Abstract: The invention provides a method of integrating a server using alternating current power (AC server) into a server system using direct current power (DC server system) and an alternative junction device therefor. The integrating method includes: providing an AC server having a plug-in power supply unit; providing an alternative junction device for replacing the plug-in power supply unit; extracting the plug-in power supply unit from the AC server; plugging the alternative junction device into the AC server; and coupling the alternative junction device to a direct current power supply unit of a DC server system. The alternative junction device includes: a shell to be installed into a containing slot of an AC server; an output coupled to a DC input of a processor of the AC server when the shell is installed into the containing slot; and an input coupled to a DC power supply unit of a DC server system.

Abstract: The invention provides a method of integrating a server using alternating current power (AC server) into a server system using direct current power (DC server system) and an alternative junction device therefor. The integrating method includes: providing an AC server having a plug-in power supply unit; providing an alternative junction device for replacing the plug-in power supply unit; extracting the plug-in power supply unit from the AC server; plugging the alternative junction device into the AC server; and coupling the alternative junction device to a direct current power supply unit of a DC server system. The alternative junction device includes: a shell to be installed into a containing slot of an AC server; an output coupled to a DC input of a processor of the AC server when the shell is installed into the containing slot; and an input coupled to a DC power supply unit of a DC server system.

Abstract: Embodiments of a method for preparing a leadframe for integrated circuit (IC) die packaging in a molded package with an exposed die pad are disclosed. In one embodiment, a method involves producing a leadframe with a die pad, wherein the die pad has a top surface, a bottom surface, and a perimeter edge. The die pad is then planarized to flatten burrs that may exist at the perimeter edge of the die pad, wherein planarizing the die pad comprises embedding tool markings in the die pad at the perimeter edge of the die pad, the tool markings including a series of peaks and valleys that run parallel to the perimeter edge at all locations around the perimeter edge. Embodiments of a leadframe for IC die packaging in a molded package are also disclosed.

Abstract: Embodiments of a method for preparing a leadframe for integrated circuit (IC) die packaging in a molded package with an exposed die pad are disclosed. In one embodiment, a method involves producing a leadframe with a die pad, wherein the die pad has a top surface, a bottom surface, and a perimeter edge. The die pad is then planarized to flatten burrs that may exist at the perimeter edge of the die pad, wherein planarizing the die pad comprises embedding tool markings in the die pad at the perimeter edge of the die pad, the tool markings including a series of peaks and valleys that run parallel to the perimeter edge at all locations around the perimeter edge. Embodiments of a leadframe for IC die packaging in a molded package are also disclosed.