Patents by Inventor Tsung-Sheng Kuo
Tsung-Sheng Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11929273Abstract: A system and computer-implemented method are provided for manufacturing a semiconductor electronic device. An assembler receives a jig and a boat supporting a die. The assembler includes a separator that separates the jig into a first jig portion and a second jig portion and a loader that positions the boat between the first jig portion and the second jig portion. A robot receives an assembly prepared by the assembler and manipulates a locking system that fixes an alignment of the boat relative to the first jig portion and the second jig portion to form a locked assembly. A process chamber receives the locked assembly and subjects the locked assembly to a fabrication operation.Type: GrantFiled: July 27, 2020Date of Patent: March 12, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITEDInventors: Tsung-Sheng Kuo, Chih-Hung Huang, Guan-Wei Huang, Ping-Yung Yen, Hsuan Lee, Jiun-Rong Pai
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Patent number: 11851224Abstract: In certain embodiments, a system includes: an inspection station configured to receive a die vessel, wherein the inspection station is configured to inspect the die vessel for defects; a desiccant station configured to receive the die vessel from the inspection station, wherein the desiccant station is configured to add a desiccant to the die vessel; a bundle station configured to receive the die vessel from the desiccant station, wherein the bundle station is configured to combine the die vessel with another die vessel as a die bundle; and a bagging station configured to receive the die bundle from the bundle station, wherein the bagging station is configured to dispose the die bundle in a die bag and to heat seal the die bag with the die bundle inside.Type: GrantFiled: March 3, 2022Date of Patent: December 26, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tsung-Sheng Kuo, Hsu-Shui Liu, Jiun-Rong Pai, Yang-Ann Chu, Chieh-Chun Lin, Shine Chen
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Patent number: 11820607Abstract: In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.Type: GrantFiled: August 9, 2022Date of Patent: November 21, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tsung-Sheng Kuo, Chih-Hung Huang, Yi-Fam Shiu, Chueng-Jen Wang, Hsuan Lee, Jiun-Rong Pai
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Publication number: 20230360939Abstract: In certain embodiments, a workstation includes: a cleaning station configured to clean a die vessel, wherein the die vessel is configured to secure a semiconductor die; an inspection station configured to inspect the die vessel after cleaning to determine whether the die vessel is identified as passing inspection; and a conveyor configured to move the die vessel between the cleaning station and the inspection station.Type: ApplicationFiled: July 14, 2023Publication date: November 9, 2023Inventors: Tsung-Sheng KUO, Guan-Wei HUANG, Chih-Hung HUANG, Yang-Ann CHU, Hsu-Shui LIU, Jiun-Rong PAI
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Patent number: 11784073Abstract: An apparatus for handling wafer carriers in a semiconductor fabrication facility (FAB) is disclosed. In one example, the apparatus includes: a table configured to receive a wafer carrier having a first door and operable to hold a plurality of wafers; an opening mechanism configured to open the first door of the wafer carrier; and a door storage space configured to store the first door. The apparatus may be either located on a floor of the FAB or physically coupled to a ceiling of the FAB.Type: GrantFiled: March 3, 2022Date of Patent: October 10, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tsung-Sheng Kuo, Yang-Ann Chu, Alan Yang, Vic Huang, Hsu-Shui Liu, Jiun-Rong Pai
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Publication number: 20230317505Abstract: In an embodiment, a system includes: a tool port of a semiconductor processing tool; a processing port with an internal processing port location and an external processing port location; a robot configured to move a die vessel between the internal processing port location and the tool port; and an actuator configured to move the die vessel between the internal processing port location and the external processing port location.Type: ApplicationFiled: June 6, 2023Publication date: October 5, 2023Inventors: Tsung-Sheng KUO, Yi-Fam SHIU, Eason CHEN, Yang-Ann CHU, Jiun-Rong PAI
