Patents by Inventor TSUNG-TAI HUNG

TSUNG-TAI HUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10633569
    Abstract: A composition and a solution for temporary bonding are provided. The composition includes a dianhydride monomer, a light-absorbing monomer, and a light-absorbing material. The light-absorbing monomer includes at least one of N,N,N,N-(p-aminophenyl)-p-phenylenediamine (TPDA) and N,N-(p-aminophenyl)-p-phenylenediamine (DPDA). The light-absorbing material includes carbon black and silicon dioxide.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: April 28, 2020
    Assignee: TAIFLEX Scientific Co., Ltd.
    Inventors: Hsiu-Ming Chang, Tsung-Tai Hung, Li-Jung Hsiao, Po-Wen Lin
  • Publication number: 20190292429
    Abstract: A composition and a solution for temporary bonding are provided. The composition includes a dianhydride monomer, a light-absorbing monomer, and a light-absorbing material. The light-absorbing monomer includes at least one of N,N,N,N-(p-aminophenyl)-p-phenylenediamine (DPDA) and N,N-(p-aminophenyl)-p-phenylenediamine (TPDA). The light-absorbing material includes carbon black and silicon dioxide.
    Type: Application
    Filed: June 25, 2018
    Publication date: September 26, 2019
    Applicant: TAIFLEX Scientific Co., Ltd.
    Inventors: Hsiu-Ming Chang, Tsung-Tai Hung, Li-Jung Hsiao, Po-Wen Lin
  • Publication number: 20190163061
    Abstract: The present invention relates to a polyimide precursor and a lithography pattern formed by the same. The polyimide precursor has a repeating unit having a structure of formula (I): in the formula (I), Ar represents a tetravalent group derivated from a tetracarboxylic dianhydride compound; R1 represents a divalent group derivated from a diamine compound; and R2 independently represent a thermal-crosslinking group, a photosensitive-crosslinking group, or a hydrogen atom. The polyimide precursor has an excellent pattern-forming ability.
    Type: Application
    Filed: February 28, 2018
    Publication date: May 30, 2019
    Inventors: Chi-Shian CHEN, Bin-Ling TSAI, Yu-Pei CHEN, Chiao-Pei CHEN, Yu-Fu LIAO, Shih-Chang LIN, Chen-Ni CHEN, Tsung-Tai HUNG, Chiu-Feng CHEN
  • Publication number: 20190103274
    Abstract: A method of transferring micro devices is provided. A carrier substrate having a first surface and a second surface opposite to each other is provided, wherein a plurality of micro devices is disposed on the first surface, and each micro device binds to the first surface through laser debonding gel. Next, a receiving substrate is subjected to be relatively closer to the first surface, and a mask is provided on the second surface. Afterwards, the second surface with the mask is irradiated with a laser light, so as to keep the micro devices without laser irradiation binding on the first surface, and the micro devices irradiated with the laser light lose adhesive force and transfer to the receiving substrate.
    Type: Application
    Filed: November 30, 2017
    Publication date: April 4, 2019
    Applicant: TAIFLEX Scientific Co., Ltd.
    Inventors: Hsiu-Ming Chang, Po-Wen Lin, Tsung-Tai Hung
  • Patent number: 9955572
    Abstract: A polyimide polymer represented by the following formula 1 is provided. In formula 1, Ar is Ar? is A is and 0<X<0.38.
    Type: Grant
    Filed: October 18, 2016
    Date of Patent: April 24, 2018
    Assignee: TAIFLEX Scientific Co., Ltd.
    Inventors: Yi-Kai Fang, Tsung-Tai Hung, Chiao-Pei Chen, Chiu-Feng Chen, Ching-Hung Huang
  • Publication number: 20180086952
    Abstract: An adhesive composition is provided. The adhesive composition includes a mixture (A), wherein the mixture (A) includes a first component (a), a cross-linking agent (b), and a second component (c), wherein the second component (c) includes a calcium-containing complex compound or a calcium-containing compound. Based on the total weight of the mixture (A), a content of the first component (a) is from 40 to 80 wt %, a content of the cross-linking agent (b) is from 20 to 60 wt %, and a content of the second component (c) is from 1 to 20 wt %. Specifically, the calcium-containing complex compound is selected from the group consisting of a compound represented by formula (1), a compound represented by formula (2), a compound represented by formula (3), and a compound represent by formula (4), and the calcium-containing compound is selected from the group consisting of a compound represented by formula (5) and a compound represent by formula (6).
