Abstract: A method of making a semiconductor device includes patterning a conductive layer over a substrate to define a conductive pad having a first width. The method includes depositing a passivation layer, wherein the passivation layer directly contacts the conductive pad. The method includes depositing a protective layer over the passivation layer, wherein the protective layer directly contacts the conductive pad. The method includes depositing an under-bump metallization (UBM) layer directly contacting the conductive pad, wherein the UBM layer has a second width greater than the first width. The method includes depositing a mask layer over the UBM layer; and forming an opening in the mask layer wherein the opening has the second width. The method includes forming a conductive pillar in the opening on the UBM layer; and etching the UBM layer using the conductive pillar as a mask, wherein the etched UBM layer has the second width.

Abstract: The present disclosure provides a method for manufacturing an auto-crosslinked hyaluronic acid gel, comprising conducting auto-crosslinking reaction of a colloid containing hyaluronic acid continuously at low temperature in an acidic environment, and treating the reaction product with steam at high temperature to obtain the auto-crosslinked hyaluronic acid gel with high viscosity.

Abstract: The present invention provides a method for adjusting the frequency of an oscillator. The method comprises providing a substrate having a plurality of openings, forming a conductive layer on a first surface of the substrate and patterning the conductive layer to form a plurality of strip line, one of which is formed corresponding to the openings to become an inductance circuit, covering the conductive layer with a lid, and cutting part of the strip line through the plurality of openings from the opposite side of the first surface to adjust frequencies of the oscillator.

Abstract: The present invention provides a method for adjusting the frequency of an oscillator. The method comprises providing a substrate having a plurality of openings, forming a conductive layer on a first surface of the substrate and patterning the conductive layer to form a plurality of strip line, one of which is formed corresponding to the openings to become an inductance circuit, covering the conductive layer with a lid, and cutting part of the strip line through the plurality of openings from the opposite side of the first surface to adjust frequencies of the oscillator.