Patents by Inventor Tsung-Wen Chan

Tsung-Wen Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080220547
    Abstract: A single-chip surface mounted LED structure and a method for manufacturing the same, said LED structure mainly comprises an LED chip, a heat sink structure, two opposing electrodes, conducting wires and a supporting structure; said method comprises the steps of firstly cutting off a spare area other than said heat sink structure and two opposing electrodes from a metal material belt, forming a basic shape, forming said supporting structure in the region of said heat sink structure and two opposing electrodes using plastic injection molding, and then further cutting off the rest of said metal material belt to separate said heat sink structure and two opposing electrodes, and finally using chip-bonding and wire bonding to package sad LED structure and cutting off said packaged LED structure from said metal material belt.
    Type: Application
    Filed: March 9, 2007
    Publication date: September 11, 2008
    Inventors: Tsung-Wen CHAN, Chin-Hsiang Ku
  • Publication number: 20080220548
    Abstract: A multi-chip surface mounted LED structure and a method for manufacturing the same, said LED structure comprises a plurality of equivalent lighting units, each lighting unit comprises an LED chip, a heat sink structure, two opposing electrodes, said plurality of equivalent lighting units are mutually connected by a supporting structure; said method comprises the steps of firstly cutting a metal material belt to form a basic shape and using plastic injection molding to form said supporting structure, and then using chip bonding and wire bonding to connect said two opposing electrodes, and connecting adjacent lighting units in series/parallel, and finally cutting off a spare region of said metal material belt and packaging sad LED structure to form said multi-chip surface mounted LED structure; furthermore, a plurality of multi-chip surface mounted LED structures can be mutually connected in series/parallel by directly cutting said metal material belt to form a connection area thereon to enable conductivity bet
    Type: Application
    Filed: March 8, 2007
    Publication date: September 11, 2008
    Inventors: Tsung-Wen CHAN, Chin-Hsiang Ku
  • Patent number: 7420811
    Abstract: A heat sink structure for light-emitting diode (LED) based streetlamps is disclosed, which comprises an upper cover, on which heat sink fins are integrally formed, and a lower cover. The heat energy generated by the LEDs mounted within the upper cover and the lower cover can be removed through the heat sink fins, achieving the effect of rapid removal of the heat energy.
    Type: Grant
    Filed: September 14, 2006
    Date of Patent: September 2, 2008
    Inventor: Tsung-Wen Chan
  • Patent number: 7399107
    Abstract: Disclosed is a LCD back light module structure comprising one or more than one LED arrayed along an electric conducting stick which being equipped with conductor blades on its surface. The conductor blade is used for connecting the conducting stick to a driving circuit. A blind hole is formed on the conducting stick and the light spot of the Led die is buried in the blind hold and the electric connection is extended from the light spot to the adjacent two conductor blades. After being completed connection for each LED die, the epoxy resin is infused around the blind hole to form a transparent lens. The high crowned configuration of the lens enables the LED to uniformly emit the light therefrom therefore each LED forms a uniformly brilliant lighting surface on the LCD back light module structure.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: July 15, 2008
    Assignee: Tsung-Wen Chan
    Inventor: Tsung-Wen Chan
  • Publication number: 20080112162
    Abstract: The present invention discloses a backlight structure having embedded light emitting diodes (LEDs) and a fabrication method thereof. The backlight structure comprises a PCB having a plurality of arc-shaped pits and necessary circuitry implemented thereon; a nanometer-thick gold layer sputtered on surfaces of said PCB and said plurality of arc-shaped pits; and an LED die embedded in each one of said plurality of arc-shaped pits, wherein said LED die is fused and fixed to the center of said arc-shaped pit by high frequency wave; said LED die is covered with a phosphor molding compound made by mixing phosphor and silica gel; and each one of said plurality of arc-shaped pits and its neighboring portion of PCB is covered by a window layer formed by transparent silica gel.
    Type: Application
    Filed: November 9, 2006
    Publication date: May 15, 2008
    Applicant: TOPSON OPTOELECTRONICS SEMI-CONDUCTOR CO., LTD.
    Inventor: Tsung-Wen Chan
  • Publication number: 20080068799
    Abstract: A heat sink structure for light-emitting diode (LED) based streetlamps is disclosed, which comprises an upper cover, on which heat sink fins are integrally formed, and a lower cover. The heat energy generated by the LEDs mounted within the upper cover and the lower cover can be removed through the heat sink fins, achieving the effect of rapid removal of the heat energy.
    Type: Application
    Filed: September 14, 2006
    Publication date: March 20, 2008
    Applicant: Topson Optoelectronics Semi-conductor Co., Ltd.
