheng Kuo, Hsu-Shui Liu, Jiun-Rong Pai, Shou-Wen Kuo, Wen-Chin Kan, Yang-Ann Chu
  • Publication number: 20190103314
    Abstract: Some embodiments relate to a processing tool for processing a singulated semiconductor die. The tool includes an evaluation unit, a drying unit, and a die wipe station. The evaluation unit is configured to subject the singulated semiconductor die to a liquid to detect flaws in the singulated semiconductor die. The drying unit is configured to dry the liquid from a frontside of the singulated semiconductor die. The die wipe station includes an absorptive drying structure configured to absorb the liquid from a backside of the singulated semiconductor die after the drying unit has dried the liquid from the frontside of the singulated semiconductor die.
    Type: Application
    Filed: February 23, 2018
    Publication date: April 4, 2019
    Inventors: Tsung-Sheng Kuo, Hsu-Shui Liu, Jiun-Rong Pai, Shou-Wen Kuo, Yang-Ann Chu