Abstract: A method for in-line optical testing is provided. The method includes providing a substrate, forming an optical device on the substrate, and forming a test circuit on the substrate, the test circuit being optically coupled to the optical device. An optical test is performed on the optical device with the test circuit. The test circuit is then removed.

Abstract: A scavenging photodetection device (10) is provided. The scavenging photodetection device (10) includes an optical coupling portion (12) and a scavenging photodetection portion (14). The optical coupling portion (12) includes an optical coupler (16) configured to receive light from a light source, a plurality of light absorbers (18) arranged to absorb the light from the light source that is not collected by the optical coupler (16), and at least one primary input waveguide (20) optically coupled to the optical coupler (16) and configured to direct collected light to a photonic integrated circuit. The scavenging photodetection portion (14) includes a primary photodetector (22) configured to collect uncollected light from the optical coupling portion (12) to determine an alignment position of the photonic integrated circuit.

Abstract: A photonics packaging method is provided. The photonics packaging method includes providing a substrate (10) and attaching a first optical device (12) to the substrate (10). The first optical device (12) includes a first mode converter (14) optically coupled to a first integrated photonics chip (16). A second optical device (32) is also attached to the substrate (10). The second optical device (32) includes a second mode converter (34) optically coupled to a second integrated photonics chip (36). The second optical device (32) is of a greater height than the first optical device (12). An index-matching material (56) is disposed in a space between the first and second optical devices (12) and (32) and a force is applied on the second optical device (32) to cause the second optical mode converter (34) to align with the first optical mode converter (14). The index-matching material (56) is subsequently cured.

Abstract: A scavenging photodetection device (10) is provided. The scavenging photodetection device (10) includes an optical coupling portion (12) and a scavenging photodetection portion (14). The optical coupling portion (12) includes an optical coupler (16) configured to receive light from a light source, a plurality of light absorbers (18) arranged to absorb the light from the light source that is not collected by the optical coupler (16), and at least one primary input waveguide (20) optically coupled to the optical coupler (16) and configured to direct collected light to a photonic integrated circuit. The scavenging photodetection portion (14) includes a primary photodetector (22) configured to collect uncollected light from the optical coupling portion (12) to determine an alignment position of the photonic integrated circuit.

Abstract: A photonics packaging method is provided. The photonics packaging method includes providing a substrate (10) and attaching a first optical device (12) to the substrate (10). The first optical device (12) includes a first mode converter (14) optically coupled to a first integrated photonics chip (16). A second optical device (32) is also attached to the substrate (10). The second optical device (32) includes a second mode converter (34) optically coupled to a second integrated photonics chip (36). The second optical device (32) is of a greater height than the first optical device (12). An index-matching material (56) is disposed in a space between the first and second optical devices (12) and (32) and a force is applied on the second optical device (32) to cause the second optical mode converter (34) to align with the first optical mode converter (14). The index-matching material (56) is subsequently cured.

Abstract: A photodetector (10) is provided. The photodetector (10) includes an interferometer (12) and a photodetection region (14) coupled to the interferometer (12). The interferometer (12) is configured to generate an optical intensity distribution that corresponds to an electric field distribution in the photodetection region (14).

Abstract: A method for in-line optical testing is provided. The method includes providing a substrate (10), forming an optical device (16) on the substrate (10), and forming a test circuit (20) on the substrate (10), the test circuit (20) being optically coupled to the optical device (16). An optical test is performed on the optical device (16) with the test circuit (20). The test circuit (20) is then removed.

Abstract: A phase-shifter (10) for optical modulation is provided. The phase-shifter (10) includes a first electrode (12), a second electrode (14), a waveguide (16) in a folded configuration between the first and second electrodes (12, 14), and one or more PN junctions (18, 20) provided with the waveguide (16) and connected to the first and second electrodes (12, 14).

Abstract: According to one aspect of the invention, there is provided a pin photodetector comprising a dopant diffusion barrier layer disposed within an active light absorbing region of the pin photodetector.

Abstract: An optical circuit for sensing a biological entity in a fluid and a method of configuring an optical circuit for sensing a biological entity in a fluid are provided. The optical circuit includes a sensing arrangement including a reference arm having a reference waveguide and a sensing arm having a waveguide; wherein lengths of the reference waveguide and the waveguide are configured in accordance with a temperature dependency reduction criterion.

Abstract: An optical light source is provided. The optical light source includes a waveguide including two reflectors arranged spaced apart from each other to define an optical cavity therebetween, an optical gain medium, and a coupling structure arranged to couple light between the optical cavity and the optical gain medium.

Abstract: An optical converter and a method of manufacturing the optical converter are provided. The optical converter may include a signal receiving portion configured to receive an optical signal from an optical fiber which can be coupled to the optical converter, a signal output portion configured to output the optical signal received by the signal receiving portion, and a signal coupling portion being disposed between the signal receiving portion and the signal output portion and being configured to couple the optical signal received by the signal receiving portion into the signal output portion. The signal output portion may include a waveguide element having at least one tapered end section, and being partially or wholly surrounded by the signal coupling portion. The at least one tapered end section may be configured to couple the optical signal from the signal coupling portion into the waveguide element and the waveguide element may be configured to output the optical signal.

Abstract: An optical light source is provided. The optical light source includes a waveguide including two reflectors arranged spaced apart from each other to define an optical cavity therebetween, an optical gain medium, and a coupling structure arranged to couple light between the optical cavity and the optical gain medium.

Abstract: According to one aspect of the invention, there is provided a pin photodetector comprising a dopant diffusion barrier layer disposed within an active light absorbing region of the pin photodetector.

Abstract: An optical converter and a method of manufacturing the optical converter are provided. The optical converter may include a signal receiving portion configured to receive an optical signal from an optical fiber which can be coupled to the optical converter, a signal output portion configured to output the optical signal received by the signal receiving portion, and a signal coupling portion being disposed between the signal receiving portion and the signal output portion and being configured to couple the optical signal received by the signal receiving portion into the signal output portion. The signal output portion may include a waveguide element having at least one tapered end section, and being partially or wholly surrounded by the signal coupling portion. The at least one tapered end section may be configured to couple the optical signal from the signal coupling portion into the waveguide element and the waveguide element may be configured to output the optical signal.