    Inventor: Tsung-Wen Chan
  • Publication number: 20080037279
    Abstract: A tapered prism illumination apparatus for LCD backlight consists of an LCD, a plurality of LEDs and a heat dissipation base. The plurality of LEDs consists of high power LEDs mounted in the back of the LCD, wherein each of the LEDs includes a light emitting point that is packaged exteriorly with a transparent covering body and, on the light emitting path of the LED, a tapered prism is disposed. In the periphery of the LED a thermally conducting substrate is disposed, while the heat dissipation base is mounted in the rear of the LEDs and has reflecting faces in the periphery of each of the LEDs. When light is generated at the light emitting point, it can be projected onto the tapered prism, by which it is bent by 90°, and then projected onto the LCD via the reflecting faces. The heat generated by the high power LEDs is conducted by the thermally conducting substrate to the heat dissipation base to be removed.
    Type: Application
    Filed: August 8, 2006
    Publication date: February 14, 2008
    Inventor: Tsung-Wen Chan
  • Publication number: 20080007951
    Abstract: A LED decorative lighting structure comprises a plurality of LEDS. Each LED has two electric conductor blades which being directly made by cutting down from a strip of the same material. Each of the two conductor blades is equipped with a terminal which further includes a holding strip and an electric conducting strip. The holding strip is for fixing an outer insulation sheath of a conductor by pressing on it; while the conducting strip is for fixing and making connection with the metallic stranded core wires of the conductor. The holding strips and the electric conducting strips in both conductor blades are disposed in different height with each other so as to avoid shortcircuiting by accidental contact. The plurality of LED constructed as such can be arranged in series/parallel connection thereby forming a desired configuration of the LED decorative lighting structure according to the present invention.
    Type: Application
    Filed: July 6, 2006
    Publication date: January 10, 2008
    Inventor: Tsung-Wen Chan
  • Publication number: 20080007962
    Abstract: Disclosed is a LCD back light module structure comprising one or more than one LED arrayed along an electric conducting stick which being equipped with conductor blades on its surface. The conductor blade is used for connecting the conducting stick to a driving circuit. A blind hole is formed on the conducting stick and the light spot of the Led die is buried in the blind hold and the electric connection is extended from the light spot to the adjacent two conductor blades. After being completed connection for each LED die, the epoxy resin is infused around the blind hole to form a transparent lens. The high crowned configuration of the lens enables the LED to uniformly emit the light therefrom therefore each LED forms a uniformly brilliant lighting surface on the LCD back light module structure.
    Type: Application
    Filed: July 6, 2006
    Publication date: January 10, 2008
    Inventor: Tsung-Wen Chan
  • Patent number: 7270450
    Abstract: A lighting and flashing Christmas tree structure apparatus employs a low power control circuit to control the flashing sequence of LED light strings, capable of randomly altering distribution of the light strings with free choice of colors. A plug-free magnetic power system supplies electrical power to a cuboidal body where each of the four sides thereon has an electrical power receptacle free for user selection. With a LED device controller, a magnificent blinking is emitting from the LED light source to delight Christmas atmosphere. The electrical power offered by the present invention is limited below 24 V, which is within the safety range of the electrical properties code for body contact, therefore being free of safety concerns.
    Type: Grant
    Filed: December 22, 2005
    Date of Patent: September 18, 2007
    Assignee: Topson Optoelectronics Semi-conductor Co. Ltd.
    Inventor: Tsung-Wen Chan
  • Publication number: 20070147028
    Abstract: A lighting and flashing Christmas tree structure apparatus employs a low power control circuit to control the flashing sequence of LED light strings, capable of randomly altering distribution of the light strings with free choice of colors. A plug-free magnetic power system supplies electrical power to a cuboidal body where each of the four sides thereon has an electrical power receptacle free for user selection. With a LED device controller, a magnificent blinking is emitting from the LED light source to delight Christmas atmosphere. The electrical power offered by the present invention is limited below 24 V, which is within the safety range of the electrical properties code for body contact, therefore being free of safety concerns.
    Type: Application
    Filed: December 22, 2005
    Publication date: June 28, 2007
    Inventor: Tsung-Wen Chan
  • Patent number: 6757969
    Abstract: Method of fabricating LED assembly disclosed herein can provides a string of original colored high intensity LEDS usable for screen displaying or traffic signal lights molded by injecting harmless polyacrylic resin in a short time duration and at low temperature.
    Type: Grant
    Filed: December 14, 2001
    Date of Patent: July 6, 2004
    Inventor: Tsung-Wen Chan
  • Publication number: 20030021117
    Abstract: A high intensity light source has a LED assembly consisting of red, green and blue three primary colored LEDS enclosed in a globe whose inner wall surface is spray coated with a fluorescent powder for blending the emitted lights from the LEDS into various resultant colored lights by operating a control circuit, and the resultant lights are outputted through all directional refraction of the globe.
    Type: Application
    Filed: July 27, 2001
    Publication date: January 30, 2003
    Inventor: Tsung-Wen Chan