Patents by Inventor Tsung Tai CHIEN

Tsung Tai CHIEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and systems for combined negative pressure and electroadhesion-based manipulation in manufacturing
    Patent number: 11203123
    Abstract: Systems, apparatus, and methods of manufacturing an article using electroadhesion technology, either as a sole modality of handling such materials or in concert with vacuum for the pick up and release of materials, respectively.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: December 21, 2021
    Assignee: Grabit, Inc.
    Inventors: Harsha Prahlad, Richard J. Casler, Susan Kim, Matthew Leettola, Jon Smith, Kenneth Tan, Patrick Wang, John Mathew Farren, Patrick Conall Regan, Po Cheng Chen, Honam Ko, Dragan Jurkovic, Aishwarya Varadhan, Tsung Tai Chien, Chang-Chu Liao, Chih-Chi Chang, Kuo-Hung Lee, TaeHoun Kim
  • Methods and systems for electroadhesion-based manipulation and mechanical release in manufacturing
    Patent number: 10987815
    Abstract: Systems, apparatus, and methods of manufacturing an article using electroadhesion technology, either as a sole modality of handling such materials or in concert with at least one mechanically actuated modality for the pick-up and release of materials, respectively. The mechanically actuated modality in one embodiment is configured as a netting configured to be placed over a contact surface of an electroadhesive plate to facilitate the handling of an object.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: April 27, 2021
    Assignee: Grabit, Inc.
    Inventors: Harsha Prahlad, Richard J. Casler, Susan Kim, Matthew Leettola, Jon Smith, Kenneth Tan, Patrick Wang, John Mathew Farren, Patrick Conall Regan, Po Cheng Chen, Howard Fu, Honam Ko, Dragan Jurkovic, Aishwarya Varadhan, Tsung Tai Chien, Chang-Chu Liao, Chih-Chi Chang, Kuo-Hung Lee, Ming-Feng Jean, TaeHoun Kim, Qingde Chen, Greg Miller
  • SYSTEM AND METHODS FOR THERMOFORMING ARTICLES
    Publication number: 20190351604
    Abstract: Systems and processes for thermoforming an article are disclosed. The system can include a first heating station that can include a first heating zone and a second heating zone. The system can further include a first cooling station for reducing the temperature of the heated article to a range of about 50° C. to about 70° C. while exposing the article to atmospheric pressure. The system can also include a second cooling station that can expose an article to a pressure above atmospheric pressure.
    Type: Application
    Filed: May 17, 2019
    Publication date: November 21, 2019
    Inventors: Tsung-Tai Chien, Meng-Chun Hu, I-Hsien Tseng, Guo-Chang Wang
  • METHODS AND SYSTEMS FOR COMBINED NEGATIVE PRESSURE AND ELECTROADHESION-BASED MANIPULATION IN MANUFACTURING
    Publication number: 20180319020
    Abstract: Systems, apparatus, and methods of manufacturing an article using electroadhesion technology, either as a sole modality of handling such materials or in concert with vacuum for the pick up and release of materials, respectively.
    Type: Application
    Filed: July 9, 2018
    Publication date: November 8, 2018
    Inventors: Harsha PRAHLAD, Richard J. CASLER, Susan KIM, Matthew LEETTOLA, Jon SMITH, Kenneth TAN, Patrick WANG, John Mathew FARREN, Patrick Conall REGAN, Po Cheng CHEN, Honam KO, Dragan JURKOVIC, Aishwarya VARADHAN, Tsung Tai CHIEN, Chang-Chu LIAO, Chih-Chi CHANG, Kuo-Hung LEE, TaeHoun KIM
  • METHODS AND SYSTEMS FOR ELECTROADHESION-BASED MANIPULATION AND MECHANICAL RELEASE IN MANUFACTURING
    Publication number: 20180319019
    Abstract: Systems, apparatus, and methods of manufacturing an article using electroadhesion technology, either as a sole modality of handling such materials or in concert with at least one mechanically actuated modality for the pick-up and release of materials, respectively.
    Type: Application
    Filed: July 9, 2018
    Publication date: November 8, 2018
    Inventors: Harsha PRAHLAD, Richard J. CASLER, Susan KIM, Matthew LEETTOLA, Jon SMITH, Kenneth TAN, Patrick WANG, John Mathew FARREN, Patrick Conall REGAN, Po Cheng CHEN, Howard FU, Honam KO, Dragan JURKOVIC, Aishwarya VARADHAN, Tsung Tai CHIEN, Chang-Chu LIAO, Chih-Chi CHANG, Kuo-Hung LEE, Ming-Feng JEAN, TaeHoun KIM, Qingde CHEN, Greg MILLER