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Publication number: 20230298919Abstract: Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.Type: ApplicationFiled: May 23, 2023Publication date: September 21, 2023Inventors: Tsung-Sheng KUO, Kai-Chieh HUANG, Wei-Ting HSIAO, Yang-Ann CHU, I-Lun YANG, Hsuan LEE
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Patent number: 11721572Abstract: In certain embodiments, a workstation includes: a cleaning station configured to clean a die vessel, wherein the die vessel is configured to secure a semiconductor die; an inspection station configured to inspect the die vessel after cleaning to determine whether the die vessel is identified as passing inspection; and a conveyor configured to move the die vessel between the cleaning station and the inspection station.Type: GrantFiled: July 26, 2022Date of Patent: August 8, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tsung-Sheng Kuo, Guan-Wei Huang, Chih-Hung Huang, Yang-Ann Chu, Hsu-Shui Liu, Jiun-Rong Pai
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Patent number: 11705358Abstract: In an embodiment, a system includes: a tool port of a semiconductor processing tool; a processing port with an internal processing port location and an external processing port location; a robot configured to move a die vessel between the internal processing port location and the tool port; and an actuator configured to move the die vessel between the internal processing port location and the external processing port location.Type: GrantFiled: September 30, 2019Date of Patent: July 18, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tsung-Sheng Kuo, Yi-Fam Shiu, Eason Chen, Yang-Ann Chu, Jiun-Rong Pai
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Patent number: 11699619Abstract: Some embodiments relate to a processing tool for processing a singulated semiconductor die. The tool includes an evaluation unit, a drying unit, and a die wipe station. The evaluation unit is configured to subject the singulated semiconductor die to a liquid to detect flaws in the singulated semiconductor die. The drying unit is configured to dry the liquid from a frontside of the singulated semiconductor die. The die wipe station includes an absorptive drying structure configured to absorb the liquid from a backside of the singulated semiconductor die after the drying unit has dried the liquid from the frontside of the singulated semiconductor die.Type: GrantFiled: April 21, 2021Date of Patent: July 11, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tsung-Sheng Kuo, Hsu-Shui Liu, Jiun-Rong Pai, Shou-Wen Kuo, Yang-Ann Chu
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Patent number: 11682571Abstract: Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.Type: GrantFiled: June 24, 2022Date of Patent: June 20, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tsung-Sheng Kuo, Kai-Chieh Huang, Wei-Ting Hsiao, Yang-Ann Chu, I-Lun Yang, Hsuan Lee
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Publication number: 20230095609Abstract: A system, includes, a semiconductor processing unit, an Automated Materials Handling System (AMHS) vehicle, and a warehouse apparatus, wherein the warehouse apparatus comprises at least one input port, at least one output port, and at least one load/unload port, wherein the warehouse apparatus is configured to perform one of the following: receiving a plurality of tray cassette containers from the AMHS vehicle at the at least one input port, transporting at least one tray cassette in each of a plurality of tray cassette containers to the at least one load/unload port via the at least one input port, transporting at least one first tray from the at least one tray cassette to the semiconductor processing unit via a tray feeder conveyor, and receiving at least one second tray from the semiconductor processing unit via the tray feeder conveyor.Type: ApplicationFiled: December 2, 2022Publication date: March 30, 2023Inventors: Tsung-Sheng Kuo, Yang-Ann Chu, Chih-Hung Huang, Guan-Wei Huang, Jiun-Rong Pai, Hsuan Lee
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Publication number: 20230063707Abstract: Apparatus and methods for automatically handling die carriers are disclosed. In one example, a disclosed apparatus includes: at least one load port each configured for loading a die carrier operable to hold a plurality of dies; and an interface tool coupled to the at least one load port and a semiconductor processing unit. The interface tool comprises: a first robotic arm configured for transporting the die carrier from the at least one load port to the interface tool, and a second robotic arm configured for transporting the die carrier from the interface tool to the semiconductor processing unit for processing at least one die in the die carrier.Type: ApplicationFiled: November 9, 2022Publication date: March 2, 2023Inventors: Tsung-Sheng Kuo, Cheng-Lung Wu, Chih-Hung Huang, Yang-Ann Chu, Hsuan Lee, Jiun-Rong Pai
