Abstract: A lifting module for a chassis and an electronic device including the lifting module are provided. The lifting module includes a sidewall bracket, a lifting bracket, a sliding button assembly, and a driven assembly. The sidewall bracket is disposed on a side frame of the chassis. The lifting bracket is movably connected to the sidewall bracket. The sliding button assembly is slidably disposed on the side frame of the chassis. Part of the sliding button assembly is exposed from the chassis. The driven assembly is movably disposed on the sidewall bracket. The driven assembly is connected to interact the sliding button assembly and the lifting bracket. The lifting bracket is driven to move relative to the sidewall bracket selectively by the sliding button assembly through the driven assembly.

Abstract: A method includes forming a gate stack on a first portion of a semiconductor fin, removing a second portion of the semiconductor fin to form a recess, and forming a source/drain region starting from the recess. The formation of the source/drain region includes performing a first epitaxy process to grow a first semiconductor layer, wherein the first semiconductor layer has straight-and-vertical edges, and performing a second epitaxy process to grow a second semiconductor layer on the first semiconductor layer. The first semiconductor layer and the second semiconductor layer are of a same conductivity type.

Abstract: A method includes forming a gate stack on a first portion of a semiconductor fin, removing a second portion of the semiconductor fin to form a recess, and forming a source/drain region starting from the recess. The formation of the source/drain region includes performing a first epitaxy process to grow a first semiconductor layer, wherein the first semiconductor layer has straight-and-vertical edges, and performing a second epitaxy process to grow a second semiconductor layer on the first semiconductor layer. The first semiconductor layer and the second semiconductor layer are of a same conductivity type.

Abstract: The present invention provides a die with a first die member, a second die member and a holder device between the first die member and the second die member. A film is sent to the die between the holder device and the second die member. And then, operating the holder device toward the second die member to press the film on the second die member, and softening and molding the film in the second die member. Next, moving the first die member toward the second die member to close the die, and then performing an injection molding process to inject a molten material into the die. The molten material is combined with the film to form a product with the film on a surface thereof.

Abstract: A method of continuously feeding film pieces for the molding process includes a film preparation task, a film drawing task, a film cutting task and a film feeding task. The film preparation task includes preparing a roll of film and drawing the film out and fixing a head end thereof at a first position. The film drawing task includes holding the film and drawing the film along a film feeding direction to have the head end to a second position. The film cutting task includes cutting the film off to have a film piece,. The film feeding task includes holding the film piece and moving the film piece to a third position. The film preparation task, the film drawing task and film cutting task are repeated in sequence for continuously feeding film pieces for the molding process.

Abstract: A film feeding machine includes a drawing device to draw a continuous film out of a film base to a predetermined position. The film is held by a feeding device and cut off by a cutting device to have a film piece. The film piece is fed to external equipment by the feeding device. The film feeding machine of the present invention is incorporated in a molding process having advantages of lower cost, lower defective ratio and high production efficiency.

Abstract: A method of continuously feeding film pieces for the molding process includes a film preparation task, a film drawing task, a film cutting task and a film feeding task. The film preparation task includes preparing a roll of film and drawing the film out and fixing a head end thereof at a first position. The film drawing task includes holding the film and drawing the film along a film feeding direction to have the head end to a second position. The film cutting task includes cutting the film off to have a film piece,. The film feeding task includes holding the film piece and moving the film piece to a third position. The film preparation task, the film drawing task and film cutting task are repeated in sequence for continuously feeding film pieces for the molding process.

Abstract: The present invention provides a die with a first die member, a second die member and a holder device between the first die member and the second die member. A film is sent to the die between the holder device and the second die member. And then, operating the holder device toward the second die member to press the film on the second die member, and softening and molding the film in the second die member. Next, moving the first die member toward the second die member to close the die, and then performing an injection molding process to inject a molten material into the die. The molten material is combined with the film to form a product with the film on a surface thereof.

Abstract: A film feeding machine includes a drawing device to draw a continuous film out of a film base to a predetermined position. The film is held by a feeding device and cut off by a cutting device to have a film piece. The film piece is fed to external equipment by the feeding device. The film feeding machine of the present invention is incorporated in a molding process having advantages of lower cost, lower defective ratio and high production efficiency.