Abstract: The disclosure discloses a fabrication method for a light absorption layer of a solar cell, including: forming a precursor film on a substrate, wherein the precursor film includes the Group IB-IIB-IVA-VIA amorphous nanoparticles; and conducting a thermal process to the precursor film to form the light absorption layer on the substrate.

Abstract: A method for fabricating an absorbing layer of a solar cell and a thermal treatment device thereof adapted for forming an absorbing layer on a substrate are disclosed. The method includes the following steps. First, a solid-phase vapor source in a chamber and an absorbing layer precursor on a substrate are maintained by a predetermined distance. The solid-phase vapor source contains tin. The absorbing layer precursor contains copper, zinc, tin and sulfur. The temperature inside the chamber is raised to a forming temperature, so that the absorbing layer precursor forms an absorbing layer on the substrate.

Abstract: The disclosure discloses a fabrication method for a light absorption layer of a solar cell, including: forming a precursor film on a substrate, wherein the precursor film includes the Group IB-IIB-IVA-VIA amorphous nanoparticles; and conducting a thermal process to the precursor film to form the light absorption layer on the substrate.

Abstract: A method for forming a stack capacitor includes providing a substrate with a bottom layer, a BPSG layer, a USG layer and a top layer thereon; using the top layer as a hard mask and the substrate as a first etching stop layer to perform a dry etching process to form a tapered trench in the bottom layer, the BPSG layer and the USG layer; removing the top layer to perform a selective wet etching process to partially remove the BPSG layer; depositing conformally a poly-Si layer and filling the trench with a sacrificial layer; removing the poly-Si layer unmasked by the sacrificial layer; using the bottom layer as a second etching stop layer to perform a wet etching process to remove the USG layer and BPSG layer; performing a static drying process; and depositing a dielectric layer and a conductive material to form the stack capacitor.

Abstract: A method for forming a stack capacitor includes providing a substrate with a bottom layer, a BPSG layer, a USG layer and a top layer thereon; using the top layer as a hard mask and the substrate as a first etching stop layer to perform a dry etching process to form a tapered trench in the bottom layer, the BPSG layer and the USG layer; removing the top layer to perform a selective wet etching process to partially remove the BPSG layer; depositing conformally a poly-Si layer and filling the trench with a sacrificial layer; removing the poly-Si layer unmasked by the sacrificial layer; using the bottom layer as a second etching stop layer to perform a wet etching process to remove the USG layer and BPSG layer; performing a static drying process; and depositing a dielectric layer and a conductive material to form the stack capacitor.