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Patent number: 11527425Abstract: A system, includes, a semiconductor processing unit, an Automated Materials Handling System (AMHS) vehicle, and a warehouse apparatus, wherein the warehouse apparatus comprises at least one input port, at least one output port, and at least one load/unload port, wherein the warehouse apparatus is configured to perform one of the following: receiving a plurality of tray cassette containers from the AMHS vehicle at the at least one input port, transporting at least one tray cassette in each of a plurality of tray cassette containers to the at least one load/unload port via the at least one input port, transporting at least one first tray from the at least one tray cassette to the semiconductor processing unit via a tray feeder conveyor, and receiving at least one second tray from the semiconductor processing unit via the tray feeder conveyor.Type: GrantFiled: December 31, 2019Date of Patent: December 13, 2022Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tsung-Sheng Kuo, Yang-Ann Chu, Chih-Hung Huang, Guan-Wei Huang, Jiun-Rong Pai, Hsuan Lee
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Publication number: 20220384222Abstract: In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.Type: ApplicationFiled: August 9, 2022Publication date: December 1, 2022Inventors: Tsung-Sheng KUO, Chih-Hung HUANG, Yi-Fam SHIU, Chueng-Jen WANG, Hsuan LEE, Jiun-Rong PAI
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Patent number: 11508596Abstract: Apparatus and methods for automatically handling die carriers are disclosed. In one example, a disclosed apparatus includes: at least one load port each configured for loading a die carrier operable to hold a plurality of dies; and an interface tool coupled to the at least one load port and a semiconductor processing unit. The interface tool comprises: a first robotic arm configured for transporting the die carrier from the at least one load port to the interface tool, and a second robotic arm configured for transporting the die carrier from the interface tool to the semiconductor processing unit for processing at least one die in the die carrier.Type: GrantFiled: May 28, 2020Date of Patent: November 22, 2022Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tsung-Sheng Kuo, Cheng-Lung Wu, Chih-Hung Huang, Yang-Ann Chu, Hsuan Lee, Jiun-Rong Pai
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Publication number: 20220359248Abstract: In certain embodiments, a workstation includes: a cleaning station configured to clean a die vessel, wherein the die vessel is configured to secure a semiconductor die; an inspection station configured to inspect the die vessel after cleaning to determine whether the die vessel is identified as passing inspection; and a conveyor configured to move the die vessel between the cleaning station and the inspection station.Type: ApplicationFiled: July 26, 2022Publication date: November 10, 2022Inventors: Tsung-Sheng KUO, Guan-Wei HUANG, Chih-Hung HUANG, Yang-Ann CHU, Hsu-Shui LIU, Jiun-Rong PAI
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Patent number: 11488848Abstract: In certain embodiments, a workstation includes: a cleaning station configured to clean a die vessel, wherein the die vessel is configured to secure a semiconductor die; an inspection station configured to inspect the die vessel after cleaning to determine whether the die vessel is identified as passing inspection; and a conveyor configured to move the die vessel between the cleaning station and the inspection station.Type: GrantFiled: July 22, 2019Date of Patent: November 1, 2022Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tsung-Sheng Kuo, Guan-Wei Huang, Chih-Hung Huang, Yang-Ann Chu, Hsu-Shui Liu, Jiun-Rong Pai
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Publication number: 20220319890Abstract: Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.Type: ApplicationFiled: June 24, 2022Publication date: October 6, 2022Inventors: Tsung-Sheng KUO, Kai-Chieh HUANG, Wei-Ting HSIAO, Yang-Ann CHU, I-Lun YANG, Hsuan LEE
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Patent number: 11459190Abstract: In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.Type: GrantFiled: November 2, 2020Date of Patent: October 4, 2022Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tsung-Sheng Kuo, Chih-Hung Huang, Yi-Fam Shiu, Chueng-Jen Wang, Hsuan Lee, Jiun-Rong Pai