    Type: Application
    Filed: November 22, 2016
    Publication date: March 29, 2018
    Applicant: TAIFLEX Scientific Co., Ltd.
    Inventors: I-Ling Teng, Tzu-Ching Hung, Chiao-Pei Chen, Yu-Hsien Lee, Tsung-Tai Hung, Bo-Sheng Wang, Cheng-Yen Hsiao, Chen-Hsin Huang
  • Publication number: 20170152348
    Abstract: A polyimide is provided. The polyimide includes a repeating unit represented by formula 1.
    Type: Application
    Filed: February 5, 2016
    Publication date: June 1, 2017
    Inventors: Yi-Kai Fang, Tsung-Tai Hung, Chiao-Pei Chen, Pin-Shiuan Chen, Ching-Hung Huang
  • Publication number: 20170034910
    Abstract: A polyimide polymer represented by the following formula 1 is provided. In formula 1, Ar is Ar? is A is and 0<X<0.38.
    Type: Application
    Filed: October 18, 2016
    Publication date: February 2, 2017
    Applicant: TAIFLEX Scientific Co., Ltd.
    Inventors: Yi-Kai Fang, Tsung-Tai Hung, Chiao-Pei Chen, Chiu-Feng Chen, Ching-Hung Huang
  • Patent number: 9505887
    Abstract: A polyimide polymer represented by the following formula 1 is provided. In formula 1, Ar is Ar? is A is and 0<X<0.38.
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: November 29, 2016
    Assignee: TAIFLEX Scientific Co., Ltd.
    Inventors: Yi-Kai Fang, Tsung-Tai Hung, Chiao-Pei Chen, Chiu-Feng Chen, Ching-Hung Huang
  • Publication number: 20160115277
    Abstract: A polyimide polymer represented by the following formula 1 is provided. In formula 1, Ar is Ar? is A is and 0<X<0.38.
    Type: Application
    Filed: December 10, 2014
    Publication date: April 28, 2016
    Inventors: Yi-Kai Fang, Tsung-Tai Hung, Chiao-Pei Chen, Chiu-Feng Chen, Ching-Hung Huang
  • Publication number: 20160088728
    Abstract: An insulation film of a signal transmission line includes a substrate layer, and a bonding layer arranged on the substrate layer for directly covering metal conductors of the signal transmission line, wherein the bonding layer is made of a polyolefin copolymer resin or a polyolefin resin mixture.
    Type: Application
    Filed: November 3, 2014
    Publication date: March 24, 2016
    Inventors: Fu-Min Wang, Tsung-Tai Hung, I-Ling Teng, Feng-Jung Tien, Yu-Hsien Lee, Tzu-Ching Hung
  • Publication number: 20150194553
    Abstract: A thermally conductive encapsulate comprising a thermally conductive composite layer having a thermal conductivity of 0.5 W/m*K to 8 W/m*K and an adhesive resin layer having a thermal conductivity of 0.05 W/m*K to 0.4 W/m*K is provided. A percentage of a thickness of the adhesive resin layer relative to a total thickness of the thermally conductive encapsulate ranges from 0.1% to 10%, and the thermally conductive encapsulate has an overall thermal impedance less than 0.72° C.-in2/W. Accordingly, the thermally conductive encapsulate not only provides sealing, insulating and adhesive properties, but also effectively dissipates the heat to the environment without increasing the thickness or volume of the solar cell module and without modifying the original encapsulation process, and thereby enhancing the solar cell module's conversion efficiency and increasing its power output.
    Type: Application
    Filed: January 8, 2014
    Publication date: July 9, 2015
    Applicant: TAIFLEX SCIENTIFIC CO., LTD.
    Inventors: FU-MIN WANG, I-LING TENG, TSUNG-TAI HUNG, YU-HSIEN LEE, TZU-CHING HUNG, CHEN-HSIN HUANG